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On
4-6 years
6-10 years
10-15 years
More than 15 years
Past
R&D Engineer @CymMetrik Enterprise Co., Ltd.2018 ~ Present
・
FAE工程師、Project Manager、R&D
Within one month
項角色負責協調和組織各種福利活動，以提高員工福利和工作滿意度。 工作經歷 材料研發工程師 兼任產品應用工程師 R&D / FAE 正美集團 SepDec 2023 新材料開發：擅長電池凝膠、晶圓防護凝膠、醫療導電貼片等新型材料的開發，並成功解決材料應用上
Unemployed
・
Ready to interview
Full-time / Interested in working remotely
4-6 years
Tamkang University
・
Chemical & Materials Engineering
HR Supervisor – L&D, ER, HRIS @NEC (台灣恩益禧股份有限公司)2023 ~ 2023
・
人力資源管理師、招募顧問
Within one month
Christine Jiang Throughout my 7+ years of professional experience at TCS, JINS, and KLOOK, I have excelled in roles as a Sr. HR, specializing in talent acquisition. Recognized for my contributions, I received the Best Employee award in 2020 and the Value Contribution award inTaoyuan City, Taiwan 工作經歷 HR Supervisor – L&D, ER, HRIS • NEC (台灣恩益禧股份有限公司) 三月十月 2023 [Learning and development] ⚫ Formulated and executed a comprehensive company-wide 1-on-1 feedback survey.Achieved an impressive response rate of
Employed
・
Ready to interview
Full-time / Interested in working remotely
4-6 years
國立台北教育大學 National Taipei University of Education
・
藝術與造形設計學系
Senior Officer @Nippon Paint India2022 ~ Present
・
Product Manager
Within two months
Uday Dnyaneshwar Patil R&D Sr. Officer|Nippon Paint|Paint Technologist| Plastic Technologist|Construction Chemicals| Epoxy, PU Flooring India R&D- Sr. Officer , Nippon Paint India Pvt. Ltd. work experience in the field of Construction Chemicals. Current Department:Flooring, Sealants and Adhesive. Work Experience Senior Officer • Nippon Paint India FebruaryPresent Special Projects: 1. Elastomeric PU Flooring, 2. 3D Epoxy Flooring. 3. High Gloss Self level Epoxy Flooring 4. High Gloss PU Aliphatic Top coat 5. High Impact, PU Cementitous Flooring Flooring (Epoxy,PU,Polyaspartic) , Sealant (Polysulphide, Neutral Silicone
Employed
・
Ready to interview
Full-time / Not interested in working remotely
4-6 years
University Institute of Chemical Technology (formerly UDCT)
・
Paint Technology
OPC Chief Engineer @TSMC2020 ~ Present
・
AI工程師、機器學習工程師、深度學習工程師、資料科學家、Machine Learning Engineer、Deep Learning Engineer、Data Scientist
Within one month
Chun-Jung Huang [email protected] Chiao-Tung University, Ph.D. - Photonics,2015 ~ 2020 Member of The Phi Tau Phi Scholastic Honor Society of the Republic of China. Work Experience TSMC, OPC Chief Engineer (MarPresent) ◆Introduced image anomaly detection techniques to identify and address defects in photomask manufacturing, significantly improving product quality and reducing turnaround time. ◆Managed large-scale data processing tasks, demonstrating expertise in analyzing and handling datasets of hundreds of millions, to bolster model development and optimization. ◆Excelled in distributed computing, optimizing code execution across thousands of systems to
Employed
・
Ready to interview
Full-time / Interested in working remotely
4-6 years
National Chiao-Tung University
・
Ph.D. - Clinical Engineering
技術部門經理 @沛鑫包裝科技2018 ~ Present
・
R & D technologist/program manager
Within one month
Employed
・
Ready to interview
Full-time / Interested in working remotely
6-10 years
國立中興大學
・
機械Media Planning Assistant Manager @DAC_台灣迪艾思股份有限公司2023 ~ Present
・
Account Manager
Within one month
Employed
・
Ready to interview
Full-time / Not interested in working remotely
4-6 years
National Taiwan University
・
BachelorPast
行銷企劃專員 @三小文創有限公司2022 ~ 2023
・
品牌宣傳及媒體公關人員、 行銷企劃人員、活動企劃人員、傳播媒體企劃人員
Within one month
Unemployed
・
Ready to interview
Full-time / Interested in working remotely
6-10 years
實踐大學
・
行銷管理學系
Past
Staff Software Engineer @VicOne (A subsidiary of Trend Micro)2021 ~ 2023
・
軟體工程師
Within one month
2019 | 3 yrs 9 mos Developed Linux-based IP Camera. Developed video/audio related functions, snapshot/recording, sound/motion detection, HW control, and imported IVA (Intelligent Video Analytics) engine into firmware and integrated with event trigger functions. Built up communication mechanism between multiple cameras. D irectly engaged with customers in Battery camera project. Developed automated test scripts in Python for functional testing. EDUCATION M.S. Electrical Engineering Yuan Ze University •Master's thesis: A Power-Adaptive Radio Map Approach for Indoor Localization Participated in an industry-university cooperative research project
Unemployed
・
Ready to interview
Full-time / Interested in working remotely
6-10 years
Yuan Ze University
・
Electrical Engineering (Group: Digital Technology)
Past
Sr.engineer Android Developer @17 LIVE_藝啟股份有限公司臺灣分公司2022 ~ 2024
・
Android APP 開發
Within one month
黃建霖 Android App Developer •台北市，TW • d@gmail.com •我是一名熱情的Android開發工程師。具有7年的專案開發與維護的經驗,熟悉以Scrum 進行專案開發，工作上擅長與各部們合作與討論(UI/UX/QA) 且能配合PM/PO所安排之專案時程進行開發。 常見的功能包括: 定位
Unemployed
・
Ready to interview
Full-time / Interested in working remotely
6-10 years
逢甲大學
・
材料科學與工程學系
Past
Seller @Sell MAP Ltd (Shopee)2022 ~ 2024
・
主任工程師
Within one month
.Back End Engineer- Manufacture of 3DIC-TSV technology products to customers. Education Bachelor of Electrical Engineering, Da-yeh University, Taiwan 2004~2008 Skills 1.UMC ULK Team group leader 2 years, experienced various projects (Cost down) (Defect) (Equipment CIP) (Productivity) (Recipe optimization.) (Machine capacity optimization) and achieved excellent results. 2.Excellent organization, coordination, and integration ability to cooperate with R&D/ Factory affairs/Manufacturer vendor/Quality Assurance/Process Units. 3.Problem-solving and statistical analysis. 4.SPC / FDC / FMEA / 8D Report / PDCA
Unemployed
・
Ready to interview
Full-time / Interested in working remotely
6-10 years
大葉大學 DaYeh University
・
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Definition of Reputation Credits
Technical Skills
Specialized knowledge and expertise within the profession (e.g. familiar with SEO and use of related tools).
Problem-Solving
Ability to identify, analyze, and prepare solutions to problems.
Adaptability
Ability to navigate unexpected situations; and keep up with shifting priorities, projects, clients, and technology.
Communication
Ability to convey information effectively and is willing to give and receive feedback.
Time Management
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Teamwork
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Leadership
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Within one month
Director, Semiconductor Packaging R&D; Senior Member of Technical Staff
Texas Instruments
・
2020 ~ 2023
Professional Background
Current status
Unemployed
Job Search Progress
Ready to interview
Professions
Packaging Engineer
Fields of Employment
Semiconductor
Work experience
More than 15 years
Management
I've had experience in managing 15+ people
Skills
Languages
English
・
Professional
Job search preferences
Positions
Director or Managing Director above
Job types
Full-time
Locations
Taipei, 台灣, California, 美國, TX, 美國, AZ, 美國
Remote
Interested in working remotely
Freelance
No
Educations
School
University of Michigan
Major
Mechanical Engineering / Industrial Engineering
Sean Kuo
Director, Semiconductor Packaging R&D; Senior Member of Technical Staff
20 year experience in Semiconductor Package Development, Quality, Reliability and Assembly process improvement.
14+ year leading cross functional teams in global organization to achieve sustainable best records, improve customer satisfaction and increase stakeholder values.
Demonstrated a dynamic combination of strategic leadership and technical expertise; deep
understanding in problem-solving skill and program/supply chain/budget management; enthusiasm in people development.
Taipei City, Taiwan
[email protected]
https://www.linkedin.com/in/sean-kuo-47247a25/
工作經歷
二月 2020 - 八月 2023
Taipei, Taiwan
Director, Semiconductor Packaging R&D
Texas Instruments
- Led team to define TI-Taiwan new package roadmap and strategy, as well as develop and introduce new packages with innovative ideas, robust quality, and cost competitive solutions to on-time release.
Built strong connection with operation teams to smoothly and flawlessly launch complex devices and hit business goal.
Served as TI-Taiwan leadership team to direct and decide factory strategy as well as mitigate business continuity risks.
Organized and hosted worldwide meetings virtually with 120+ participants across 5+ time zones.
Coached engineers to win top 3 paper among 100+ papers in worldwide conference in 3 consecutive years.
Initiated and coached team to submit 36 IPs. 25 approved to file US patent.
Developed top notch people in multiple nations by leveraging worldwide resource.
十一月 2017 - 二月 2020
Taipei, Taiwan
Director, Quality and Reliability Assurance
Texas Instruments
- Led team to drive Taiwan quality strategy, build quality foundation and improve all quality indices.
Served as site customer representative to successfully pass IATF-16949 internal and external audits from key customers.
Led team to solve customer incidents and returns to receive high customer satisfaction across Assembly and Test process.
Led cross-function teams to drive site quality excellence. Reduced low tech error cases. Improved indices of 6 chronic defects to record low by engineering breakthrough.
Chair of MRB (Material Review Board) to direct risk assessment to protect quality to customers.
Chair of CCB (Change Control Board) to drive the process change risk assessment with improved quality.
十月 2013 - 十一月 2017
Taipei, Taiwan
Manager, Assembly Process Engineering
Texas Instruments
- Lorem ipsum dolor sit amet, consectetuer adipiscing elit, sed diam nonummy nibh euismod tincidunt ut laoreet dolore magna aliquam erat volutpat.
四月 2009 - 十月 2013
Taipei, Taiwan
Manager, Wire Bond and Direct Material Cost, Assembly Process Engineering
Texas Instruments
- Lorem ipsum dolor sit amet, consectetuer adipiscing elit, sed diam nonummy nibh euismod tincidunt ut laoreet dolore magna aliquam erat volutpat.
四月 2003 - 四月 2009
Taipei, Taiwan
Individual Process/Packaging Engineer, Assembly Process Engineering
Texas Instruments
- 2005 Jun to 2009 Apr (Taiwan): Senior Wire Bond Packaging Engineer
2004 May to 2005 Apr (Dallas, TX): Packaging and Si node readiness Engineer
2003 Apr to 2004 May (Taiwan): Wire Bond Process Engineer
學歷
2000 - 2002
University of Michigan
Mechanical Engineering / Industrial Engineering
Lorem ipsum dolor sit amet, consectetuer adipiscing elit, sed diam nonummy nibh euismod tincidunt ut laoreet dolore magna aliquam erat volutpat.
技能
- Word
- PowerPoint
- Excel
語言
- English — 專業
Sean Kuo
Director, Semiconductor Packaging R&D; Senior Member of Technical Staff
20 year experience in Semiconductor Package Development, Quality, Reliability and Assembly process improvement.
14+ year leading cross functional teams in global organization to achieve sustainable best records, improve customer satisfaction and increase stakeholder values.
Demonstrated a dynamic combination of strategic leadership and technical expertise; deep
understanding in problem-solving skill and program/supply chain/budget management; enthusiasm in people development.
Taipei City, Taiwan
[email protected]
https://www.linkedin.com/in/sean-kuo-47247a25/
工作經歷
二月 2020 - 八月 2023
Taipei, Taiwan
Director, Semiconductor Packaging R&D
Texas Instruments
- Led team to define TI-Taiwan new package roadmap and strategy, as well as develop and introduce new packages with innovative ideas, robust quality, and cost competitive solutions to on-time release.
Built strong connection with operation teams to smoothly and flawlessly launch complex devices and hit business goal.
Served as TI-Taiwan leadership team to direct and decide factory strategy as well as mitigate business continuity risks.
Organized and hosted worldwide meetings virtually with 120+ participants across 5+ time zones.
Coached engineers to win top 3 paper among 100+ papers in worldwide conference in 3 consecutive years.
Initiated and coached team to submit 36 IPs. 25 approved to file US patent.
Developed top notch people in multiple nations by leveraging worldwide resource.
十一月 2017 - 二月 2020
Taipei, Taiwan
Director, Quality and Reliability Assurance
Texas Instruments
- Led team to drive Taiwan quality strategy, build quality foundation and improve all quality indices.
Served as site customer representative to successfully pass IATF-16949 internal and external audits from key customers.
Led team to solve customer incidents and returns to receive high customer satisfaction across Assembly and Test process.
Led cross-function teams to drive site quality excellence. Reduced low tech error cases. Improved indices of 6 chronic defects to record low by engineering breakthrough.
Chair of MRB (Material Review Board) to direct risk assessment to protect quality to customers.
Chair of CCB (Change Control Board) to drive the process change risk assessment with improved quality.
十月 2013 - 十一月 2017
Taipei, Taiwan
Manager, Assembly Process Engineering
Texas Instruments
- Lorem ipsum dolor sit amet, consectetuer adipiscing elit, sed diam nonummy nibh euismod tincidunt ut laoreet dolore magna aliquam erat volutpat.
四月 2009 - 十月 2013
Taipei, Taiwan
Manager, Wire Bond and Direct Material Cost, Assembly Process Engineering
Texas Instruments
- Lorem ipsum dolor sit amet, consectetuer adipiscing elit, sed diam nonummy nibh euismod tincidunt ut laoreet dolore magna aliquam erat volutpat.
四月 2003 - 四月 2009
Taipei, Taiwan
Individual Process/Packaging Engineer, Assembly Process Engineering
Texas Instruments
- 2005 Jun to 2009 Apr (Taiwan): Senior Wire Bond Packaging Engineer
2004 May to 2005 Apr (Dallas, TX): Packaging and Si node readiness Engineer
2003 Apr to 2004 May (Taiwan): Wire Bond Process Engineer
學歷
2000 - 2002
University of Michigan
Mechanical Engineering / Industrial Engineering
Lorem ipsum dolor sit amet, consectetuer adipiscing elit, sed diam nonummy nibh euismod tincidunt ut laoreet dolore magna aliquam erat volutpat.
技能
- Word
- PowerPoint
- Excel
語言
- English — 專業