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雲端工程師，雲端架構師
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National Taiwan University
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Avatar of the user.
Disponible pour les entreprises avec abonnement
Past
Process Integration Engineer @TSMC Fab12B
・
2019 ~ 2021
Yield Improvement Engineer
Plus d'1 an
Communicating
Measuring Instruments
Semiconductor Process
Sans Emploi
Temps plein / Intéressé par le travail à distance
4 à 6 ans
National Taiwan University
・
M.S. Photonics and Optoelectronics
Avatar of Marvin Lin.
Avatar of Marvin Lin.
Marvin Lin
iOS Developer @CMoney全曜財經資訊股份有限公司
・
2019 ~ Présent
Senior iOS Developer
Dans 1 mois
Quiz - https://itunes.apple.com/tw/app/idExperienced with App deployment procedure on App Store. Experienced with Git/Github version control. Had experience of Scrum developing procedure Toshiba, Out sourcing project manager, Nov 2013 ~ Apr 2017 Focusing on back-end process of semiconductor of memory (SSD). Constructed Business Intelligence (BI) system to all out sourcing resource. Introduced BI tool (Spotfire) to weekly, monthly report of all out sourcing resource. Managing schedule and monitoring out-sourcing items process. Monitoring shipment situation of out-sourcing sites. Showa
IOS
Objective-C/Swift
SwiftUI
Reputation Credits2
Employé
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Temps plein / Intéressé par le travail à distance
6 à 10 ans
National Taiwan University
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Material Science
Avatar of John Chiu.
Avatar of John Chiu.
John Chiu
Past
AI Project Coordinator @TSMC
・
2020 ~ Présent
雲端工程師，雲端架構師
Plus d'1 an
experiencing various cultures is my favourite after work. Graduate Student at the University of Auckland Hsinchu，TW [email protected] Work Experience AI Project Coordinator,, 1 year, 6 months Taiwan Semiconductor Manufacturing Company @ Machine-learning-based DoE (D esign o f E xperiments ) Consult 10+ process recipe tuning projects in advanced technology (N3, N2, N1.4) Build up a machine-learning adoption framework to assist used OFAT to MFAT tuning. Data Scientist, 8 years 3 months Taiwan Semiconductor Manufacturing Company @ Ma chine Learning Solution Development Using OpenCV(C#), ImageJ (Java) and
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6 à 10 ans
National Taiwan University
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Industrial Engineering
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Project leader engineer(主任工程師) @TSMC
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2014 ~ Présent
Optical engineer, Semiconductor engineer
Dans 3 mois
OPC
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6 à 10 ans
National Taiwan University
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Photonics and optoelectronic
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CTO @KryptoGO Co., Ltd.
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2021 ~ Présent
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Dans 1 an
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6 à 10 ans
National Taiwan University
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Computer Science and Information Engineering

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Plus d'1 an
Avatar of shih-heng sun.
shih-heng sun
Yield Improvement Engineer
TSMC Fab12B
・
2019 ~ 2021
Professional Background
Statut Actuel
Sans Emploi
Progrès de la Recherche d'Emploi
Professions
Electrical Engineer, Product Engineer
Fields of Employment
Électronique Grand Public
Expérience Professionnelle
4 à 6 ans
Management
None
Compétences
Communicating
Measuring Instruments
Semiconductor Process
Property Analysis
Field Inspection
Data Analysis
Word
PowerPoint
Excel
Langues
English
・
Courant
Chinese
・
Natif ou Bilingue
Job search preferences
Position Désirée
Yield Improvement Engineer
Type d'emploi
Temps plein
Lieu Désiré
Taipei, 台灣, Zhubei, Zhubei City, Hsinchu County, Taiwan
Travail à distance
Intéressé par le travail à distance
Freelance
Non.
Éducation
École
National Taiwan University
Spécialisation
M.S. Photonics and Optoelectronics
Imprimer

Shih Heng Sun

Semiconductor Process Integration Engineer with 5+ years of experience.

TSMC PIE specializing in advanced technology semiconductor products (3nm~10nm). Well-versed in yield improvement of semiconductor manufacturing process, Logic IC yield analysis, and collaborating with production line to solve problems. Making a huge leap for TSMC advanced IC fabrication in process integration and yield improvement. Enthusiastic about semiconductor product development and design which can change people's lives.

    

Work Experiences

Yield Improvement Engineer  •  TSMC Fab12B

August 2016 - December 2020

Expert in most advanced Logic IC process (5nm~10nm) and familiar with advanced measuring instruments such as SEM, E-beam and Bright/Dark Field Inspection Tool.
Specialized in detecting defects to improve yield.
Collaborated with EE & PE to refine logic IC manufacturing procedure and lower production cost.

Process Integration Engineer  •  TSMC Fab12B / TSMC R&D

May 2019 - December 2019 / January 2021 - December 2021 

Proficient in analyzing the relationship between chip electrical properties and process problems.
Specialized in using electrical data analysis (3nm~5nm) to improve Logic IC performance
Experienced in hitherto the most advanced semiconductor process (3nm).

Education

2013/09 - 2016/07

National Taiwan University

M.S. Photonics and Optoelectronics

2006/09 - 2010/06

National Taiwan University

B.S. Physics

Graduate Research

Enhancement of Emission Efficiency of Deep-ultraviolet AlGaN Quantum Wells through Surface Plasmon Coupling with an Al Protrusion Array

Skills

  • Semiconductor electrical property analysis
  • Advanced metrology tools (SEM, DB/DD and E-beam)
  • Excellent in problem-solving
  • Capable of both working on teams and individual
  • Influential communicating and reporting skills

Languages

  • English — Fluent
  • Chinese — Native
Resume
Profile
Imprimer

Shih Heng Sun

Semiconductor Process Integration Engineer with 5+ years of experience.

TSMC PIE specializing in advanced technology semiconductor products (3nm~10nm). Well-versed in yield improvement of semiconductor manufacturing process, Logic IC yield analysis, and collaborating with production line to solve problems. Making a huge leap for TSMC advanced IC fabrication in process integration and yield improvement. Enthusiastic about semiconductor product development and design which can change people's lives.

    

Work Experiences

Yield Improvement Engineer  •  TSMC Fab12B

August 2016 - December 2020

Expert in most advanced Logic IC process (5nm~10nm) and familiar with advanced measuring instruments such as SEM, E-beam and Bright/Dark Field Inspection Tool.
Specialized in detecting defects to improve yield.
Collaborated with EE & PE to refine logic IC manufacturing procedure and lower production cost.

Process Integration Engineer  •  TSMC Fab12B / TSMC R&D

May 2019 - December 2019 / January 2021 - December 2021 

Proficient in analyzing the relationship between chip electrical properties and process problems.
Specialized in using electrical data analysis (3nm~5nm) to improve Logic IC performance
Experienced in hitherto the most advanced semiconductor process (3nm).

Education

2013/09 - 2016/07

National Taiwan University

M.S. Photonics and Optoelectronics

2006/09 - 2010/06

National Taiwan University

B.S. Physics

Graduate Research

Enhancement of Emission Efficiency of Deep-ultraviolet AlGaN Quantum Wells through Surface Plasmon Coupling with an Al Protrusion Array

Skills

  • Semiconductor electrical property analysis
  • Advanced metrology tools (SEM, DB/DD and E-beam)
  • Excellent in problem-solving
  • Capable of both working on teams and individual
  • Influential communicating and reporting skills

Languages

  • English — Fluent
  • Chinese — Native