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Avatar of Jackie Tsai.
Jackie Tsai
Module Packaging Engineer
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Jackie Tsai

Module Packaging Engineer
Born in Taoyuan city, 27 years old now. I got a master degree from National Tsing Hua University. Majored in MEMS (Micro Electro Mechanical Systems) process and chip design. Designed the process flow and drew the mask to fabricate the chip on my own. Motivated and experienced Equipment Engineer and Process Engineer with 2 years of experience in TSMC. Experienced in trouble shooting and period maintenance on PVD process tool and WET clean process tool. Proven ability to communicate with vendors and employees in departments, such as metrology team and yield team to make the project of defect reduced. Leave from TSMC due to family issues, then join to Actron and work as Module Packaging Engineer. Mainly responsible for bonding tool (wire bonding, ribbon bonding). Now join to DISCO and work as Customer Service Engineer, mainly responsible for wafer sawing tools.
Logo of the organization.
DISCO HI-TEC Taiwan
Logo of the organization.
National Tsing Hua University
Taoyuán, Taiwan

Professional Background

  • Current status
    Employed
    ・
    Not open to opportunities
  • Profession
    Semiconductor Engineering
    ・
    Equipment Engineer
    ・
    Process Engineer
  • Fields
    Semiconductor
  • Work experience
    2-4 years (2-4 years relevant)
  • Management
    None
  • Skills
    Micro LED Mass Transfer
    MEMS chip design
    Tool Period Maintenance and Trouble Shooting
    Source Development
    Wire Bonding/Ribbon Bonding
    Yield analysis/enhancement
    Semiconductor Process
    Good Communication Skills
    Tool Assembling
  • Languages
    English
    ・
    Fluent
    Japanese
    ・
    Beginner
    Chinese
    ・
    Native or Bilingual
  • Highest level of education
    Master

Job search preferences

  • Desired job type
    Full-time
    ・
    Interested in working remotely
  • Desired positions
    Customer Service Engineer
  • Desired work locations
    Taichung City, Taiwan
    ・
    Hsinchu City, Taiwan 300
    ・
    Taoyuan City, Taiwan
    ・
    Tainan City, Taiwan
  • Freelance
    Non-freelancer

Work Experience

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Customer Service Engineer

DISCO HI-TEC Taiwan
・
Full-time
May 2023 - Present
Hsinchu, Hsinchu City, Taiwan
• Mainly resposible for blade dicing tools (wafer sawing). • Analyzes and troubleshoots technical problems via phone or at customer site. • On-call or on-tudy alone to handle the tool's status, minimize the tool's downtime. • Provides assitance of installation and relocation of tools. • Guides proper training and provides tool's manuals for all users and cusvomers
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Module Packaging Engineer

Actron Technology Corp.
Dec 2022 - May 2023
・
6 mos
Taoyuan City, Taiwan
• Tool's vendor : HESSE(BJ920, BJ931), KNS(PowerFushion), TRI(TR7700Q SII). • Wire bonding and ribbon bonding tool maintenance. • Defined the criteria of parts' lifetime and the standard of scrapped material. • Yield rate maintenance and cost saving (second source development) • Do the analysis of scrapped material and the measurement data to find out the root cause and fix it. • Monitored the process result of looping (height, width of bonding foot). Finetuned the parameters if needed.
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Process Engineer

台灣積體電路製造股份有限公司(TSMC)
Apr 2022 - Jul 2022
・
4 mos
• Tool's vendor : SCREEN (SU & SB series) • Developed the most efficient recipe to enhance the WPH. • Fine tune the parameters of process to enhance the yield rate. • Communicated with Equipment Engineer to solve the defect problem. • Did data analysis and experiment establishment for new process. • Second source development for cost saving
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Equipment Engineer

台灣積體電路製造股份有限公司(TSMC)
Oct 2020 - Apr 2022
・
1 yr 7 mos
Taichung City, Taiwan
• Tool's vendor : AMAT(Endura PVD), ASM(Pulsar XP ALD), KE(Single wafer baking). • Created SOP for operation and alarm handles for equipment. • Tool period maintenance & trouble shooting. • Managed the project and offline KPI (parts, count of alarm, chart performance) . • On-duty alone & work in shift to handle the tool status. • FDC alarm recovery & SPC data analysis. • Co-work with vendors to install or re-locate the tool.

Education

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National Tsing Hua University

Master’s Degree
・
Power Mechanical Engineering
2018 - 2020
Description
Thesis article : The CMOS-MEMS Electrostatic Transfer Head Integrated with Piezoresistive Force Sensor. The chip is fabricated by TSMC process platform (0.18um 1P6M CMOS-MEMS). Due to this platform has the multi-layer structure, it makes the integration of sensor easier. This chip used poly-si as piezoresistive material, also set Wheatstone bridge to measure the change in resistance. The top metal layer is designed as electrode, it can generate electrostatic force to pick up the Micro LED chip while we applied voltage on it. Designed the via and sacrificed layer to fabricate the cavity, let poly-si has the space to deform. When the Micro LED chip contacted the transfer head, the poly-si would deform and we could do the measurement of resistance to calculate the bonding force. With this design, we can enhance the yield rate of mass transfer.
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National Chung Hsing University Taichung

Bachelor’s Degree
・
Mechanical Engineering
2014 - 2018