silicon wafers manufacturing process ranged from ingot growth, cropping and grinding, slug evaluation, slicing, double-side grinding, edge grinding, HLM, alkaline and acid etching, RTA, double-side polishing, edge-polishing, cleaning, inspection, packaging, and Epi. Managed the daily operation of production, quality, budget, material consumption, and events of factory automation, facility and equipment repair and ESH. Drafted KPI of Manufacturing Center to find out the area for improvement from the perspective of productivity, efficiency, yield, quality, cost, delivery and safety. MayDec 2019 Director, Manufacturing Safety Division Shin-Etsu Handotai Taiwan Co., Ltd. Total employees : 138
Full-time / Interested in working remotely
National Chiao Tung University
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Technology Management