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Definition of Reputation Credits
Personality
-Excellent in planning and designing experiments.
-Effective for problem solving and logical analysis.
-Being detail-oriented, responsible, clever and a fast learner.
-Communicative for project discussion and team work.
Work Experiences
R&D Process Engineer • Hitachi High-Tech Corporation
Aug. 2019 - Present
⚫ Expertly trained on the 901x series in R&D product lines for dry etching process.
⚫ Process trouble-shooting to determine faults for non-performance.
⚫ Customer’s information data collection and analysis, solve process issue and optimize process to get process POR
⚫ Process CIP evaluation and implant in customer site to improve process stability.
⚫ Communicate between Japanese resource and customer sites and provide effective solution toward dry etching process.
Process Engineer • TSMC
Apr. 2017 - Aug. 2019
⚫ Being responsible for medium current and high energy ion implanter
⚫ Conducted assessing processes, taking measurements and interpreting data.
⚫ Developed best practices, routines and innovative solutions to improve production rates and
quality of output.
✓ Arcing defect improvement by adjust suppression voltage for low-energy and high dosage implant process.
✓ Beam standard improvement by set beam spectrum analyzer for high-energy implantation, decrease 200pcs WAT abnormal/1year
✓ Medium current idle time defense function to avoid WAT shift by beam-decay case.
✓ Set RTM to catch chamber pressure when beam profile scan to avoid beam profile errorcaused by chamber leakage.
✓ Create a new particle monitor procedure instead of scratch monitor to improve cycle time.
⚫ Solved urgent conditions for production line.
Process Engineer • UMC
Jan. 2016 - Apr. 2017
⚫ Being responsible for N28 etching from spacer to ESD layer.
⚫ Planned and executed effective, well-designed experiments
✓ Planned over etch split for yield loss case on salicide layer and solve the weakness of process window.
⚫ Co-work with vendor for new tool release for cycle time improvement(9 tool/year).
⚫ Maintained SPC chart and performed risk assessment.
⚫ Defect source analysis, co-work with equipment engineer to improvement particle performance.
Education
National Cheng Kung University
Material Science and Engineering
2012 - 2014
National Chung Hsing University
Material Science and Engineering
2008 - 2012
Extracurricular activities
- Member of Badminton Club in Hitachi-high tech (2019-now)
- Staff of Popularization Science Education activities (2012-2014)
- Cadre of NCHU Photography Club (2010-2011)
- Executive of Darkroom Camp in NCHU Photography Club (2011)
- Part-time stuff at Cold Stone Creamery (2010)
- Member of Material Freshmen’s Camp (2009)
- Member of Material Science Camp (2009)
- Member of Badminton Club (2006-2008)
Skills
Language
- Word
- Excel
- PowerPoint
- Ion implanter
- Dry etching
- Chinese
- English
Personality
-Excellent in planning and designing experiments.
-Effective for problem solving and logical analysis.
-Being detail-oriented, responsible, clever and a fast learner.
-Communicative for project discussion and team work.
Work Experiences
R&D Process Engineer • Hitachi High-Tech Corporation
Aug. 2019 - Present
⚫ Expertly trained on the 901x series in R&D product lines for dry etching process.
⚫ Process trouble-shooting to determine faults for non-performance.
⚫ Customer’s information data collection and analysis, solve process issue and optimize process to get process POR
⚫ Process CIP evaluation and implant in customer site to improve process stability.
⚫ Communicate between Japanese resource and customer sites and provide effective solution toward dry etching process.
Process Engineer • TSMC
Apr. 2017 - Aug. 2019
⚫ Being responsible for medium current and high energy ion implanter
⚫ Conducted assessing processes, taking measurements and interpreting data.
⚫ Developed best practices, routines and innovative solutions to improve production rates and
quality of output.
✓ Arcing defect improvement by adjust suppression voltage for low-energy and high dosage implant process.
✓ Beam standard improvement by set beam spectrum analyzer for high-energy implantation, decrease 200pcs WAT abnormal/1year
✓ Medium current idle time defense function to avoid WAT shift by beam-decay case.
✓ Set RTM to catch chamber pressure when beam profile scan to avoid beam profile errorcaused by chamber leakage.
✓ Create a new particle monitor procedure instead of scratch monitor to improve cycle time.
⚫ Solved urgent conditions for production line.
Process Engineer • UMC
Jan. 2016 - Apr. 2017
⚫ Being responsible for N28 etching from spacer to ESD layer.
⚫ Planned and executed effective, well-designed experiments
✓ Planned over etch split for yield loss case on salicide layer and solve the weakness of process window.
⚫ Co-work with vendor for new tool release for cycle time improvement(9 tool/year).
⚫ Maintained SPC chart and performed risk assessment.
⚫ Defect source analysis, co-work with equipment engineer to improvement particle performance.
Education
National Cheng Kung University
Material Science and Engineering
2012 - 2014
National Chung Hsing University
Material Science and Engineering
2008 - 2012
Extracurricular activities
- Member of Badminton Club in Hitachi-high tech (2019-now)
- Staff of Popularization Science Education activities (2012-2014)
- Cadre of NCHU Photography Club (2010-2011)
- Executive of Darkroom Camp in NCHU Photography Club (2011)
- Part-time stuff at Cold Stone Creamery (2010)
- Member of Material Freshmen’s Camp (2009)
- Member of Material Science Camp (2009)
- Member of Badminton Club (2006-2008)
Skills
Language
- Word
- Excel
- PowerPoint
- Ion implanter
- Dry etching
- Chinese
- English