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Definition of Reputation Credits
王亦翰 (Eason Wang)
Since the beginning of work in 2013/9 to present with 10.5 years experience as an engineer. Main expertise is yield improvement, process technology and new product evaluate, and also handle customer complaint investigation.
In my current position at CLC company as Sr.Application engineer in Sales Division.
Contact information: E-mail: [email protected] Mobile: (+886) 0936-409-582
CAREER SUMMARY
- With 7.5-years experiences as engineer in Semiconductor Industry, mainly focus on yield improvement, process technical, new product evaluation, and handle customer complaint investigation.
- Familiar with customer service and application experience in the field of semiconductor chemicals for wet-etching and lithography processes.
Good at support main client TSMC with EUV, KrF photoresist and advanced semiconductor packaging industry client SPIL, PTI, Chipbond and ChipMos with etchant and stripper maintenance and troubleshooting.
Experience with schedule planning/ man-power allocation/ cost control & saving.
Familiar with cross-function communication with members.
CAREER HISTORY
CHEMLEADER CO. (CLC), (Semiconductor material company)
Senior Application engineer
Oct. 2022 - Present
Job responsibility:
- Experience with support advanced semiconductor packaging industry customer such as SPIL, PTI, Chipbond and ChipMos with evaluate new product and provide application support.
- Maintain and develop good relationships with customer during troubleshooting. Work closely with customer to understand issues and demands.
- Interface with R&D team and customer to develop new product.
- Design and complete DOE (Design of Experiments) evaluations material for customer.
- Responsible for customer complaint.
TOKYO OHKA KOGYO CO. (TOK), (Semiconductor material company)
Section Manager (Application engineer)
Sept. 2017 - Sept. 2022
Job responsibility:
- Experience with support main client TSMC with EUV equipment, measuring product, on-site
inspection as required.
Interface with MFG and QA teams to support production running smoothly.
Manage the photoresist product speciation and planning measurement schedule.
Analyze data and provides adjustment parameters for the next stage.
Responsible for customer complaint, tool recipe setup and test.
Inspect sample by TEL Clean track, ASML scanner, KLA SP2, CD-SEM.
Inspect EUVR, KrF, Polymer, item: Film thickness, CD-size, Defect.
Achievements:
- EUVR Development recipe improvement 20%*2 products
- KrF Coater recipe improvement 20%*2 products
- Wafer cost down 600,000 NTD/year
- Tool APM cost down 30,000 NTD/year
- Publish PM SOP*3
Chipbond Technology CO. (Semiconductor package & test company)
Product engineer
Aug. 2016 - Feb. 2017
Job responsibility:
- Experience with customer complaint and analyze abnormal sample from customer.
- Familiar with cross departmental working and communication.
- Good at revise process follow file.
NEO Solar Power Technology CO. (Solar cell company)
Process integration engineer
Sept. 2013 - Aug. 2016
Job responsibility:
- Familiar with evaluate new product and new process technology.
- Produce special request sample from customer.
- Experience with setting new spec for new product and Investigate customer complain.
Achievements:
- Evaluate new product and mass production * 30 products
- Evaluate new process technology: New wet etch recipe
- Produce special request sample of customer * 20 items
- MES setting for new product * 450 items
- Inspect tool reform, parts cost down 1,280,000NTDper year, and save the cost of producing 130,000,000 NTD
Education
Sept.2011 - Aug.2013
National Yunlin University of Science and Technology.
Material science (M.S.)
Research nano-magnetic sample (process by PVD )
Sept.2007 - June.2011
Chung Hua University
Opto-electronics & Material Engineering(B.S.)
Research ceramic material on metal surface
Working thoughts
Whether in my current position or in past work experience, communication has always been an important part of work for the interdepartmental.
I really like to play a communication role to convey information. Not only can I increase my views on the same thing for different people and different departments, but I can also increase my lack of professional skills to solve problems.
Reasons of leaving and self-motivate
How to improve my work skills and more chance for growth and achievements in my work. My past work experience brought me the greatest sense of accomplishment, and eager to learn more and more new process technology in next job.
I am an employee with problem-solving and innovation skills. I have experience in process integration, product analysis, and inter-departmental communication, which gives me confidence that I can work in the workplace through practical work experience and strengthening of personal professional skills after being admitted to a new job.
I have ability with problem-solving and innovation, and had the experience of an engineer, and require the quality of product. I have confidence in the admission of new work, and strengthen new personal professional competence through practical work experience in the future.
王亦翰 (Eason Wang)
Since the beginning of work in 2013/9 to present with 10.5 years experience as an engineer. Main expertise is yield improvement, process technology and new product evaluate, and also handle customer complaint investigation.
In my current position at CLC company as Sr.Application engineer in Sales Division.
Contact information: E-mail: [email protected] Mobile: (+886) 0936-409-582
CAREER SUMMARY
- With 7.5-years experiences as engineer in Semiconductor Industry, mainly focus on yield improvement, process technical, new product evaluation, and handle customer complaint investigation.
- Familiar with customer service and application experience in the field of semiconductor chemicals for wet-etching and lithography processes.
Good at support main client TSMC with EUV, KrF photoresist and advanced semiconductor packaging industry client SPIL, PTI, Chipbond and ChipMos with etchant and stripper maintenance and troubleshooting.
Experience with schedule planning/ man-power allocation/ cost control & saving.
Familiar with cross-function communication with members.
CAREER HISTORY
CHEMLEADER CO. (CLC), (Semiconductor material company)
Senior Application engineer
Oct. 2022 - Present
Job responsibility:
- Experience with support advanced semiconductor packaging industry customer such as SPIL, PTI, Chipbond and ChipMos with evaluate new product and provide application support.
- Maintain and develop good relationships with customer during troubleshooting. Work closely with customer to understand issues and demands.
- Interface with R&D team and customer to develop new product.
- Design and complete DOE (Design of Experiments) evaluations material for customer.
- Responsible for customer complaint.
TOKYO OHKA KOGYO CO. (TOK), (Semiconductor material company)
Section Manager (Application engineer)
Sept. 2017 - Sept. 2022
Job responsibility:
- Experience with support main client TSMC with EUV equipment, measuring product, on-site
inspection as required.
Interface with MFG and QA teams to support production running smoothly.
Manage the photoresist product speciation and planning measurement schedule.
Analyze data and provides adjustment parameters for the next stage.
Responsible for customer complaint, tool recipe setup and test.
Inspect sample by TEL Clean track, ASML scanner, KLA SP2, CD-SEM.
Inspect EUVR, KrF, Polymer, item: Film thickness, CD-size, Defect.
Achievements:
- EUVR Development recipe improvement 20%*2 products
- KrF Coater recipe improvement 20%*2 products
- Wafer cost down 600,000 NTD/year
- Tool APM cost down 30,000 NTD/year
- Publish PM SOP*3
Chipbond Technology CO. (Semiconductor package & test company)
Product engineer
Aug. 2016 - Feb. 2017
Job responsibility:
- Experience with customer complaint and analyze abnormal sample from customer.
- Familiar with cross departmental working and communication.
- Good at revise process follow file.
NEO Solar Power Technology CO. (Solar cell company)
Process integration engineer
Sept. 2013 - Aug. 2016
Job responsibility:
- Familiar with evaluate new product and new process technology.
- Produce special request sample from customer.
- Experience with setting new spec for new product and Investigate customer complain.
Achievements:
- Evaluate new product and mass production * 30 products
- Evaluate new process technology: New wet etch recipe
- Produce special request sample of customer * 20 items
- MES setting for new product * 450 items
- Inspect tool reform, parts cost down 1,280,000NTDper year, and save the cost of producing 130,000,000 NTD
Education
Sept.2011 - Aug.2013
National Yunlin University of Science and Technology.
Material science (M.S.)
Research nano-magnetic sample (process by PVD )
Sept.2007 - June.2011
Chung Hua University
Opto-electronics & Material Engineering(B.S.)
Research ceramic material on metal surface
Working thoughts
Whether in my current position or in past work experience, communication has always been an important part of work for the interdepartmental.
I really like to play a communication role to convey information. Not only can I increase my views on the same thing for different people and different departments, but I can also increase my lack of professional skills to solve problems.
Reasons of leaving and self-motivate
How to improve my work skills and more chance for growth and achievements in my work. My past work experience brought me the greatest sense of accomplishment, and eager to learn more and more new process technology in next job.
I am an employee with problem-solving and innovation skills. I have experience in process integration, product analysis, and inter-departmental communication, which gives me confidence that I can work in the workplace through practical work experience and strengthening of personal professional skills after being admitted to a new job.
I have ability with problem-solving and innovation, and had the experience of an engineer, and require the quality of product. I have confidence in the admission of new work, and strengthen new personal professional competence through practical work experience in the future.