Hsinchu City, Taiwan
v Master of material science technology
v 10 years experience in assembly industry, including
- 3 years wire bonding process experience for logic product with lead frame base
- 6.5 years package design experience for memory product with wire bonding and flip chip base. Package type include BGA base product (MCP / PoP )
- 0.5 year substrate planning experience
- Work in NXP package innovation as project leader now, to handle new product or new technology development
v Key achievement
- Focal team leader to achieve major customer annual audit successfully
- Manage new product development from design till mass production withhigh hitting rate
- Leading team to accomplish customer annual project with cross function team
* E-mail : [email protected]
* Phone no. : 0972-393331
Apr. 2022 - Present
HsinChu, Taiwan
As a project leader for new product or new technology or new material development. The role need to work with internal cross function team, business unit, quality and engineering team for project development. While development need,
1. from assembly process, package design, selected material point of view to create risk assessment
2. prepare development proposal including development schedule to meet production plan.
3. work with OSAT or production line to complete process window study to make sure qualification quality
六月 2021 - Present
HsinChu, Taiwan
1. Leading 6 members team for substrate planning
2. Work with procurement to define long term substrate allocation and strategy
3. Inventory and excess material control
4. Be coordinator to work with x function team to come out disposition for substrate incoming issue
四月 2019 - 六月 2021
HsinChu, Taiwan
1. Leading 6 members for new production development
1-1 work with customer to find out best structure solution for new product. (both WB base and flip chip base)
1-2 find out best direct material solution through technical discussion and simulation
2. Build up design data base to consolidate capability of team members
3. Coordinator for cross function team project, e.g. standardization substrate deign
六月 2016 - 四月 2019
HsinChu, Taiwan
1. Leading 6 members for new production development
1-1 work with customer to find out best structure solution for new product. (both WB base and flip chip base)
1-2 find out best direct material solution through technical discussion and simulation
2. Build up design data base to consolidate capability of team members
3. Coordinator for cross function team project, e.g. standardization substrate design
六月 2014 - 六月 2016
HsinChu, Taiwan
1. Project management :
1-1 New product development from design till mass production
1-2 Cost reduction project
2. Trouble shooting, define design rule and upgrade regularly
3. New direct material development (wire /compound / solder ball / die attach film)
九月 2010 - 六月 2014
TaiChung, Taiwan
1. Wire bonding process engineer main job function
1-1 new product process condition and loop setting
1-2 New Cu wire and capillary development
1-2 trouble shooting while new product development
2. Focal team leader for new device qualification
3. Mass production trouble shooting and throughput enhancement
Jun. 2021 - Mar. 2022
1. Leading a 6 member team for substrate planning
2. Work with procurement to define long term substrate allocation and strategy
3. Inventory and excess material control. Work with process team to come out a plan to consume excess material
4. Be coordinator to work with a cross-function team to come out disposition for substrate incoming issue
5.Monitor substrate delivery and negotiate with suppliers
Apr. 2019 - Jun. 2021
1. Leading 6 members for new production development
1-1 work with customers who has memory foundry to find out the best design solution for new product. (product type including MCP with wire bond and flip chip base)
1-2 find out the best direct material solution through technical discussion and simulation
1-3 work with project managed team to come out product development milestone
2. Build up design data base to consolidate the capability of team members
3. Be a coordinator and communication with cross function team project, e.g. standardization substrate design
4. To communicate and align a working model for better communication with customer manager
5.Integrate suppliers's technical road map with assembly process road map
Jun. 2016 - Apr. 2019
1. Leading 6 members for new production development
1-1 work with customers who has memory foundry to find out the best design solution for new product. (product type including MCP with wire bond and flip chip base)
1-2 find out the best direct material solution through technical discussion and simulation
1-3 work with project manag team to come our product development milestone
2. Build up design data base to consolidate the capability of team members
3. Be a coordinator and communication with cross function team project, e.g. standardization substrate design
4. Communicate with suppliers for new direct material development.
Jun. 2014 - Jun. 2016
1. Project management :
1-1 Memory new product development from design till mass production. MCP (NAND+DRAM+controller) and PoP (DRAM) are major package type.
1-2 Cost reduction project
1-3 Work with process engineering team to come out DOE matrix for new structure or new material development
2. Trouble shooting, defining, integrating design rules and upgrading regularly
3. New direct material development (wire /compound / solder ball / die attach film)
Sep. 2010 - Jun. 2014
1. Wire bonding process engineer for QFN package, the main job function are,
1-1 New product process condition and loop setting
1-2 New Cu wire and capillary development
1-3 Trouble shooting while new product development
1-4 Mass production trouble shooting and throughput enhancement
2. Focal team leader for new device qualification
3. Work with technical center to build up parameter data base and selection rule
2007 - 2009
2003 - 2007
Hsinchu City, Taiwan
v Master of material science technology
v 10 years experience in assembly industry, including
- 3 years wire bonding process experience for logic product with lead frame base
- 6.5 years package design experience for memory product with wire bonding and flip chip base. Package type include BGA base product (MCP / PoP )
- 0.5 year substrate planning experience
- Work in NXP package innovation as project leader now, to handle new product or new technology development
v Key achievement
- Focal team leader to achieve major customer annual audit successfully
- Manage new product development from design till mass production withhigh hitting rate
- Leading team to accomplish customer annual project with cross function team
* E-mail : [email protected]
* Phone no. : 0972-393331
Apr. 2022 - Present
HsinChu, Taiwan
As a project leader for new product or new technology or new material development. The role need to work with internal cross function team, business unit, quality and engineering team for project development. While development need,
1. from assembly process, package design, selected material point of view to create risk assessment
2. prepare development proposal including development schedule to meet production plan.
3. work with OSAT or production line to complete process window study to make sure qualification quality
六月 2021 - Present
HsinChu, Taiwan
1. Leading 6 members team for substrate planning
2. Work with procurement to define long term substrate allocation and strategy
3. Inventory and excess material control
4. Be coordinator to work with x function team to come out disposition for substrate incoming issue
四月 2019 - 六月 2021
HsinChu, Taiwan
1. Leading 6 members for new production development
1-1 work with customer to find out best structure solution for new product. (both WB base and flip chip base)
1-2 find out best direct material solution through technical discussion and simulation
2. Build up design data base to consolidate capability of team members
3. Coordinator for cross function team project, e.g. standardization substrate deign
六月 2016 - 四月 2019
HsinChu, Taiwan
1. Leading 6 members for new production development
1-1 work with customer to find out best structure solution for new product. (both WB base and flip chip base)
1-2 find out best direct material solution through technical discussion and simulation
2. Build up design data base to consolidate capability of team members
3. Coordinator for cross function team project, e.g. standardization substrate design
六月 2014 - 六月 2016
HsinChu, Taiwan
1. Project management :
1-1 New product development from design till mass production
1-2 Cost reduction project
2. Trouble shooting, define design rule and upgrade regularly
3. New direct material development (wire /compound / solder ball / die attach film)
九月 2010 - 六月 2014
TaiChung, Taiwan
1. Wire bonding process engineer main job function
1-1 new product process condition and loop setting
1-2 New Cu wire and capillary development
1-2 trouble shooting while new product development
2. Focal team leader for new device qualification
3. Mass production trouble shooting and throughput enhancement
Jun. 2021 - Mar. 2022
1. Leading a 6 member team for substrate planning
2. Work with procurement to define long term substrate allocation and strategy
3. Inventory and excess material control. Work with process team to come out a plan to consume excess material
4. Be coordinator to work with a cross-function team to come out disposition for substrate incoming issue
5.Monitor substrate delivery and negotiate with suppliers
Apr. 2019 - Jun. 2021
1. Leading 6 members for new production development
1-1 work with customers who has memory foundry to find out the best design solution for new product. (product type including MCP with wire bond and flip chip base)
1-2 find out the best direct material solution through technical discussion and simulation
1-3 work with project managed team to come out product development milestone
2. Build up design data base to consolidate the capability of team members
3. Be a coordinator and communication with cross function team project, e.g. standardization substrate design
4. To communicate and align a working model for better communication with customer manager
5.Integrate suppliers's technical road map with assembly process road map
Jun. 2016 - Apr. 2019
1. Leading 6 members for new production development
1-1 work with customers who has memory foundry to find out the best design solution for new product. (product type including MCP with wire bond and flip chip base)
1-2 find out the best direct material solution through technical discussion and simulation
1-3 work with project manag team to come our product development milestone
2. Build up design data base to consolidate the capability of team members
3. Be a coordinator and communication with cross function team project, e.g. standardization substrate design
4. Communicate with suppliers for new direct material development.
Jun. 2014 - Jun. 2016
1. Project management :
1-1 Memory new product development from design till mass production. MCP (NAND+DRAM+controller) and PoP (DRAM) are major package type.
1-2 Cost reduction project
1-3 Work with process engineering team to come out DOE matrix for new structure or new material development
2. Trouble shooting, defining, integrating design rules and upgrading regularly
3. New direct material development (wire /compound / solder ball / die attach film)
Sep. 2010 - Jun. 2014
1. Wire bonding process engineer for QFN package, the main job function are,
1-1 New product process condition and loop setting
1-2 New Cu wire and capillary development
1-3 Trouble shooting while new product development
1-4 Mass production trouble shooting and throughput enhancement
2. Focal team leader for new device qualification
3. Work with technical center to build up parameter data base and selection rule
2007 - 2009
2003 - 2007