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4-6 years
6-10 years
10-15 years
More than 15 years
Tainan City, Taiwan
Past
Product Designer @More Design Work /Formfty Manufacturing 2021 ~ Present
・
Mechanical / Industrial designer
Within one month
YuJie Wang There's a soul where art builds in science. Taipei, Taiwan Mechanical design Consumer/industrial product Collaborative robot skin Medical equipment Materials experiences Hard tooling : PC, ABS, double injection, metal stamping, die casting, extrusion molding Rapid tooling : cast resin, CNC, NCT, 3Dprinting Self-learning Front-end language and Python Blender 3D Native in Mandarin / TOEIC 760. Career Aprpresent Product designer More Design x Formfty Manufacturing From concept brain storming to rapid prototype making. Also with the largest SLA 3D printing solutions in Taiwan. We're a team that creates the best products
Unemployed
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Ready to interview
Full-time / Interested in working remotely
6-10 years
Yuan Ze University
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Mechanical EngineeringThe Most Lightweight and Effective Recruiting Plan
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Definition of Reputation Credits
Technical Skills
Specialized knowledge and expertise within the profession (e.g. familiar with SEO and use of related tools).
Problem-Solving
Ability to identify, analyze, and prepare solutions to problems.
Adaptability
Ability to navigate unexpected situations; and keep up with shifting priorities, projects, clients, and technology.
Communication
Ability to convey information effectively and is willing to give and receive feedback.
Time Management
Ability to prioritize tasks based on importance; and have them completed within the assigned timeline.
Teamwork
Ability to work cooperatively, communicate effectively, and anticipate each other's demands, resulting in coordinated collective action.
Leadership
Ability to coach, guide, and inspire a team to achieve a shared goal or outcome effectively.
Professional Background
Current status
Unemployed
Job Search Progress
Ready to interview
Professions
Product Engineer, Project Engineer
Fields of Employment
Semiconductor
Work experience
More than 15 years
Management
I've had experience in managing 1-5 people
Skills
Languages
English
・
Fluent
Chinese
・
Native or Bilingual
Job search preferences
Positions
Project Manager
Job types
Full-time
Locations
Kaohsiung City, 台灣, Tainan, 台灣, Taiwan, 日本
Remote
Interested in working remotely
Freelance
No
Educations
School
國立臺灣海洋大學 National Taiwan Ocean University
Major
Materials Science
Wei-Yueh Sung (Cloud Sung) 宋威岳
Desired Position: A challenging position as Assembly Engineering/ Quality/ Planning in utilizing my skills and experience.
Kaohsiung, Taiwan
Email: [email protected]
https://www.cakeresume.com/s--Oj8brP5jTYjBJ7tGzYvCcg--/cloud-sung-2aa072
工作經歷 Work Experience
Jul 2022 - Nov 2023
Project Manager ATX Semiconductors Suzhou China
- Took charge of NPI leader of N company (Analog, Logic & Cu-clip devices) products from Apr’23 to Nov’23. Also took charge of NPI of B company (MEMS device) at the same period. Team members & project quantities: 6 persons with 26 projects.
- Took charge of NPI leader of N company (Isolator & MEMS devices) products from Jul’22 to Apr’23. Team members & project quantities: 5 persons with 20 projects.
Aug 2018 - Jul 2022
Business Manager ATX Semiconductors Suzhou China
- Took charge of business development (Quote of RFQ/AOD definition/customer relationship maintaining/TAM-SAM-PAM control/NDA & Agreement & MOU establishment) of US customers (main focus on T & S companies) from 2018 to 2022.
- Led revenue of US account with 200% growth from 2018 to 2021
Nov 2015 - Aug 2018
Project Manager ASEN (Suzhou China)
- Took charge of New device phase-in of E company (Diversity front-end module) products from Nov’15 to Aug’18. Team members & project quantities: 3 persons with 20 projects
- Took charge of New device phase-in of T company QFN products from Nov’15 to Aug’18. Team members & project quantities: 4 persons with 22 projects.
Jan 2008 - Nov 2015
Project Engineer ASE Kaohsiung Taiwan
- Took charge of New device phase-in and HVM issue of Module products (Wireless/PA/Wearable module) from Dec’12 to Nov’15
- Took charge of New Products development of Stacked-Die FBGA and PoP (package on package) products from Y2008 to end of Y2012
- Successfully led FOW (DAF over wire) products of M company into mass-production in end of Y2009
- Successfully led PoP products of B company into mass-production on Q2 of Y2011
Jan 2007 - Jan 2008
Integration Engineer UMC (Tainan Taiwan)
Took charge of F/BEoL integration includes 45nm wafer processing, Flip-chip/BOAC rule maintain and low-k wafer dicing solution.
Jan 2004 - Jan 2007
Product Engineer ASE Kaohsiung Taiwan
- Took charge of New Products Development of Stacked-Die FBGA.
- Successfully led MSPD (Memory Stick Pro Duo) products of S company into mass-production in end of Y2005.
- Successfully pass qualification lots of Stacked-die FBGA of I company in Jan’07 and will start mass-production on Q2’07.
Jan 2000 - Jan 2004
Process Engineer ASE Kaohsiung Taiwan
- Took charge of troubleshooting and process integration of Front End Processes (Wafer preparation to Die attach) of FBGA
學歷 Education
National Taiwan Ocean University (Keelung, Taiwan)
- Master of Science in Materials Engineering
- Thesis: Study on Plasma Vitrification Treatment for Petroleum Industry Wastes and LLRW Surrogates from Nuclear Power Plants
Sep 1997 - Jun 1999
Feng Chia University (Taichung, Taiwan)
- Bachelor of Science in Materials Science
Sep 1992 - Jun 1997
語言 Language
- Chinese - Native
- English - Fluent (TOEIC 630)
技能 Skills
- Experience in Statistics : Basic Statistics, Statistic software (JMP)- ANOVA analysis/DOE/Taguchi method/Control chart/Variability chart/Pareto chart
- Experience in Quality : 8D reporting, 3x5 why analysis, QC tools, SPC, FMEA, MSA, CP
- Experience of APQP (Advanced Product Quality Planning) & PPAP, PSM (problem solving methodology)
- TOEIC 630
A
Wei-Yueh Sung (Cloud Sung) 宋威岳
Desired Position: A challenging position as Assembly Engineering/ Quality/ Planning in utilizing my skills and experience.
Kaohsiung, Taiwan
Email: [email protected]
https://www.cakeresume.com/s--Oj8brP5jTYjBJ7tGzYvCcg--/cloud-sung-2aa072
工作經歷 Work Experience
Jul 2022 - Nov 2023
Project Manager ATX Semiconductors Suzhou China
- Took charge of NPI leader of N company (Analog, Logic & Cu-clip devices) products from Apr’23 to Nov’23. Also took charge of NPI of B company (MEMS device) at the same period. Team members & project quantities: 6 persons with 26 projects.
- Took charge of NPI leader of N company (Isolator & MEMS devices) products from Jul’22 to Apr’23. Team members & project quantities: 5 persons with 20 projects.
Aug 2018 - Jul 2022
Business Manager ATX Semiconductors Suzhou China
- Took charge of business development (Quote of RFQ/AOD definition/customer relationship maintaining/TAM-SAM-PAM control/NDA & Agreement & MOU establishment) of US customers (main focus on T & S companies) from 2018 to 2022.
- Led revenue of US account with 200% growth from 2018 to 2021
Nov 2015 - Aug 2018
Project Manager ASEN (Suzhou China)
- Took charge of New device phase-in of E company (Diversity front-end module) products from Nov’15 to Aug’18. Team members & project quantities: 3 persons with 20 projects
- Took charge of New device phase-in of T company QFN products from Nov’15 to Aug’18. Team members & project quantities: 4 persons with 22 projects.
Jan 2008 - Nov 2015
Project Engineer ASE Kaohsiung Taiwan
- Took charge of New device phase-in and HVM issue of Module products (Wireless/PA/Wearable module) from Dec’12 to Nov’15
- Took charge of New Products development of Stacked-Die FBGA and PoP (package on package) products from Y2008 to end of Y2012
- Successfully led FOW (DAF over wire) products of M company into mass-production in end of Y2009
- Successfully led PoP products of B company into mass-production on Q2 of Y2011
Jan 2007 - Jan 2008
Integration Engineer UMC (Tainan Taiwan)
Took charge of F/BEoL integration includes 45nm wafer processing, Flip-chip/BOAC rule maintain and low-k wafer dicing solution.
Jan 2004 - Jan 2007
Product Engineer ASE Kaohsiung Taiwan
- Took charge of New Products Development of Stacked-Die FBGA.
- Successfully led MSPD (Memory Stick Pro Duo) products of S company into mass-production in end of Y2005.
- Successfully pass qualification lots of Stacked-die FBGA of I company in Jan’07 and will start mass-production on Q2’07.
Jan 2000 - Jan 2004
Process Engineer ASE Kaohsiung Taiwan
- Took charge of troubleshooting and process integration of Front End Processes (Wafer preparation to Die attach) of FBGA
學歷 Education
National Taiwan Ocean University (Keelung, Taiwan)
- Master of Science in Materials Engineering
- Thesis: Study on Plasma Vitrification Treatment for Petroleum Industry Wastes and LLRW Surrogates from Nuclear Power Plants
Sep 1997 - Jun 1999
Feng Chia University (Taichung, Taiwan)
- Bachelor of Science in Materials Science
Sep 1992 - Jun 1997
語言 Language
- Chinese - Native
- English - Fluent (TOEIC 630)
技能 Skills
- Experience in Statistics : Basic Statistics, Statistic software (JMP)- ANOVA analysis/DOE/Taguchi method/Control chart/Variability chart/Pareto chart
- Experience in Quality : 8D reporting, 3x5 why analysis, QC tools, SPC, FMEA, MSA, CP
- Experience of APQP (Advanced Product Quality Planning) & PPAP, PSM (problem solving methodology)
- TOEIC 630