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of $0.5m I onboarded the VW account as new business, which opened worldwide opportunities for ATEQ Responsible for strategic supplier relationships and accountable for the coordination and implementation of schedule and budget planning of all new products/solutions Quality Engineer @ CONDUMEX Group Mexico Responsible for the metrology department, working with engineering to improve process standards using information collected from operations Responsible for implementing processes within the metrology department leading to successful ISO9001 accreditation Education Master in International Business GGSB - École supérieure de commerce Grenoble, France Electronic Engineering (Automation) ITQ - Queretaro Institute Of Technology Queretaro, Mexico Co

Experiments of RC decay could be low by reducing K-factor. Let constructs would not be weak after curing. UMC trained me to learn more process of NDC, TEOS and SION etc. We co-worked with other department about Etch, Photo and Diffusion. I use Film Metrology Tools(Aleristo measure thickness, RI, U% and Stress measurement. I have consistently exceeded my targets and I am able to successfully work under pressure and multi-task efficiently. As an avid cyclist and user of many of your products. I am confident that my experience, communication

with the project manager to understand the requirements Module Development - Implement the module by following the interface Release Document - Writing the user manual to let others know the usage of this module Maintenance - Push module to remote repository, update the version by the new requirement Algorithm Development - Develop defect inspection & metrology algorithm using Halcon library SW/HW Integration - Integrate the AOI software with camera/light device/PLC, etc. AOI System Development - Construct high throughput AOI System with in-line battery factory Asynchronous acquisition/inspection Distributed system for throughput requirement/cross platform integration Multi-threading

and demonstrate the characteristics of personal communication . D uring the period of studied at Institute of Optoelectronic Engineering, I have been participated in a research project of optical inspection system. Via imaging laser optics based digital holograpgic technology and Matlab based algorithm to development a 2D/3D metrology system with a resolution of micro meter order. Dare to accept challenges. Practice and apply what I have learned. Look forward to self-improvement Skills Tracepro Non-imaging optical design Stray light analysis LCD brightness/visual analysis SPEOS Non-imaging optical design Visualizing Situational Simulation

to improve Logic IC performance Experienced in hitherto the most advanced semiconductor process (3nm). Education 2013//07 National Taiwan University M.S. Photonics and Optoelectronics 2006//06 National Taiwan University B.S. Physics Graduate Research Enhancement of Emission Efficiency of Deep-ultraviolet AlGaN Quantum Wells through Surface Plasmon Coupling with an Al Protrusion Array Skills Semiconductor electrical property analysis Advanced metrology tools (SEM, DB/DD and E-beam) Excellent in problem-solving Capable of both working on teams and individual Influential communicating and reporting skills Languages English — Fluent Chinese — Native

daemon for serving 7 fabs globally. Internal Data-as-a-Service (DaaS) A easy/reuse-able single source API via scala/spark, able to reach more than 20 internal data source. High performance and saving human hour of developing data process > 500 hours . Image Virtual Metrology Fusion the CMOS image and FDC to build up virtual metrology on CMP/DE. Estimated benefit on improving CPK and increase inline inspection to 100%. Implement via Machine Learning/Deep Learning with spark and MLflow for serving model evaluation and tracking. Best Window of

Check) 4). Maintain product yield and solve the problem of low yield by experiment. (Product defect improvement yield increase) 5). The project experiment in the yellow light area and the solution for finding abnormality online. 6).Recipe setting: Expose: ASML (Dry/ immersion), Canon. Metrology: CDSEM(Hitachi, Apply) ,Overlay (KLA) 7).Analysis and design for Litho mark . 8).Tool simulation: SMO/PROLITHUS/PRODATA 9).SPIE paper: Reducing the substrate dependent scanner leveling effect in low-k1 contact printing 六月二月 2022 Senior Engineer • 華邦電