1. Responsible for special process yield improvement for 10%. 2. Development auto function increases production yield by 12%. 3. Defect analysis and reduction. 4. Teamwork with vendors to do new function testing and data collection. 5. Using Fault Detection & Classification System do the troubleshooting. 6. Using Big data to maintain the wafer source quality. 7. Tool retrofit and software upgrade data validation and function testing.

1.維護3D列印機台和協助修改CAD圖檔 2.教育部3D列印校園巡迴推廣計畫擔任導覽員

1. 協助工地現場施工維護與清掃 2.採購現場所需材料與零件 3. 4.