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劉力維
Project Researcher
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劉力維

Project Researcher
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Wistron
National Sun Yat-Sen University
New Taipei City, Taiwan

職場能力評價

專業背景

  • 目前狀態
  • 專業
    產品經理
  • 產業
    消費性電子產品
  • 工作年資
    6 到 10 年
  • 管理經歷
  • 技能
    Manufacturing Process
    Process Evaluation
    Tolerance Analysis
    Mechanical Design
    Injection Molding
    Manufacturing
    Total Quality
  • 最高學歷

求職偏好

  • 預期工作模式
    全職
    對遠端工作有興趣
  • 希望獲得的職位
    Project Researcher
  • 期望的工作地點
  • 接案服務

工作經驗

Project Researcher

2015年8月 - 現在
Lead total design and communicate with customer on four projects including 2in1 and gaming series . In charge of Form factor checking, MB placement, Key part design. Form factor checking : Fix the key part location, then provide the aggressive dimension to client. MB placement : Define the connector location and provide the limit height to layout team. Key part design : Battery module. Improve the Mechanical parts cost and yield rate. Cost down 10% and enhance 5% yield rate for predecessor. Own multiple project & implement multiple source in project. Communicate placement and check solution with function team Thermal, EMC & EE . Evaluate the material and manufacturing process to use in. Experience including Plastic and Double injection molding, Sheet metal, Die Casting, Diamond cut, Anodization, Compression rubber, Stamping. Assign work and arrange training plan to young engineer. Discuss DFM, DFA, DFQ & DFSS with factory and supplier separately. Define total quality plan Both factory and vendor side until meet target. FPYR over 95% in the MP phase. Base on CAE and test data, provide the solving plan to client and recommend solutions. Confirm the ME schedule with other function. Pull in 10 days. Check the tooling sets, tooling life with fulfillment.

Senior Mechanical Engineer

2013年1月 - 2015年7月
2 年 7 個月
Design LCD, palm rest and base assembly on three projects. One is the thinnest 14 laptop & best project at company Z height = 15.3mm . In charge of mechanical part design, Key part design, ME test & process evaluation. Mechanical part design : Speaker module, LCD cover & LCD bezel, palmrest, Base, Door, Hinge cap, hinge, Antenna module, KB support bracket, K-lock bracket, FFC cable, wire cable. Key part design : Keyboard module. the thinnest KB module 3.2mm, stroke 1.2mm ME test : KB deflection, housing rigidity, Click pad travel & force, Touch feeling, K-lock test. Process evaluation : Aluminum stamping process, Diamond cut, High gloss, Double injection. Discuss DFM with vendor. Improve manufacturing quality until mass production.

Mechanical Engineer

2010年6月 - 2012年12月
2 年 7 個月
Join the normal NB mechanical design & proposal two times. One is annual project that have greatest quantity 5 million . In charge of mechanical part design, ME test & process evaluation. Mechanical part design : Dummy card, speaker module, palmrest, Door, KB support bracket, K-lock bracket, FFC cable, wire cable. ME test : KB deflection, housing rigidity, Click pad travel & force, Touch feeling, K-lock test. Drive the jigs and fixture to enhance parts quality.

學歷

Master of Mechanical Engineering
2006 - 2009