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Internship
實習期間：2024年07月至2024年08月 -實習地點：桃園市龍潭區中豐路高平段1號 職缺一 【產品製程整合工程師實習】 【職務說明】 • Identify chances to increase test/process yield and throughput 了解半導體製造生產流程及良率改善。 • New product introduction, qualification and
40K+ TWD / month
No requirement for relevant working experience
No management responsibility
號 OR 新北市中和區中正路866號 【產品測試工程師實習職務說明】 • Test solution debug at manufacture production line 改善IC自動化測試流程，幫助提昇IC生產效率。 • Identify chances to increase test yield and throughput 了解半導體製造生產流程及良率改善。 • Design, develop, and im
40K+ TWD / month
No requirement for relevant working experience
No management responsibility
about summer internship program>> https://forms.office.com/r/zB5DJwivdq 【Internship Positsions】Resume submissions are open until 5/16. You may apply multiple positions by links below. Hardward Engineer 硬體工程師 Softward Engineer 軟體工程師 Firmware Engineer 韌體工程師 Mechanical Engineer 機構工程師 Sales & Marketing 業務行銷 Manufacturing 生產製造 PM & Specialist 營運管
45K ~ 45K TWD / month
No requirement for relevant working experience
No management responsibility
