Joyce Chu My name is Joyce Chu. I have worked at Chipbond since 2017 and in charge of bumping and sometimes need to cooperate with probe and DPS team to figure out some engineering issues. So, I am very good at bumping process and basic probe and DPS knowledge are both no problem as well. I am the person with high pressure resistance, determination and persistence. Taiwan Province, Taiwan Work Experience Senior engineer • CHIPBOND 2017/4 - Present 1. NPI project: mask drawing design by using K-layout and AutoCAD and do the risk assessment
Taiwan Technology University・
Material Science and Engineering