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4 到 6 年
6 到 10 年
10 到 15 年
15 年以上
United States
Avatar of Chenyang Hsu.
Avatar of Chenyang Hsu.
曾任
Senior Product Application Engineer @Mi Equipment
2021 ~ 2023
Senior Engineer
一個月內
and business issues◆ Increased productivity: Coordinated the new tool expansion of poly1 etch, increased the production capacity of the main product by 25-30% within a year. ◆ New product development: Cooperated with ST / PEI engineers on products in the experimental stage or converted into mass production. Including the CIS/HV/BCD products. ◆ Trained newcomers and served as SPC coordinator. Education Chung Yuan Christian University Master of Physics Job skill C/C++ Embedded system Matlab DOE FMEA Risk Analysis SPC Word, Excel, Powerpoint Language English — Intermediate Mandarin — Native language
DOE
FMEA Risk Analysis
MES
待业中
正在积极求职中
全职 / 对远端工作有兴趣
6 到 10 年
Chung Yuan Christian University
Physic
Avatar of the user.
Avatar of the user.
AI Engineer @Playsee
2022 ~ 现在
資料分析師、資料科學家、產品經理
一個月內
Python
Project Management
Strategic Thinking
就职中
正在积极求职中
全职 / 对远端工作有兴趣
4 到 6 年
National Cheng Kung University
心理所(認知科學所)
Avatar of the user.
Engineering
超過一年
Matlab
LabVIEW
Microsoft Office
目前会考虑了解新的机会
全职 / 暂不考虑远端工作
4 到 6 年
Illinois Institute of Technology
Chemical Engineering
Avatar of 林宇翔.
Avatar of 林宇翔.
曾任
產品開發工程師/EPM @鴻來企業股份有限公司
2018 ~ 2023
半導體工程師/PM/產品經理/專案管理
半年內
Michael Lin A small number of engineers with Bachelor's degree in Mechanical Engineering and a background in Psychology. Served in the fields of Semiconductor, Consumer electronics, Automation and traditional manufacturing . Skill Mechanical material of science Nanofabrication of Microelectromechanical Systems nondestructive examination Finite Element Analysis visual basic Matlab Labview Autocad Process Engineer 8D/RCA troubleshooting IC Assembly Processes improvement team up motion teaching on robotic Pro_E and CATIA Product Manager PDLC Competitor analysis EVT/DVT/NVT Pricing coordinate internal and customer Social media management copywriting Language Chinese-native English- medium 550~750 Japanese-N5
8D/RCCA troubleshooting
Assembly Processes
EPM
待业中
全职 / 对远端工作有兴趣
4 到 6 年
私立中國文化大學
機械工程學
Avatar of Hao-Chun (Chad) Yang.
Avatar of Hao-Chun (Chad) Yang.
Senior Machine Learning Engineer @C-Media Electronics
2020 ~ 2021
Machine Learning Scientist, Data Scientist
一個月內
Hao-Chun (Chad) Yang Ph.D Ph.D Graduate @NTHU (EE) | Seeking AI/ML R&D Position | Speech, IOT, Health Informatics, Computational Neuroscience | pytorch, tensorflow Room 315, General Building III, No. 101, Section 2, Kuang-Fu Road,Hsinchu City, Taiwan Skills Programming Programming: Python, Matlab DevOps: AWS, GCP, Git, Docker Deep Learning: Pytorch, Tensorflow, Keras ML& Data Science: Sklearn, Numpy, Pandas, Matplotlib MLOps: MLflow, W&B Special HonorsBest Challenge Poster - Physionet/CINC ChallengeTravel Grants - IEEE SPS SocietyPresident Scholarship - NTHU Education National Tsing Hua University Ph.D. in Electrical Engineering (SepPresent) National Tsing
Python
pytorch
tensorflow
服兵役中
全职 / 对远端工作有兴趣
4 到 6 年
清華大學
電機工程
Avatar of the user.
Avatar of the user.
Quality Assurance Engineer @Zemax, LLC (Now part of Ansys)
2021 ~ 现在
前瞻光學工程師、頭戴式顯示器光學工程師、抬頭顯示器光學工程師、立體顯示光學工程師
一年內
LCoS SLM
光束輪廓儀
偏振分析儀
就职中
全职 / 对远端工作有兴趣
4 到 6 年
國立清華大學
動力機械所光機電組
Avatar of Ankit Sharma.
Avatar of Ankit Sharma.
System Engineer @Tata Consultancy Services
2015 ~ 2019
Control Systems Engineer
超過一年
Services, System Engineer, Mar 2015 ~ Nov 2019 Here my duties included designing parts of automobiles, preparing technical drawings, and coordinating with the onsite team, to ensure customer requirements were met on time. Here my team provided services to the automaker client, Mazda Motor Corporation. Skills Siemens NX, CATIA, MATLAB, ANSYS, FORTRAN, POINTWISE CFD. Education Missouri University of Science and Technology, Rolla, Master of Science (MS), Mechanical Engineering, 2020 ~ 2022 Currently a graduate student of an MS -Thesis course at the university. Chhattisgarh Swami Vivekanand Technical University, Bachelor of Engineering (BEng), Mechanical Engineering, 2010 ~ 2014 Completed a
Siemens NX
CATIA V5
Matlab/Simulink
就学中
Intern / 对远端工作有兴趣
4 到 6 年
Missouri University of Science and Technology, Rolla
Mechanical Engineering
Avatar of Alan Colio.
Avatar of Alan Colio.
Engineer @Palomar Scientific Instruments
Hardware Engineer
超過一年
Alan Colio I have worked as a full-time hardware engineer since 2012 and had been working part-time hardware engineer intern sinceUsing my skills of hardware engineering, I oversee the client's product complete life-cycle from planning to manufacture to meet and exceed their expectations. Hardware Engineer San Diego, California, US [email protected] Skills VHDL Xilinx ISE, PlanAhead, and Vivado System Generator SDK Altium Designer Schematic Capture and PCB Layout Labview FPGA FPGA Module for FlexRIO C API Interface MatLab Simulink Microprocessors Qt C/C++ EE lab instruments Oscilloscopes, Signal generators
VHDL
Altium Designer
Xilinx
全职 / 对远端工作有兴趣
4 到 6 年
CSUSM
Applied Physics

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时间管理能力
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超過一年
Northeast Asia 5G Management Trainee at Ericsson Group
Logo of Ericsson.
Ericsson
2020 ~ 现在
Taipei, 台灣
专业背景
目前状态
就职中
求职阶段
专业
系统、网络管理员
产业
工作年资
小於 1 年
管理经历
技能
Microsoft Office
Matlab
C/C++
Thermal Analysis
Research and Development (R&D)
Semiconductor Process
CMOS
Ansys
Semiconductor Industry
Telecommunications Industry
5G New Radio (NR)
Electronic Packaging
Product Management
Radio Access Networks
Private Networks
语言能力
Chinese
母语或双语
English
专业
Japanese
初阶
求职偏好
希望获得的职位
Sales Account Manager/ Project Manager/ Pre-sales/ Solution Architect
预期工作模式
全职
期望的工作地点
Taiwan, Japan, Belgium, Netherlands, USA, Sweden, Germany, South Korea, UK, France, Switzerland, Austria
远端工作意愿
对远端工作有兴趣
接案服务
学历
学校
Katholieke Universiteit Leuven
主修科系
Faculty of Science
列印

Pin-Jun Chen

Northeast Asia 5G Management Trainee at Ericsson Group

  Taipei, Taiwan

5G Elite Trainee in Market Area North East Asia (MNEA) at Ericsson Group, based in Taipei, Taiwan. Former International Scholar at KU Leuven who focused on advanced electronic packaging technology, which is commonly used in IC and ICT industries. Moreover, I have served as an R&D Intern at imec, Belgium, a HW Intern at Qualcomm, and a Graduate Research Assistant at TSMC research center in NCTU, Taiwan.

    

工作經歷

Northeast Asia 5G Management Trainee  •  Ericsson

十一月 2020 - Present

5G Elite Trainee Program in North East Asia
• Under the coaching of the President of Ericsson Taiwan, Chafic Nassif.
• Be rotated into three core departments of Project Management, Product Management, and Sales within two years.
• Support the key account management (KAM) team with product and solution expertise focusing on 5G projects.

Research and Development Intern  •  Interuniversity Microelectronics Centre (imec)

一月 2020 - 五月 2020

Wafer Bonding Assembly Team
• Designed and conducted a novel process to fabricate 3D microfluidic devices with dry film resistance (DFR) technology.
• Manipulated laminator, bonder, and SAM to investigate the optimal parameter for the DFR process.

Hardware Engineering Intern  •  Qualcomm

五月 2019 - 十一月 2019

Reliability Engineering Team
• Learn the product level reliability evaluation for leading-edge silicon process technology on mobile products.
• Learn how to use statistical analysis (Weibull, Lognormal), reliability tools or software, HTOL oven, and ESD machine.

Graduate Research Assistant  •  Taiwan Semiconductor Manufacturing Company (TSMC)

九月 2017 - 九月 2019

TSMC Research Center in NCTU (交大-台積電聯合研發中心)
• Under the supervision of Prof. Chenming Hu, former CTO of TSMC, from UC Berkeley.
• Collaborated with TSRI and NCTU-UCB Joint Center for Intelligent Semiconductor Technology to develop a novel process for next-generation Monolithic 3D BEOL FinFET.

Research Intern  •  Industrial Technology Research Institute (ITRI)

五月 2018 - 四月 2019

Electronics and Optoelectronic System Research Laboratories
• Used different materials as passivation layers to investigate low-temperature Cu-to-Cu bonding techniques.
• Utilized ANSYS APDL to analyze transient thermal conduction problems in different models and boundary conditions.

Undergraduate Research Assistant  •  The Chinese University of Hong Kong (CUHK)

七月 2017 - 八月 2017

Department of Chemistry
• Research topic: Synthesis of Sonogashira Cross-Coupling Reaction.
• Used Pd catalyst to synthesize over 20+ types of compounds to investigate the Sonogashira coupling mechanism.

Summer Intern  •  Academia Sinica

七月 2016 - 九月 2016

Institute of Chemistry
• Research topic: The Conductivity Shift of PEDOT Derivatives.
• Used four-point probe measurement and Autolab to analyze the conductivity of 10+ kinds of conducting polymer.

學歷

2020 - 2020

Katholieke Universiteit Leuven

Faculty of Science

2017 - 2020

National Chiao Tung University

International College of Semiconductor Technology

2013 - 2017

National Tsing Hua University

Department of Materials Science and Engineering

技能

Professionalism


  • IC/Semiconductor Engineering
  • Advanced Electronic Packaging
  • 5G/B5G Telecom Technology
  • Radio Access Networks (RAN)

Soft Skills


  • Product Management/Pre-sales
  • Project Management/Service Delivery
  • Account Management/Sales

Language


  • Chinese
  • English
简历
个人档案

Pin-Jun Chen

Northeast Asia 5G Management Trainee at Ericsson Group

  Taipei, Taiwan

5G Elite Trainee in Market Area North East Asia (MNEA) at Ericsson Group, based in Taipei, Taiwan. Former International Scholar at KU Leuven who focused on advanced electronic packaging technology, which is commonly used in IC and ICT industries. Moreover, I have served as an R&D Intern at imec, Belgium, a HW Intern at Qualcomm, and a Graduate Research Assistant at TSMC research center in NCTU, Taiwan.

    

工作經歷

Northeast Asia 5G Management Trainee  •  Ericsson

十一月 2020 - Present

5G Elite Trainee Program in North East Asia
• Under the coaching of the President of Ericsson Taiwan, Chafic Nassif.
• Be rotated into three core departments of Project Management, Product Management, and Sales within two years.
• Support the key account management (KAM) team with product and solution expertise focusing on 5G projects.

Research and Development Intern  •  Interuniversity Microelectronics Centre (imec)

一月 2020 - 五月 2020

Wafer Bonding Assembly Team
• Designed and conducted a novel process to fabricate 3D microfluidic devices with dry film resistance (DFR) technology.
• Manipulated laminator, bonder, and SAM to investigate the optimal parameter for the DFR process.

Hardware Engineering Intern  •  Qualcomm

五月 2019 - 十一月 2019

Reliability Engineering Team
• Learn the product level reliability evaluation for leading-edge silicon process technology on mobile products.
• Learn how to use statistical analysis (Weibull, Lognormal), reliability tools or software, HTOL oven, and ESD machine.

Graduate Research Assistant  •  Taiwan Semiconductor Manufacturing Company (TSMC)

九月 2017 - 九月 2019

TSMC Research Center in NCTU (交大-台積電聯合研發中心)
• Under the supervision of Prof. Chenming Hu, former CTO of TSMC, from UC Berkeley.
• Collaborated with TSRI and NCTU-UCB Joint Center for Intelligent Semiconductor Technology to develop a novel process for next-generation Monolithic 3D BEOL FinFET.

Research Intern  •  Industrial Technology Research Institute (ITRI)

五月 2018 - 四月 2019

Electronics and Optoelectronic System Research Laboratories
• Used different materials as passivation layers to investigate low-temperature Cu-to-Cu bonding techniques.
• Utilized ANSYS APDL to analyze transient thermal conduction problems in different models and boundary conditions.

Undergraduate Research Assistant  •  The Chinese University of Hong Kong (CUHK)

七月 2017 - 八月 2017

Department of Chemistry
• Research topic: Synthesis of Sonogashira Cross-Coupling Reaction.
• Used Pd catalyst to synthesize over 20+ types of compounds to investigate the Sonogashira coupling mechanism.

Summer Intern  •  Academia Sinica

七月 2016 - 九月 2016

Institute of Chemistry
• Research topic: The Conductivity Shift of PEDOT Derivatives.
• Used four-point probe measurement and Autolab to analyze the conductivity of 10+ kinds of conducting polymer.

學歷

2020 - 2020

Katholieke Universiteit Leuven

Faculty of Science

2017 - 2020

National Chiao Tung University

International College of Semiconductor Technology

2013 - 2017

National Tsing Hua University

Department of Materials Science and Engineering

技能

Professionalism


  • IC/Semiconductor Engineering
  • Advanced Electronic Packaging
  • 5G/B5G Telecom Technology
  • Radio Access Networks (RAN)

Soft Skills


  • Product Management/Pre-sales
  • Project Management/Service Delivery
  • Account Management/Sales

Language


  • Chinese
  • English