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Avatar of shih-heng sun.
Hors ligne
Avatar of shih-heng sun.
Hors ligne
shih-heng sun
Past
Process Integration Engineer @TSMC Fab12B
・
2019 ~ 2021
Yield Improvement Engineer
Plus d'1 an
huge leap for TSMC advanced IC fabrication in process integration and yield improvement. Enthusiastic about semiconductor product development and design which can change people's lives. Work Experiences Yield Improvement Engineer • TSMC Fab12B AugustDecember 2020 Expert in most advanced Logic IC process (5nm~10nm) and familiar with advanced measuring instruments such as SEM, E-beam and Bright/Dark Field Inspection Tool. Specialized in detecting defects to improve yield. Collaborated with EE & PE to refine logic IC manufacturing procedure and lower production cost. Process Integration Engineer • TSMC Fab12B / TSMC R&D MayDecember 2019 /
Communicating
Measuring Instruments
Semiconductor Process
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Temps plein / Intéressé par le travail à distance
4 à 6 ans
National Taiwan University
・
M.S. Photonics and Optoelectronics

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Avatar of shih-heng sun.
shih-heng sun
Yield Improvement Engineer
TSMC Fab12B
・
2019 ~ 2021
Professional Background
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Professions
Electrical Engineer, Product Engineer
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Électronique Grand Public
Expérience Professionnelle
4 à 6 ans
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None
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Communicating
Measuring Instruments
Semiconductor Process
Property Analysis
Field Inspection
Data Analysis
Word
PowerPoint
Excel
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English
・
Courant
Chinese
・
Natif ou Bilingue
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Position Désirée
Yield Improvement Engineer
Type d'emploi
Temps plein
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Taipei, 台灣, Zhubei, Zhubei City, Hsinchu County, Taiwan
Travail à distance
Intéressé par le travail à distance
Freelance
Non.
Éducation
École
National Taiwan University
Spécialisation
M.S. Photonics and Optoelectronics
Imprimer

Shih Heng Sun

Semiconductor Process Integration Engineer with 5+ years of experience.

TSMC PIE specializing in advanced technology semiconductor products (3nm~10nm). Well-versed in yield improvement of semiconductor manufacturing process, Logic IC yield analysis, and collaborating with production line to solve problems. Making a huge leap for TSMC advanced IC fabrication in process integration and yield improvement. Enthusiastic about semiconductor product development and design which can change people's lives.

    

Work Experiences

Yield Improvement Engineer  •  TSMC Fab12B

August 2016 - December 2020

Expert in most advanced Logic IC process (5nm~10nm) and familiar with advanced measuring instruments such as SEM, E-beam and Bright/Dark Field Inspection Tool.
Specialized in detecting defects to improve yield.
Collaborated with EE & PE to refine logic IC manufacturing procedure and lower production cost.

Process Integration Engineer  •  TSMC Fab12B / TSMC R&D

May 2019 - December 2019 / January 2021 - December 2021 

Proficient in analyzing the relationship between chip electrical properties and process problems.
Specialized in using electrical data analysis (3nm~5nm) to improve Logic IC performance
Experienced in hitherto the most advanced semiconductor process (3nm).

Education

2013/09 - 2016/07

National Taiwan University

M.S. Photonics and Optoelectronics

2006/09 - 2010/06

National Taiwan University

B.S. Physics

Graduate Research

Enhancement of Emission Efficiency of Deep-ultraviolet AlGaN Quantum Wells through Surface Plasmon Coupling with an Al Protrusion Array

Skills

  • Semiconductor electrical property analysis
  • Advanced metrology tools (SEM, DB/DD and E-beam)
  • Excellent in problem-solving
  • Capable of both working on teams and individual
  • Influential communicating and reporting skills

Languages

  • English — Fluent
  • Chinese — Native
Resume
Profile
Imprimer

Shih Heng Sun

Semiconductor Process Integration Engineer with 5+ years of experience.

TSMC PIE specializing in advanced technology semiconductor products (3nm~10nm). Well-versed in yield improvement of semiconductor manufacturing process, Logic IC yield analysis, and collaborating with production line to solve problems. Making a huge leap for TSMC advanced IC fabrication in process integration and yield improvement. Enthusiastic about semiconductor product development and design which can change people's lives.

    

Work Experiences

Yield Improvement Engineer  •  TSMC Fab12B

August 2016 - December 2020

Expert in most advanced Logic IC process (5nm~10nm) and familiar with advanced measuring instruments such as SEM, E-beam and Bright/Dark Field Inspection Tool.
Specialized in detecting defects to improve yield.
Collaborated with EE & PE to refine logic IC manufacturing procedure and lower production cost.

Process Integration Engineer  •  TSMC Fab12B / TSMC R&D

May 2019 - December 2019 / January 2021 - December 2021 

Proficient in analyzing the relationship between chip electrical properties and process problems.
Specialized in using electrical data analysis (3nm~5nm) to improve Logic IC performance
Experienced in hitherto the most advanced semiconductor process (3nm).

Education

2013/09 - 2016/07

National Taiwan University

M.S. Photonics and Optoelectronics

2006/09 - 2010/06

National Taiwan University

B.S. Physics

Graduate Research

Enhancement of Emission Efficiency of Deep-ultraviolet AlGaN Quantum Wells through Surface Plasmon Coupling with an Al Protrusion Array

Skills

  • Semiconductor electrical property analysis
  • Advanced metrology tools (SEM, DB/DD and E-beam)
  • Excellent in problem-solving
  • Capable of both working on teams and individual
  • Influential communicating and reporting skills

Languages

  • English — Fluent
  • Chinese — Native