● Developed the go-to-markets and increased 60% of operating income. ● Developed the CoWoS inner crack inspection system. ● Developed AOI modules combined with deep learning applications to improve the capability for defects detection for customers. ● Leaded the sales team to perform market survey and defined a product roadmap. ● Managed customer relationships and improved operational efficiency, ● Allocated and integrated of various resources. ● Managed the product marketing and positioning strategy.

● Developed the SiP inner crack inspection system machine. ● Developed strip inspection system machine. ● Lead the project schedule control, cost control, and manage manpower. ● Managed the project progress and risk. ● Coordinated with cross-departmental. ● Researched new technology development and application. ● Created specifications and related technical manuals.

● Designed the AOI module. ● Installed the machine and testing on site. ● Designed demonstration kits for business promotion. ● Developed the wafer level CSP AOI project in the semiconductor field. ● Developed the CMP pad project in the chemistry filed .

● Coded the algorithm for industry control protocol conversions. (Modbus, profibus, etc...) ● Designed the MFC software interface. ● Planed the SPS Automation Exhibition in Nuremberg, Germany.