Product Test Engineer @Realtek Semiconductor Corp.
・
2021 ~ Present
工程師
Within one month
First Name:Ting-Hua Last Name: Chang Gender: Male Birthday:1994/12/10 Aged:29 years old Email: [email protected] Mobile:Taoyuan District, Taoyuan City, Taiwan Work experience Product Test Engineer • Realtek Semiconductor Corp.(Realtek) Hsinchu Taiwan , AugPresent (2 Years and 6 Months) Subcon &OSAT management : Release new CP/ FT device on Subcon & OSAT Production issues analysis and summarize report Wafer Sort/Final Test suppliers and drive operation performance Product yield enhanced and improvement summarize report. Subcon & OSAT production process audit and review Multimedia production test engineering team leader. Tester
統、電子帳單寄送系統、簡訊/推播/LineBC發送系統、自然人憑證系統、短網址系統 學歷 恆逸教育訓練中心 使用Spring Framework 5開發企業級應用程式輔仁大學 Fu Jen Catholic University 資訊管理學系技能 Word PowerPoint Excel Project Management Communication Redis kafka Spring MVC Vue.js JAVA JavaScript JSP jstl DB2 PostgreSQL MongoDB SpringBoot Control-M 語言 English — 進階
of preventing MO [PVD] 2. [Productivity] Robotic Automation auto trace inline lot defect [Reduce shift team loading average: 12hr/week] 3. QDR reduction summary 4. SPC reduction summary 5. PVD 110/130/140 QD/DOE summary 6. Training PVD shift three members 感謝您閱讀我的履歷,期待有機會能加入貴公司的團隊。 技能 Word PowerPoint Excel Microsoft Office Java 興趣 Table tennis Singing Scuba diving 語言 English — 中階 Chinese — 母語或雙語
Word
PowerPoint
Excel
Employed
・
Open to opportunities
Full-time / Interested in working remotely
4-6 years
國立雲林科技大學 National Yunlin University of Science and Technology
Product Test Engineer • Realtek Semiconductor Corp.(Realtek)
Hsinchu Taiwan, Aug 2021 - Present (2 Years and 6 Months)
Subcon &OSAT management :
Release new CP/ FT device on Subcon & OSAT
Production issues analysis and summarize report
Wafer Sort/Final Test suppliers and drive operation performance
Product yield enhanced and improvement summarize report.
Subcon & OSAT production process audit and review
Multimedia production test engineering team leader.
Tester platform:Teradyne J750,UltraFlex,IFlex
Prober platform:TSK,TEL
Handler platform:EPSON
Hold lot disposition and EQC issue verification
ATE Load board/probe card troubleshooting and maintenance
Product Test Engineer • Advanced Semiconductor Engineering Corp.(ASE)
Taoyuan Taiwan, July 2020 - July 2021(1 year)
Assist the customer to input new products and improve the yield performance
Establish production process
Handling hold lot and analysis
low yield improvement, troubleshooting of related production equipment
Analysis of product site yield gap
Analyze the program with channel diagram, pin diagram and data log or alarm message to verify the test board debugging
Assist customers to verify the new version of the test program and OI interface
Product yield control and abnormal integration and analysis of worldwide customers side production.
Assist in verify the electrical test abnormal IC.
ATE platform : Teradyne : Eagle
Prober platform: TSK,TEL
Handler platform: EPSON
Application Engineer • King Yuan Electronics Corp.(KYEC)
Miaoli Taiwan, Feb 2017 - Jun 2020 (3 Years and 5 Months) 1.Use Teradyne ATE, UFLEX,IFLEX platform to maintain production loadboard for customers. 2.Waveform,shmoo plot,TDE tool for program debugging and maintenance of customer's loadboard 3.Assist customers to NPI and improve yield 4.Assist customers to verify new test program and OI interface 5.Assist clients in the transformation of loaodboard layout 6.Product yield control and abnormal integration and analysis of products 7.Assist in verifying client electrical test abnormal IC 8.ATE site difference reading value analysis 9.Adjust test parameters, voltage, current, delaytime, etc.,to improve product yield 10.Analyze program with channel map, pin map and datalog or alarm messages for verification test board debug 11.Verify and test socket probe lifetime maintenance 12.Adjust needle clearing parameters of prober(TSK and TEL) to improve product yield 13.Reduce production test time and improve efficiency 14.Establish OCAP to bring up and training shift Engineer skills
Product Test Engineer • Realtek Semiconductor Corp.(Realtek)
Hsinchu Taiwan, Aug 2021 - Present (2 Years and 6 Months)
Subcon &OSAT management :
Release new CP/ FT device on Subcon & OSAT
Production issues analysis and summarize report
Wafer Sort/Final Test suppliers and drive operation performance
Product yield enhanced and improvement summarize report.
Subcon & OSAT production process audit and review
Multimedia production test engineering team leader.
Tester platform:Teradyne J750,UltraFlex,IFlex
Prober platform:TSK,TEL
Handler platform:EPSON
Hold lot disposition and EQC issue verification
ATE Load board/probe card troubleshooting and maintenance
Product Test Engineer • Advanced Semiconductor Engineering Corp.(ASE)
Taoyuan Taiwan, July 2020 - July 2021(1 year)
Assist the customer to input new products and improve the yield performance
Establish production process
Handling hold lot and analysis
low yield improvement, troubleshooting of related production equipment
Analysis of product site yield gap
Analyze the program with channel diagram, pin diagram and data log or alarm message to verify the test board debugging
Assist customers to verify the new version of the test program and OI interface
Product yield control and abnormal integration and analysis of worldwide customers side production.
Assist in verify the electrical test abnormal IC.
ATE platform : Teradyne : Eagle
Prober platform: TSK,TEL
Handler platform: EPSON
Application Engineer • King Yuan Electronics Corp.(KYEC)
Miaoli Taiwan, Feb 2017 - Jun 2020 (3 Years and 5 Months) 1.Use Teradyne ATE, UFLEX,IFLEX platform to maintain production loadboard for customers. 2.Waveform,shmoo plot,TDE tool for program debugging and maintenance of customer's loadboard 3.Assist customers to NPI and improve yield 4.Assist customers to verify new test program and OI interface 5.Assist clients in the transformation of loaodboard layout 6.Product yield control and abnormal integration and analysis of products 7.Assist in verifying client electrical test abnormal IC 8.ATE site difference reading value analysis 9.Adjust test parameters, voltage, current, delaytime, etc.,to improve product yield 10.Analyze program with channel map, pin map and datalog or alarm messages for verification test board debug 11.Verify and test socket probe lifetime maintenance 12.Adjust needle clearing parameters of prober(TSK and TEL) to improve product yield 13.Reduce production test time and improve efficiency 14.Establish OCAP to bring up and training shift Engineer skills