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National Taiwan University
Avatar of shih-heng sun.
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Avatar of shih-heng sun.
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Process Integration Engineer @TSMC Fab12B
2019 ~ 2021
Yield Improvement Engineer
Más de un año
huge leap for TSMC advanced IC fabrication in process integration and yield improvement. Enthusiastic about semiconductor product development and design which can change people's lives. Work Experiences Yield Improvement Engineer • TSMC Fab12B AugustDecember 2020 Expert in most advanced Logic IC process (5nm~10nm) and familiar with advanced measuring instruments such as SEM, E-beam and Bright/Dark Field Inspection Tool. Specialized in detecting defects to improve yield. Collaborated with EE & PE to refine logic IC manufacturing procedure and lower production cost. Process Integration Engineer • TSMC Fab12B / TSMC R&D MayDecember 2019 /
Communicating
Measuring Instruments
Semiconductor Process
Desempleado
A tiempo completo / Interesado en trabajar a distancia
De 4 a 6 años
National Taiwan University
M.S. Photonics and Optoelectronics

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Más de un año
Yield Improvement Engineer
TSMC Fab12B
2019 ~ 2021
Professional Background
Situación actual
Desempleado
Progreso en la búsqueda de empleo
Professions
Electrical Engineer, Product Engineer
Fields of Employment
Electrónica de consumo
Experiencia laboral
De 4 a 6 años
Management
Ninguno
Habilidades
Communicating
Measuring Instruments
Semiconductor Process
Property Analysis
Field Inspection
Data Analysis
Word
PowerPoint
Excel
Idiomas
English
Fluido
Chinese
Nativo o bilingüe
Job search preferences
Posición
Yield Improvement Engineer
Tipo de trabajo
A tiempo completo
Ubicación
Taipei, 台灣, Zhubei, Zhubei City, Hsinchu County, Taiwan
A distancia
Interesado en trabajar a distancia
Freelance
No.
Educación
Escuela
National Taiwan University
Mayor
M.S. Photonics and Optoelectronics
Imprimir

Shih Heng Sun

Semiconductor Process Integration Engineer with 5+ years of experience.

TSMC PIE specializing in advanced technology semiconductor products (3nm~10nm). Well-versed in yield improvement of semiconductor manufacturing process, Logic IC yield analysis, and collaborating with production line to solve problems. Making a huge leap for TSMC advanced IC fabrication in process integration and yield improvement. Enthusiastic about semiconductor product development and design which can change people's lives.

    

Work Experiences

Yield Improvement Engineer  •  TSMC Fab12B

August 2016 - December 2020

Expert in most advanced Logic IC process (5nm~10nm) and familiar with advanced measuring instruments such as SEM, E-beam and Bright/Dark Field Inspection Tool.
Specialized in detecting defects to improve yield.
Collaborated with EE & PE to refine logic IC manufacturing procedure and lower production cost.

Process Integration Engineer  •  TSMC Fab12B / TSMC R&D

May 2019 - December 2019 / January 2021 - December 2021 

Proficient in analyzing the relationship between chip electrical properties and process problems.
Specialized in using electrical data analysis (3nm~5nm) to improve Logic IC performance
Experienced in hitherto the most advanced semiconductor process (3nm).

Education

2013/09 - 2016/07

National Taiwan University

M.S. Photonics and Optoelectronics

2006/09 - 2010/06

National Taiwan University

B.S. Physics

Graduate Research

Enhancement of Emission Efficiency of Deep-ultraviolet AlGaN Quantum Wells through Surface Plasmon Coupling with an Al Protrusion Array

Skills


  • Semiconductor electrical property analysis
  • Advanced metrology tools (SEM, DB/DD and E-beam)
  • Excellent in problem-solving
  • Capable of both working on teams and individual
  • Influential communicating and reporting skills

Languages


  • English — Fluent
  • Chinese — Native
Resume
Perfil

Shih Heng Sun

Semiconductor Process Integration Engineer with 5+ years of experience.

TSMC PIE specializing in advanced technology semiconductor products (3nm~10nm). Well-versed in yield improvement of semiconductor manufacturing process, Logic IC yield analysis, and collaborating with production line to solve problems. Making a huge leap for TSMC advanced IC fabrication in process integration and yield improvement. Enthusiastic about semiconductor product development and design which can change people's lives.

    

Work Experiences

Yield Improvement Engineer  •  TSMC Fab12B

August 2016 - December 2020

Expert in most advanced Logic IC process (5nm~10nm) and familiar with advanced measuring instruments such as SEM, E-beam and Bright/Dark Field Inspection Tool.
Specialized in detecting defects to improve yield.
Collaborated with EE & PE to refine logic IC manufacturing procedure and lower production cost.

Process Integration Engineer  •  TSMC Fab12B / TSMC R&D

May 2019 - December 2019 / January 2021 - December 2021 

Proficient in analyzing the relationship between chip electrical properties and process problems.
Specialized in using electrical data analysis (3nm~5nm) to improve Logic IC performance
Experienced in hitherto the most advanced semiconductor process (3nm).

Education

2013/09 - 2016/07

National Taiwan University

M.S. Photonics and Optoelectronics

2006/09 - 2010/06

National Taiwan University

B.S. Physics

Graduate Research

Enhancement of Emission Efficiency of Deep-ultraviolet AlGaN Quantum Wells through Surface Plasmon Coupling with an Al Protrusion Array

Skills


  • Semiconductor electrical property analysis
  • Advanced metrology tools (SEM, DB/DD and E-beam)
  • Excellent in problem-solving
  • Capable of both working on teams and individual
  • Influential communicating and reporting skills

Languages


  • English — Fluent
  • Chinese — Native