I have experienced three different positions in ASE PE department 1. Assembly NPI team druing 2019/09~2020/08 for Hisilicon FCCSP Device * New Product Introduction Planning -Risk Assessment: Substrate design review, process FMEA review, flow definition, BOM material selection and reliability verification -Yield Management: Yield improvement, Customer engineer lot arrangement 2. ATV Project team during 2020/08~2022/03 for ATV system construct - ATV factory enhancement with 5M1E, hand free improvement, and unit traceability with BGA device -ATV NPI device defect gating enhancement -ATV BOM selection recommendation -Support to ATV customer audit (Renesas and Toshiba) 3. Assembly HVM team from 2022/03 till now -Qualcomm HVM device yield management and quailty issue handling -Support project for new factory established -New machine buy off planning -Coordinate with cross-department working difficulty

I have experienced 2 position in Pynmax Quality department 1. QC team during 2014/09~2016/08 * Schottky and GPP(Glassivation passivation part) product quality performance monitor -MQA sampling size definition and SPC monitor in process -Non confirming product disposal -Major defect analysis and improvement -Support to internal audit and control plan review regularly -Wafer probing criteria tighten by 1.5 IQR outlier finding 2. CQM team during 2016/08~2019/09 *Schottky and GPP product for Panjit customer -RMA and MRB procedure handling -Communicating effectively with customer and 8D report writing -Support to internal and external audit