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Leo Su
Packaging Designer
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Leo Su

Packaging Designer
Ever since I graduated from Cheng Kung University. I have put my time into getting R&D experience in several company. I have worked for Taimide technology and Unicon Optical. I have one year of experience in pressure sensitive adhesive development, and another one year in silicone hydrogel contact lens development. My strength lies in formulation of recipe and new product introduction. I developed the first thermal release tape in Taimide and it’s could be shipped and profitable. In Unicon, I managed to a new process technique which make lens more comfortable to wear and import it into mass production. Currently, I work for Powertech technology as a package designer. I have over 3 years of experience in package design. I’m well in new device package feasibility and technical risk assessment. I managed to coordinate lots of design review meeting and introduce several devices to mass production including BGA, eMCP, eMMC, UFS hybrid and FCCSP type. I’m definitely communicative and familiar with aligning opinions from vendor, factory and customer. I hope I have demonstrated my suitability and hope to be afforded the opportunity to further show how my educational background and work experience would enable me to be evaluable asset to your esteemed company.
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Powertech Technology Inc.
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National Tsing Hua University,NTHU
台灣新竹縣竹北市竹北

Latar Belakang Profesional

  • Status sekarang
  • Profesi
    Packaging Engineer
    Materials Engineer
  • Bidang
    Semikonduktor
  • Pengalaman Kerja
    4-6 tahun (relevan 2-4 tahun)
  • Management
    Tidak ada
  • Skil
    Packaging Design
    New Product Introduction
    Issue Resolution
    Coordination
  • Bahasa
    Chinese
    Bahasa ibu atau Bilingual
    English
    Menengah
  • Pendidikan tertinggi
    Master

Preferensi pencarian kerja

  • Jenis pekerjaan yang diinginkan
    Full-time
    Tertarik bekerja jarak jauh
  • Jabatan pekerjaan yang diinginkan
    Packaging Designer
  • Lokasi pekerjaan yang diinginkan
  • Bekerja lepas
    Non-pekerja lepas

Pengalaman Kerja

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Packaging Designer

08/2018 - Sekarang
1. Semiconductor Packaging Design - R&D in IC packaging, SIP Module packaging and single die packaging - IC packaging material characterization and failure analysis - Packaging proposal, design, process flow, risk assessment, data collection and analysis 2. New Product Introduction - Bring IC packaging solutions from concept to mass production - Drive package development working closely with customer, vendors and multi-functional team

Research And Development Engineer

10/2017 - 05/2018
8 mos
Silicone Hydrogel Contact Lens Development - Silicone Hydrogel: formulation development - Hydrophilic silicone oligomer synthesis - Explore new ingredients with fundamental understanding, experiment design, data analysis and result interpretation - Assists in research efforts to improve existing products

Research And Development Engineer

08/2016 - 05/2017
10 mos
Thermal Release Tape development - Polyimide film: polymer synthesis and coating process - Pressure sensitive adhesive: formulation development - Explore new ingredients with chemical functionality that improve product performance via understanding of customer needs & material technology - Assists in research efforts to improve existing products or create new application

Edukasi

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Sarjana
Chemical Engineering
2008 - 2013
Logo of the organization.
Sarjana
Chemical Engineering
2008 - 2013
Logo of the organization.
Sarjana
Chemical Engineering
2008 - 2013
Logo of the organization.
Sarjana
Chemical Engineering
2008 - 2013
Logo of the organization.
Master
Chemical Engineering
2008 - 2013