issue of Module products (Wireless/PA/Wearable module) from Dec’12 to Nov’15 Took charge of New Products development of Stacked-Die FBGA and PoP (package on package) products from Y2008 to end of Y2012 Successfully led FOW (DAF over wire) products of M company into mass-production in end of Y2009 Successfully led PoP products of B company into mass-production on Q2 of Y2011 JanJan 2008 Integration Engineer UMC (Tainan Taiwan) Took charge of F/BEoL integration includes 45nm wafer processing, Flip-chip/BOAC rule maintain and low-k wafer dicing solution.
lai chao chyi Senior Software Developer, Extensive experience in Android app development, Experience in independently developing apps with Vue.js Currently working at Microsoft as a Support Engineer, primarily responsible for the product Azure OpenAI. 台灣新北市 Work Experience Azure Support Engineer • Microsoft Product: Azure (OpenAI & IoT) Content: - Application and technological research of Azure services - Architecture & solution recommendations - OpenAI prompt engineering Rectified critical issue for client utilizing Azure OpenAI and IoT Services, resulting in notable improvements in performance and heightened customer satisfaction. Collaborated extensively across multiple departments(billing, network service, APIM) Promoting a customer