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Acceleration architecture RD engineer

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Job updated 8 months ago

Job Description

About the job

The job focuses on the development of tightly/loosely coupled acceleration computing units for specified applications, such as machine learning, a complex task that requires an understanding of software workloads, pain points in implementation, and effective partitioning of the workload between a general-purpose processor and a hardware acceleration. We research, design, and develop new technologies and architecture to make computing faster, seamless, and more efficient.

Responsibilities
  • Define the next generation machine learning accelerator architecture and ISA for machine learning applications.
  • Explore various trade-offs of future architecture designs in terms of performance, power, energy, and area. Initiate new feature modeling in the architecture simulator.
  • Work with compiler engineers to optimize compilation results and extend the compiler infrastructure.
  • Work with software engineers to partition machine learning workload to selected compute engines to enhance user experiences.

Requirements

Minimum qualifications:
  • Master degree in Computer Science, Electrical Engineering, a related field, or equivalent practical experience
  • 3 years of experience in computer or chip architecture, performance, and/or compiler
  • Experience with one or more general purpose programming languages, including C/C++ or Python

Preferred qualifications:
  • PhD degree in Computer Science or Electrical Engineering
  • Experience with domain-specific accelerators
  • Experience with distributed/parallel programming
  • Experience with hardware/software co-design for machine learning
  • Experience with micro-architecture

Interview process

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1
3 years of experience required
50,000 ~ 150,000 TWD / month
Optional Remote Work
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Logo of Andes Technology 晶心科技.

About us

晶心科技股份有限公司於2005年成立於新竹科學園區,2017年於台灣證交所上市(TWSE: 6533)。

晶心是RISC-V國際協會的創始首席會員,也是第一家採用RISC-V作為其第五代架構AndeStar™基礎的主流CPU供應商。為滿足當今電子設備的嚴格要求,晶心提供可配置性高的32/64位元高效CPU核心,包含DSP、FPU、Vector、超純量(Superscalar)及多核心系列,可應用於各式SoC與應用場景。晶心亦提供功能齊全的整合開發環境和全面的軟/硬體解決方案,可幫助客戶在短時間內創新其SoC設計。

在2021年,Andes-Embedded™ SoC的年出貨量突破30億顆;而截至2021年底,嵌入AndesCore™ 的SoC累積總出貨量已達100億顆。

更多關於晶心的資訊,請參閱晶心官網 https://www.andestech.com。

晶心重視每一位員工,除了有良好工作環境,也提供學習及成長的空間,歡迎優秀的朋友一起加入晶心的工作行列,打造未來尖端科技的精兵。


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