CakeResume 找人才

進階搜尋
On
4 到 6 年
6 到 10 年
10 到 15 年
15 年以上
Avatar of 洪維澤.
離線
Avatar of 洪維澤.
離線
EUV Equipment Engineer @台灣積體電路製造股份有限公司
2017 ~ 現在
Mechanical / Thermal Engineer, Semiconductor Engineer
一年內
N7+) - Mask defect improving - HVM fab savety (6S) control - New employee orientation Achievement - N7+ production on EUV - Reduce 25% mask defect - The most safety department of factory Mechanical and Thermal design (Ability Enterprise) Production - Security camera - Consumer camera - Sport/wearing camera Skill - Mechanical design - Thermal design and simulation - CAD/CAM software PTC-creo/COMSOL/Solidworks Customer - Huawei - Google - Sony - Fujifilm Education National Chiao Tung University, Master of mechanical engineering, 2012~2014 National Chung Cheng University, Bachelor of Mechanical engineering, 2008~2012 Work Experience TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY: Aug 2017 ~ Now EUV senior Equipment Engineer
Auto CAD
COMSOL
CAD/CAM
全職
4 到 6 年
National Chiao Tung University
Master of Mechanical engineering

最輕量、快速的招募方案,數百家企業的選擇

搜尋履歷,主動聯繫求職者,提升招募效率。

  • 瀏覽所有搜尋結果
  • 每日可無限次數開啟陌生對話
  • 搜尋僅開放付費企業檢視的履歷
  • 檢視使用者信箱 & 電話
搜尋技巧
1
嘗試搜尋最精準的關鍵字組合
資深 後端 php laravel
如果結果不夠多,再逐一刪除較不重要的關鍵字
2
將須完全符合的字詞放在雙引號中
"社群行銷"
3
在不想搜尋到的字詞前面加上減號,如果想濾掉中文字,需搭配雙引號使用 (-"人資")
UI designer -UX
免費方案僅能搜尋公開履歷。
升級至進階方案,即可瀏覽所有搜尋結果(包含數萬筆覽僅在 CakeResume 平台上公開的履歷)。

職場能力評價定義

專業技能
該領域中具備哪些專業能力(例如熟悉 SEO 操作,且會使用相關工具)。
問題解決能力
能洞察、分析問題,並擬定方案有效解決問題。
變通能力
遇到突發事件能冷靜應對,並隨時調整專案、客戶、技術的相對優先序。
溝通能力
有效傳達個人想法,且願意傾聽他人意見並給予反饋。
時間管理能力
了解工作項目的優先順序,有效運用時間,準時完成工作內容。
團隊合作能力
具有向心力與團隊責任感,願意傾聽他人意見並主動溝通協調。
領導力
專注於團隊發展,有效引領團隊採取行動,達成共同目標。
一年內
EUV Equipment Engineer @ 台灣積體電路製造股份有限公司
台灣積體電路製造股份有限公司
2017 ~ 現在
Taichung, 台灣
專業背景
目前狀態
求職階段
專業
其他
產業
工作年資
4 到 6 年
管理經歷
技能
Auto CAD
COMSOL
CAD/CAM
Creo
語言能力
求職偏好
希望獲得的職位
Mechanical / Thermal Engineer, Semiconductor Engineer
預期工作模式
全職
期望的工作地點
遠端工作意願
接案服務
學歷
學校
National Chiao Tung University
主修科系
Master of Mechanical engineering
列印
Profile 03 00@2x

洪維澤 (Philip Hung)

Mail : [email protected] / Tel : +(886)-916-277-255
F., No. 28, Daye N. Rd., West Dist., Taichung City 403, Taiwan (R.O.C.)

My name is Philip. I have 3 years consumer production mechanical and thermal engineer experience. Was responsible for thermal design judgement and implement solution in early product stage. 
In addition, having 3 years experience as a semiconductor equipment engineer at TSMC strengthens my ability to adapt intense work environment. As a member of lithography process (EUV) department, solving issues for wafer manufacturing timely and precisely improves my professional and communicative skills.

Semiconductor Manufacture (TSMC)


Equipment

- ASML EUV 3400B/3400C

- Tool maintain

- Metrology tool setup

- Defect control


Project

- Join R&D EUV tooling development

- F15B wafer production(N7+)

- Mask defect improving

- HVM fab savety (6S) control

- New employee orientation


Achievement

- N7+ production on EUV

- Reduce 25% mask defect

- The most safety department of 

   factory

Mechanical and Thermal design (Ability Enterprise)


Production

- Security camera

- Consumer camera

- Sport/wearing camera


Skill

- Mechanical design

- Thermal design and simulation

- CAD/CAM software

   PTC-creo/COMSOL/Solidworks


Customer

- Huawei

- Google

- Sony

- Fujifilm

Education

National Chiao Tung University, Master of mechanical engineering, 2012~2014

National Chung Cheng University, Bachelor of Mechanical engineering, 2008~2012

Work Experience

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY: Aug 2017 ~ Now

 EUV senior Equipment Engineer

ABILITY ENTERPRISE CO., LTD: Aug 2014 ~ Jul 2017

Mechanical and Thermal design Engineer

履歷
個人檔案
Profile 03 00@2x

洪維澤 (Philip Hung)

Mail : [email protected] / Tel : +(886)-916-277-255
F., No. 28, Daye N. Rd., West Dist., Taichung City 403, Taiwan (R.O.C.)

My name is Philip. I have 3 years consumer production mechanical and thermal engineer experience. Was responsible for thermal design judgement and implement solution in early product stage. 
In addition, having 3 years experience as a semiconductor equipment engineer at TSMC strengthens my ability to adapt intense work environment. As a member of lithography process (EUV) department, solving issues for wafer manufacturing timely and precisely improves my professional and communicative skills.

Semiconductor Manufacture (TSMC)


Equipment

- ASML EUV 3400B/3400C

- Tool maintain

- Metrology tool setup

- Defect control


Project

- Join R&D EUV tooling development

- F15B wafer production(N7+)

- Mask defect improving

- HVM fab savety (6S) control

- New employee orientation


Achievement

- N7+ production on EUV

- Reduce 25% mask defect

- The most safety department of 

   factory

Mechanical and Thermal design (Ability Enterprise)


Production

- Security camera

- Consumer camera

- Sport/wearing camera


Skill

- Mechanical design

- Thermal design and simulation

- CAD/CAM software

   PTC-creo/COMSOL/Solidworks


Customer

- Huawei

- Google

- Sony

- Fujifilm

Education

National Chiao Tung University, Master of mechanical engineering, 2012~2014

National Chung Cheng University, Bachelor of Mechanical engineering, 2008~2012

Work Experience

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY: Aug 2017 ~ Now

 EUV senior Equipment Engineer

ABILITY ENTERPRISE CO., LTD: Aug 2014 ~ Jul 2017

Mechanical and Thermal design Engineer