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Hermes Microvision Inc. (HMI), an ASML company, has been committed to the research and development of the most advanced E-beam Inspection (EBI) tools and solutions for the leading semiconductor manufacturing fabs. As a PE intern, you will be co-work with Production Engineer to sustain manufacture quality and make production line stable. Job Description classify issue and help to inform competence owner to handle. Modify document base on DnE and PE release information. Sending

Introduction to the job ASML has been committed to the research and development of the most advanced E-beam Inspection (EBI) tools and solutions for the leading semiconductor manufacturing fabs. If you are willing to accept diversified challenges、 cooperate and innovate 、 care about each other, this is the opportunity to make it happen. Role and responsibilities - Produce diversified modules and ensure production quality - Have a ability to analyze and solve problems - To bridge between factory

Job Title CS - Global Operations Center Planner (12-hr day/night shift) - Linkou Degree: Bachelor Work Experience: 2-3 years Travel: 10% Workplace Types: Hybrid Job Description: Introduction to the job Do you like challenges and do you want to work in a fast pacing supply chain environment to support some of the biggest semiconductor companies worldwide? Are you familiar with Logistics Operations and like to managing urgent demands on a daily basis? If this sounds like you and

Google welcomes people with disabilities. Minimum qualifications: 10 years of experience in VLSI technologies, product and test engineering, and semiconductor processing. Experience in Automated Test Equipment (ATE) or system-level testings using AdvanTest or UFlex systems. Preferred qualifications: Experience in system-level testing using Advantest SLT platform. Familiarity with Automatic Test Equipment (ATE) test platforms such as Advantest 93K, Teradyne UltraFlex SoC test system. Familiarity

1. Sensor IC/ Mixed Signal IC Design, Verification, Design/Verification related documents writing: -Familiar with Hspice, Matlab simulation tools. -Familiar with ADC/DAC, Bandgap, Regulator, Filter, and so on related IP design is preferred. -Interesting in Ambient light sensor, Proximity sensor, Long wave length Infrared sensor, Humidity sensor design is preferred. -Familiar with basic semiconductor process is preferred. 2. Support Mass Production Testing 3. Design Document/Report Support

Tensorcom, a pioneer in developing innovative semiconductors for high-speed millimeter wave, ultra-low power, wireless communication chipsets, is looking for a candidate who is interested in working on complex ASIC designs for our next generation 60GHz, IEEE 802.11ad/WiGig compliant SoCs with specific emphasis on developing RTL code for the digital baseband module. The candidate will participate in a range of ASIC development activities such as defining the digital modem architecture, the evalua

CSCM Group Leader - Global Operations Center / Linkou Introduction Do you like challenges and do you want to work in a fast pacing supply chain environment to support some of the biggest semiconductor companies worldwide? Are you familiar with Logistics Operations and like to managing urgent demands on a daily basis? If this sounds like you and if you have a strong customer oriented mindset, here is your mission. Job Mission For our Global Operations Center in Taichung in

Tensorcom, a pioneer in developing innovative semiconductors for high-speed millimeter wave, ultra-low power, wireless communication chipsets is looking for a candidate who is interested in developing software tools, drivers, and firmware for its highspeed wireless millimeter wave network communications products. As an experienced S/W designer, you will be expected to have deep knowledge of and experience in one or more major specialty functions of one or more programming languages, OS device dr

Tensorcom, a pioneer in developing innovative semiconductors for high-speed millimeter wave, ultra-low power, wireless communication chipsets, is looking for a candidate who is interested in working on complex, low power, ASIC designs for our next generation WiGig/IEEE 802.11ad compliant SoCs. The interested candidate will participate in a range of ASIC development activities such as defining the SoC architecture, the development of RTL code, the taping-out of the chip, and the evaluation of

Resume submissions are open until 5/16. You may apply multiple positions by links below. Hardward Engineer 硬體工程師 Softward Engineer 軟體工程師 Firmware Engineer 韌體工程師 Mechanical Engineer 機構工程師 Sales & Marketing 業務行銷 Manufacturing 生產製造 PM & Specialist 營運管理 (e.g. PM、IT、FIN、Corporate Brand Marketing、Procurement、HR...) Optoelectronic Semiconduct