During the ten years of TSMC’s tenure, he devoted himself to the 300mmBR technical process management unit. The main task was to handle the production of wafers, from deposition, etching, heating, photoresist processing, filling, development and other process systems to 300mmBR The technical process management unit must adopt keen observation and vigilance, strictly check whether each process is in accordance with SOP, and then conduct two rechecks by BR staff to load the SM system to complete the entire process.