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EUV Equipment Engineer @台灣積體電路製造股份有限公司
2017 ~ Présent
Mechanical / Thermal Engineer, Semiconductor Engineer
Dans 1 an
N7+) - Mask defect improving - HVM fab savety (6S) control - New employee orientation Achievement - N7+ production on EUV - Reduce 25% mask defect - The most safety department of factory Mechanical and Thermal design (Ability Enterprise) Production - Security camera - Consumer camera - Sport/wearing camera Skill - Mechanical design - Thermal design and simulation - CAD/CAM software PTC-creo/COMSOL/Solidworks Customer - Huawei - Google - Sony - Fujifilm Education National Chiao Tung University, Master of mechanical engineering, 2012~2014 National Chung Cheng University, Bachelor of Mechanical engineering, 2008~2012 Work Experience TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY: Aug 2017 ~ Now EUV senior Equipment Engineer
Auto CAD
COMSOL
CAD/CAM
Temps plein
4 à 6 ans
National Chiao Tung University
Master of Mechanical engineering

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Dans 1 an
EUV Equipment Engineer @ 台灣積體電路製造股份有限公司
台灣積體電路製造股份有限公司
2017 ~ Présent
Taichung, 台灣
Professional Background
Statut Actuel
Progrès de la Recherche d'Emploi
Professions
Other
Fields of Employment
Expérience Professionnelle
4 à 6 ans
Management
Compétences
Auto CAD
COMSOL
CAD/CAM
Creo
Langues
Job search preferences
Position Désirée
Mechanical / Thermal Engineer, Semiconductor Engineer
Type d'emploi
Temps plein
Lieu Désiré
Travail à distance
Freelance
Éducation
École
National Chiao Tung University
Spécialisation
Master of Mechanical engineering
Imprimer
Profile 03 00@2x

洪維澤 (Philip Hung)

Mail : [email protected] / Tel : +(886)-916-277-255
F., No. 28, Daye N. Rd., West Dist., Taichung City 403, Taiwan (R.O.C.)

My name is Philip. I have 3 years consumer production mechanical and thermal engineer experience. Was responsible for thermal design judgement and implement solution in early product stage. 
In addition, having 3 years experience as a semiconductor equipment engineer at TSMC strengthens my ability to adapt intense work environment. As a member of lithography process (EUV) department, solving issues for wafer manufacturing timely and precisely improves my professional and communicative skills.

Semiconductor Manufacture (TSMC)


Equipment

- ASML EUV 3400B/3400C

- Tool maintain

- Metrology tool setup

- Defect control


Project

- Join R&D EUV tooling development

- F15B wafer production(N7+)

- Mask defect improving

- HVM fab savety (6S) control

- New employee orientation


Achievement

- N7+ production on EUV

- Reduce 25% mask defect

- The most safety department of 

   factory

Mechanical and Thermal design (Ability Enterprise)


Production

- Security camera

- Consumer camera

- Sport/wearing camera


Skill

- Mechanical design

- Thermal design and simulation

- CAD/CAM software

   PTC-creo/COMSOL/Solidworks


Customer

- Huawei

- Google

- Sony

- Fujifilm

Education

National Chiao Tung University, Master of mechanical engineering, 2012~2014

National Chung Cheng University, Bachelor of Mechanical engineering, 2008~2012

Work Experience

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY: Aug 2017 ~ Now

 EUV senior Equipment Engineer

ABILITY ENTERPRISE CO., LTD: Aug 2014 ~ Jul 2017

Mechanical and Thermal design Engineer

Resume
Profile
Profile 03 00@2x

洪維澤 (Philip Hung)

Mail : [email protected] / Tel : +(886)-916-277-255
F., No. 28, Daye N. Rd., West Dist., Taichung City 403, Taiwan (R.O.C.)

My name is Philip. I have 3 years consumer production mechanical and thermal engineer experience. Was responsible for thermal design judgement and implement solution in early product stage. 
In addition, having 3 years experience as a semiconductor equipment engineer at TSMC strengthens my ability to adapt intense work environment. As a member of lithography process (EUV) department, solving issues for wafer manufacturing timely and precisely improves my professional and communicative skills.

Semiconductor Manufacture (TSMC)


Equipment

- ASML EUV 3400B/3400C

- Tool maintain

- Metrology tool setup

- Defect control


Project

- Join R&D EUV tooling development

- F15B wafer production(N7+)

- Mask defect improving

- HVM fab savety (6S) control

- New employee orientation


Achievement

- N7+ production on EUV

- Reduce 25% mask defect

- The most safety department of 

   factory

Mechanical and Thermal design (Ability Enterprise)


Production

- Security camera

- Consumer camera

- Sport/wearing camera


Skill

- Mechanical design

- Thermal design and simulation

- CAD/CAM software

   PTC-creo/COMSOL/Solidworks


Customer

- Huawei

- Google

- Sony

- Fujifilm

Education

National Chiao Tung University, Master of mechanical engineering, 2012~2014

National Chung Cheng University, Bachelor of Mechanical engineering, 2008~2012

Work Experience

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY: Aug 2017 ~ Now

 EUV senior Equipment Engineer

ABILITY ENTERPRISE CO., LTD: Aug 2014 ~ Jul 2017

Mechanical and Thermal design Engineer