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进阶搜寻
On
没有符合的项目。
Taichung City, Taiwan
Taiwan
软体
没有符合的项目。
小於 1 年
1 到 2 年
2 到 4 年
4 到 6 年
6 到 10 年
10 到 15 年
15 年以上
AI 智能配对
On
National Chung Cheng University
國立中正大學
Taichung City, Taiwan
Taiwan
全职
Auto CAD
CAD/CAM
CREO
Comsol
无
一年內
Mechanical / Thermal Engineer, Semiconductor Engineer
没有符合的项目。
没有符合的项目。
2012
在职中
Off
全选
佳能企業股份有限公司
台灣積體電路製造股份有限公司
没有符合的项目。
没有符合的项目。
没有符合的项目。
English
4 到 6 年
6 到 10 年
10 到 15 年
15 年以上
  • 隐藏已读结果
  • 展开所有工作经验
Avatar of 洪維澤.
离线
Avatar of 洪維澤.
离线
洪維澤
EUV Equipment Engineer @台灣積體電路製造股份有限公司
・
2017 ~ 现在
Mechanical / Thermal Engineer, Semiconductor Engineer
一年內
N7+) - Mask defect improving - HVM fab savety (6S) control - New employee orientation Achievement - N7+ production on EUV - Reduce 25% mask defect - The most safety department of factory Mechanical and Thermal design (Ability Enterprise) Production - Security camera - Consumer camera - Sport/wearing camera Skill - Mechanical design - Thermal design and simulation - CAD/CAM software PTC-creo/COMSOL/Solidworks Customer - Huawei - Google - Sony - Fujifilm Education National Chiao Tung University, Master of mechanical engineering, 2012~2014 National Chung Cheng University, Bachelor of Mechanical engineering, 2008~2012 Work Experience TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY: Aug 2017 ~ Now EUV senior Equipment Engineer
Auto CAD
COMSOL
CAD/CAM
全职
4 到 6 年
National Chiao Tung University
・
Master of Mechanical engineering
100+

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职场能力评价定义

专业技能
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一年內
Avatar of 洪維澤.
洪維澤
EUV Equipment Engineer @ 台灣積體電路製造股份有限公司
台灣積體電路製造股份有限公司
・
2017 ~ 现在
Taichung, 台灣
专业背景
目前状态
求职阶段
专业
其他
产业
工作年资
4 到 6 年
管理经历
技能
Auto CAD
COMSOL
CAD/CAM
Creo
语言能力
求职偏好
希望获得的职位
Mechanical / Thermal Engineer, Semiconductor Engineer
预期工作模式
全职
期望的工作地点
远端工作意愿
接案服务
学历
学校
National Chiao Tung University
主修科系
Master of Mechanical engineering
列印
Profile 03 00@2x

洪維澤 (Philip Hung)

Mail : [email protected] / Tel : +(886)-916-277-255
F., No. 28, Daye N. Rd., West Dist., Taichung City 403, Taiwan (R.O.C.)

My name is Philip. I have 3 years consumer production mechanical and thermal engineer experience. Was responsible for thermal design judgement and implement solution in early product stage. 
In addition, having 3 years experience as a semiconductor equipment engineer at TSMC strengthens my ability to adapt intense work environment. As a member of lithography process (EUV) department, solving issues for wafer manufacturing timely and precisely improves my professional and communicative skills.

Semiconductor Manufacture (TSMC)

Equipment

- ASML EUV 3400B/3400C

- Tool maintain

- Metrology tool setup

- Defect control

Project

- Join R&D EUV tooling development

- F15B wafer production(N7+)

- Mask defect improving

- HVM fab savety (6S) control

- New employee orientation

Achievement

- N7+ production on EUV

- Reduce 25% mask defect

- The most safety department of 

   factory

Mechanical and Thermal design (Ability Enterprise)

Production

- Security camera

- Consumer camera

- Sport/wearing camera

Skill

- Mechanical design

- Thermal design and simulation

- CAD/CAM software

   PTC-creo/COMSOL/Solidworks

Customer

- Huawei

- Google

- Sony

- Fujifilm

Education

National Chiao Tung University, Master of mechanical engineering, 2012~2014

National Chung Cheng University, Bachelor of Mechanical engineering, 2008~2012

Work Experience

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY: Aug 2017 ~ Now

 EUV senior Equipment Engineer

ABILITY ENTERPRISE CO., LTD: Aug 2014 ~ Jul 2017

Mechanical and Thermal design Engineer

简历
个人档案
列印
Profile 03 00@2x

洪維澤 (Philip Hung)

Mail : [email protected] / Tel : +(886)-916-277-255
F., No. 28, Daye N. Rd., West Dist., Taichung City 403, Taiwan (R.O.C.)

My name is Philip. I have 3 years consumer production mechanical and thermal engineer experience. Was responsible for thermal design judgement and implement solution in early product stage. 
In addition, having 3 years experience as a semiconductor equipment engineer at TSMC strengthens my ability to adapt intense work environment. As a member of lithography process (EUV) department, solving issues for wafer manufacturing timely and precisely improves my professional and communicative skills.

Semiconductor Manufacture (TSMC)

Equipment

- ASML EUV 3400B/3400C

- Tool maintain

- Metrology tool setup

- Defect control

Project

- Join R&D EUV tooling development

- F15B wafer production(N7+)

- Mask defect improving

- HVM fab savety (6S) control

- New employee orientation

Achievement

- N7+ production on EUV

- Reduce 25% mask defect

- The most safety department of 

   factory

Mechanical and Thermal design (Ability Enterprise)

Production

- Security camera

- Consumer camera

- Sport/wearing camera

Skill

- Mechanical design

- Thermal design and simulation

- CAD/CAM software

   PTC-creo/COMSOL/Solidworks

Customer

- Huawei

- Google

- Sony

- Fujifilm

Education

National Chiao Tung University, Master of mechanical engineering, 2012~2014

National Chung Cheng University, Bachelor of Mechanical engineering, 2008~2012

Work Experience

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY: Aug 2017 ~ Now

 EUV senior Equipment Engineer

ABILITY ENTERPRISE CO., LTD: Aug 2014 ~ Jul 2017

Mechanical and Thermal design Engineer