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. Material selection and build product BOM. Cost review and improvement. Mechanical parts design evaluation and testing. Plastic/metal tooling design and development. Analysis and solving issues under NPI stage. Thermal condition analysis and improvement. Discussion design and specification with customer directly. Lithography Equipment Engineer • TSMC NovMay 2014 Diagnosis and handle equipment issues. Equipment maintenance and modification. Education National Sun Yat-sen University M.S in Mechanical and Electro-Mechanical EngineeringNational Sun Yat-sen University B.S in Mechanical and Electro-Mechanical EngineeringProduct development experience Wireless presentation system

陳健峰 John Chen Work over 8 years in the semiconductor area. Have expertise especially in DUV lithography systems. Hsinchu City, Taiwan 300 ˙ [email protected] ˙Work Experience Sr. Field Service Engineer • Nikon Precision Taiwan Ltd. OctoberPresent Primarily responsible for customer service with DUV lithography machine issues. Diagnosing and trouble shooting with any kinds of scanner issues. Modify machine and tune parameters to meet customer's request. Master in high order lens aberration adjustment. Implement first Nikon I14 stepper top/bottom lens replacement in Taiwan. Projection lens

UMC as Etch process engineer for two years and 9 months and worked in Applied Materials as CVD process support engineer for three years and 7 months. When I worked in UMC, My job is to maintain and solve production issue, so I cooperate with other departments like integration, lithography, thin film and also diffusion very often. So it makes me know integration process flow very well. One of my process flow improvement achievement is increasing 5% of production capacity. When I worked in Applied Materials. My position changed from foundry customer to supplier.

production capacity. Make a new part number and spec for custom product. Brightness verification for custom product with new process. Production planning. Custom Sorting & Binning Spec. Genesis Photonics , Process Engineer, Nov 2017 ~ March 2020 Process engineers, Process engineers, Responsible for process optimization and yield improvement Lithography Process Engineer Lithography Process Engineer Monitor the yield of reticle and products through AOI, to improve appearance yield of product. Making data analysis report of lithography process to optimize parameters to reduce the cost of rework. Collaborated with cross-department coworkers to develop stepper parameters for specific

to contribute my skills and knowledge in a fast-paced and challenging environment. New Taipei City, Taiwan [email protected] ☎YiChao Chang Skills Equipment maintenance Equipment troubleshooting wafer equipment Stress management Language Chinese Native English Medium Working experience Equipment Engineer Taiwan Semiconductor Manufacturing Co., Ltd. Lithography engineering department, scanner section JulJulLithography engineering department, track and development section SepJunTroubleshoot issues,and execute routine maintenance of equipment, including TEL CLEAN TRACK ACT & ASML DUV series Minimize certain specific wafer defects during coating photoresist by spotting machines which are easier to generate defects, and then improving them with

張景順 (Peter CHANG) Photo Process Development Dept. From 2005 to today, 16 years have been engaged in the industry related to the memory lithography process, from the production line machine program editing to the mask layout design, new material development/process optimization to new product planning/development, has accumulated a considerable amount of Lithography process experience. Hsinchu, Hsinchu City, Taiwan 工作經歷 Project Manager • 旺宏電子 (MXIC) 1). Development of process scaling conditions and abnormal resolution NOR Flash: 110/ 75/ 55 nm NAND Flash: 36 /19

analysis , Sense-array .etc) •N7 wafer container quality owner (Foup dimension/Inspection/AMC Gas analyzer) Mask & Metrology Engineering • Taiwan Semiconductor Manufacturing Company(TSMC) 十一月九月 2018 •N28 Critical Dimension Electron Microscope (CD-SEM) metrology sponsor. •LIT defect scanner (Viper/OM) sponsor for lithography-related defect monitor. •Thermal-wave (OP) sponsor for lithography photo-resist thickness defense. •2nd version Mask qualified by handling experiment lot pi-run CD/KLA scan & WAT analysis . 學歷National Chiao Tung University Master's degree in Display InstituteNational Chiao Tung University Bachelor's