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On
4-6 years
6-10 years
10-15 years
More than 15 years
Past
資深應用工程師 @添鴻科技股份有限公司2022 ~ 2024
・
半導體製程工程師,半導體製程整合工程師,半導體研發工程師
Within one month
Unemployed
・
Ready to interview
Full-time / Interested in working remotely
6-10 years
國立雲林科技大學 National Yunlin University of Science and Technology
・
材料科技研究所
Principal Engineer @Qisda corporation2023 ~ Present
・
Senior Mechanical Engineer
Within three months
. Material selection and build product BOM. Cost review and improvement. Mechanical parts design evaluation and testing. Plastic/metal tooling design and development. Analysis and solving issues under NPI stage. Thermal condition analysis and improvement. Discussion design and specification with customer directly. Lithography Equipment Engineer • TSMC NovMay 2014 Diagnosis and handle equipment issues. Equipment maintenance and modification. Education National Sun Yat-sen University M.S in Mechanical and Electro-Mechanical EngineeringNational Sun Yat-sen University B.S in Mechanical and Electro-Mechanical EngineeringProduct development experience Wireless presentation system
Employed
・
Open to opportunities
Full-time / Interested in working remotely
6-10 years
National Sun Yat-sen University
・
Mechanical and Electro-Mechanical EngineeringUnemployed
Full-time / Interested in working remotely
4-6 years
國立台灣大學
・
光電工程學研究所Engineering Technician @Cirrus Logic, Inc2017 ~ 2021
・
Engineering Technician
Within one year
Full-time / Interested in working remotely
4-6 years
Minghsin University of Science and Technology
・
Bachelor of Senior Citizen Service Management
Sr. Field Service Engineer @Nikon Precision Taiwan Ltd.2013 ~ Present
・
Within one year
陳健峰 John Chen Work over 8 years in the semiconductor area. Have expertise especially in DUV lithography systems. Hsinchu City, Taiwan 300 ˙ [email protected] ˙Work Experience Sr. Field Service Engineer • Nikon Precision Taiwan Ltd. OctoberPresent Primarily responsible for customer service with DUV lithography machine issues. Diagnosing and trouble shooting with any kinds of scanner issues. Modify machine and tune parameters to meet customer's request. Master in high order lens aberration adjustment. Implement first Nikon I14 stepper top/bottom lens replacement in Taiwan. Projection lens
Employed
Full-time / Interested in working remotely
6-10 years
國立清華大學 National Tsing Hua University
・
工程與系統科學系
Process Support Engineer (CVD) @Applied Materials2018 ~ Present
・
Process Engineer
Within two months
UMC as Etch process engineer for two years and 9 months and worked in Applied Materials as CVD process support engineer for three years and 7 months. When I worked in UMC, My job is to maintain and solve production issue, so I cooperate with other departments like integration, lithography, thin film and also diffusion very often. So it makes me know integration process flow very well. One of my process flow improvement achievement is increasing 5% of production capacity. When I worked in Applied Materials. My position changed from foundry customer to supplier.
Employed
Full-time / Interested in working remotely
6-10 years
國立台灣科技大學 National Taiwan University of Science and Technology
・
Science Electro-Optical Engineering
Offline
Offline
製程工程師 @Genesis Photonics2020 ~ Present
・
半導體製程工程師,半導體製程整合工程師,半導體研發工程師
More than one year
production capacity. Make a new part number and spec for custom product. Brightness verification for custom product with new process. Production planning. Custom Sorting & Binning Spec. Genesis Photonics , Process Engineer, Nov 2017 ~ March 2020 Process engineers, Process engineers, Responsible for process optimization and yield improvement Lithography Process Engineer Lithography Process Engineer Monitor the yield of reticle and products through AOI, to improve appearance yield of product. Making data analysis report of lithography process to optimize parameters to reduce the cost of rework. Collaborated with cross-department coworkers to develop stepper parameters for specific
Employed
Full-time / Interested in working remotely
4-6 years
崑山科技大學
・
光電工程
Project Manager @旺宏電子 (MXIC)2010 ~ 2022
・
Process Engineer
Within six months
張景順 (Peter CHANG) Photo Process Development Dept. From 2005 to today, 16 years have been engaged in the industry related to the memory lithography process, from the production line machine program editing to the mask layout design, new material development/process optimization to new product planning/development, has accumulated a considerable amount of Lithography process experience. Hsinchu, Hsinchu City, Taiwan 工作經歷 Project Manager • 旺宏電子 (MXIC) 1). Development of process scaling conditions and abnormal resolution NOR Flash: 110/ 75/ 55 nm NAND Flash: 36 /19
Employed
Full-time / Not interested in working remotely
More than 15 years
國立中山大學 National Sun Yat-Sen University
・
化學
設備工程師 @台灣積體電路製造股份有限公司2018 ~ 2020
・
Within one year
to contribute my skills and knowledge in a fast-paced and challenging environment. New Taipei City, Taiwan [email protected] ☎YiChao Chang Skills Equipment maintenance Equipment troubleshooting wafer equipment Stress management Language Chinese Native English Medium Working experience Equipment Engineer Taiwan Semiconductor Manufacturing Co., Ltd. Lithography engineering department, scanner section JulJulLithography engineering department, track and development section SepJunTroubleshoot issues,and execute routine maintenance of equipment, including TEL CLEAN TRACK ACT & ASML DUV series Minimize certain specific wafer defects during coating photoresist by spotting machines which are easier to generate defects, and then improving them with
Full-time / Not interested in working remotely
4-6 years
國立成功大學
・
電機工程學系
Metrology Engineer (OCD) @Taiwan Semiconductor Manufacturing Company(TSMC)2018 ~ Present
・
Metrology Engineer
More than one year
analysis , Sense-array .etc) •N7 wafer container quality owner (Foup dimension/Inspection/AMC Gas analyzer) Mask & Metrology Engineering • Taiwan Semiconductor Manufacturing Company(TSMC) 十一月九月 2018 •N28 Critical Dimension Electron Microscope (CD-SEM) metrology sponsor. •LIT defect scanner (Viper/OM) sponsor for lithography-related defect monitor. •Thermal-wave (OP) sponsor for lithography photo-resist thickness defense. •2nd version Mask qualified by handling experiment lot pi-run CD/KLA scan & WAT analysis . 學歷National Chiao Tung University Master's degree in Display InstituteNational Chiao Tung University Bachelor's
Full-time / Interested in working remotely
6-10 years
National Chiao Tung University
・
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Adaptability
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Professional Background
Current status
Employed
Job Search Progress
Professions
Process Engineer
Fields of Employment
Semiconductor
Work experience
4-6 years
Management
None
Skills
Languages
English
・
Intermediate
Job search preferences
Positions
半導體製程工程師,半導體製程整合工程師,半導體研發工程師
Job types
Full-time
Locations
台灣台南, 台灣高雄, 台灣新竹
Remote
Interested in working remotely
Freelance
No
Educations
School
崑山科技大學
Major
光電工程
Wun-Shan Jhou
Passionate about the optoelectronics semiconductor industry & enthusiast of automotive
Tainan City，TW
0988-157-922
Education
Kun Shan University, Master's degree,
Graduate School of Electro-Optical Engineering, 2014 ~ 2016
Graduating in the honor of the top-rated prize.(14.29%)
Kun Shan University, Bachelors' degree
Department of Electro-Optical Engineering, 2010 ~ 2014
Graduating in the honor of the third best grading prize.(5.88%)
Work Experience
Genesis Photonics, Process Engineer, Dec 2020 ~ Now
Process engineers, Responsible for process optimization and yield improvement
Lithography Process Engineer
- mini LED photolithography technology
- Evaluation of introduction of photoresist
- Batch verification (STR、TECN、ECN)
- Verification of WAT Yield and chip profile
- Set new part number of photoresist
- Monitor the yield of mask and products through AOI, to improve appearance yield of product.
- Photolithography process troubleshooting
- Accuracy <0.5 µm by mask aligner DirectAlign® mode
- new employee orientation
2. Improve of WAT yield
- Check the probe wafer map
- Analyze data Log and find root cause
EPISTAR, R&D, April 2020 ~ October 2020
- Mini LED project
- New Product Introduction and managing the transition to mass production.
- Sample presentation to meet customer require.
- Cross-functional communication.
- Set new parameters with engineering department.
- The manufacturing department assists in improving production capacity.
- Make a new part number and spec for custom product.
- Brightness verification for custom product with new process.
- Production planning.
- Custom Sorting & Binning Spec.
Genesis Photonics, Process Engineer, Nov 2017 ~ March 2020
Process engineers, Process engineers, Responsible for process optimization and yield improvement
Lithography Process Engineer
- Lithography Process Engineer
- Monitor the yield of reticle and products through AOI, to improve appearance yield of product.
- Making data analysis report of lithography process to optimize parameters to reduce the cost of rework.
- Collaborated with cross-department coworkers to develop stepper parameters for specific products.
- Reduce the amount of photoresist for operation up to 40% without affecting process stability, reducing cost of photoresist material effectively.
NEW IDEAS opto-Electronics, Operator, Jun 2014 ~ Sep 2014
Assembling LED lighting modules and reliability testing
Coretronic, Quality Control Operator, Jun 2013 ~ Sep 2013
Detection of LED TVs
Experience
Teaching Assistant, Sep 2012 ~ Jun 2015
Participated in the "Rewarding university teaching excellence programs", which implemented by the Ministry of Education Republic of China (Taiwan), as a teaching assistant and has been awarded the "Golden Award" for many times during college and Graduate school.
Universal Motorcycle Daytime Running Lamp - Picture 1 & Picture 2 & Video, 2014
Research confirms that the using of daytime running lights (DRL) can significantly reduce car accidents and improve driving safety. This project participates in the industry-university cooperation plan, design specifications in accordance with traffic laws, and participate in the "LED lamp development trend and design and technology introduction of thermal modules" of the Industrial Technology Research Institute. The final product running smoothly.
Special competition of research project of Department of Electro-Optical Engineering, Kun Shan University, 6th place
Papers
Analysis of LED heat dissipation technology and research with ceramic substrate manufacturers and lighting manufacturers, as follows:
Thermal Analysis of Multichip COB LED with Different Color Temperature, Nov 2015
Posted on International Electron Devices & Materials Symposium, Nov 2015
Through the previous motorcycle DRL project, follow-up research the dual color temperature of the automotive headlights, and participate in the OSRAM TAIWAN SSL Customer Day and OSRAM LED automotive lighting technology seminar to understand the development obstacle of Industry.
Due to headlights with high color temperature provides high visibility at night, and headlights with low color temperature can increase driving safety in rainy days and fog, and the automotive LED has a heat issue, I decided to study this project.
Both results of experiment and simulation are matched, and the maximum surface temperature of the packaged LEDs operated at 7 W and 12 W is decreased as the CCT is increased. The conversion efficiency of phosphor for the packaged LEDs with the CCT 5700K is higher than that of 3000K. This model can provide guidance in thermal analysis of LED producer to design different CCT and input power of LEDs.
Effect of Ceramic Substrate Thickness in LED Module on Thermal Characteristic, Mar 2016
Evaluating the effect of changing the thickness of alumina ceramic substrate on the thermal characteristics of LED modules through the development of the Comsol application, ceramic substrate suppliers can simplify the time and labor costs of thermal analysis of LED modules with this module.
When the thickness of the ceramic substrate is reduced, the surface temperature of the COB LED module is lowered. Because the thermal resistance of the ceramic substrate is reduced, the heat transfer path is shortened, and the heat generated by the LED can be quickly transferred to the heat sink, so that it has better thermal characteristics.
Geometric Design APP of Heat Sink, May 2016
High-power LED module heat dissipation has become a significant feature. By developing a heat sink geometry design APP to explore the effect of changing the geometry of the heat sink on the heat dissipation characteristics, the heat sink manufacturer can also use this application to significantly shorten the time and labor cost of thermal analysis.
Posted on Conference on innovation and technology in electronics, signal and communication, May 2016
Skills & License
Software
COMSOL Multiphysics、Microsoft Excel、Word、PowerPoint、Visio、SketchUp、OriginLab、Google Drive
Skill
Improve LED Process Stability, LED Material Evaluation, LED Reliability Verification, LED Thermal Characteristics Analysis, Process Cost Control, Fault AnalysisLanguage
Chinese ★★★★★
English ★★★☆☆
LED License
Professional LED Engineer-Entry Level (L-B-463-2013)
Electrical License
Industrial Wiring-Class C
(013-073643)Commercial Wiring-Class C
(007-102956)
Computer Software Application-Class C
(118-618008)
Language License
GENERAL ENGLISH PROFICIENCY TEST-Elementary (E381803)Wun-Shan Jhou
Passionate about the optoelectronics semiconductor industry & enthusiast of automotive
Tainan City，TW
0988-157-922
Education
Kun Shan University, Master's degree,
Graduate School of Electro-Optical Engineering, 2014 ~ 2016
Graduating in the honor of the top-rated prize.(14.29%)
Kun Shan University, Bachelors' degree
Department of Electro-Optical Engineering, 2010 ~ 2014
Graduating in the honor of the third best grading prize.(5.88%)
Work Experience
Genesis Photonics, Process Engineer, Dec 2020 ~ Now
Process engineers, Responsible for process optimization and yield improvement
Lithography Process Engineer
- mini LED photolithography technology
- Evaluation of introduction of photoresist
- Batch verification (STR、TECN、ECN)
- Verification of WAT Yield and chip profile
- Set new part number of photoresist
- Monitor the yield of mask and products through AOI, to improve appearance yield of product.
- Photolithography process troubleshooting
- Accuracy <0.5 µm by mask aligner DirectAlign® mode
- new employee orientation
2. Improve of WAT yield
- Check the probe wafer map
- Analyze data Log and find root cause
EPISTAR, R&D, April 2020 ~ October 2020
- Mini LED project
- New Product Introduction and managing the transition to mass production.
- Sample presentation to meet customer require.
- Cross-functional communication.
- Set new parameters with engineering department.
- The manufacturing department assists in improving production capacity.
- Make a new part number and spec for custom product.
- Brightness verification for custom product with new process.
- Production planning.
- Custom Sorting & Binning Spec.
Genesis Photonics, Process Engineer, Nov 2017 ~ March 2020
Process engineers, Process engineers, Responsible for process optimization and yield improvement
Lithography Process Engineer
- Lithography Process Engineer
- Monitor the yield of reticle and products through AOI, to improve appearance yield of product.
- Making data analysis report of lithography process to optimize parameters to reduce the cost of rework.
- Collaborated with cross-department coworkers to develop stepper parameters for specific products.
- Reduce the amount of photoresist for operation up to 40% without affecting process stability, reducing cost of photoresist material effectively.
NEW IDEAS opto-Electronics, Operator, Jun 2014 ~ Sep 2014
Assembling LED lighting modules and reliability testing
Coretronic, Quality Control Operator, Jun 2013 ~ Sep 2013
Detection of LED TVs
Experience
Teaching Assistant, Sep 2012 ~ Jun 2015
Participated in the "Rewarding university teaching excellence programs", which implemented by the Ministry of Education Republic of China (Taiwan), as a teaching assistant and has been awarded the "Golden Award" for many times during college and Graduate school.
Universal Motorcycle Daytime Running Lamp - Picture 1 & Picture 2 & Video, 2014
Research confirms that the using of daytime running lights (DRL) can significantly reduce car accidents and improve driving safety. This project participates in the industry-university cooperation plan, design specifications in accordance with traffic laws, and participate in the "LED lamp development trend and design and technology introduction of thermal modules" of the Industrial Technology Research Institute. The final product running smoothly.
Special competition of research project of Department of Electro-Optical Engineering, Kun Shan University, 6th place
Papers
Analysis of LED heat dissipation technology and research with ceramic substrate manufacturers and lighting manufacturers, as follows:
Thermal Analysis of Multichip COB LED with Different Color Temperature, Nov 2015
Posted on International Electron Devices & Materials Symposium, Nov 2015
Through the previous motorcycle DRL project, follow-up research the dual color temperature of the automotive headlights, and participate in the OSRAM TAIWAN SSL Customer Day and OSRAM LED automotive lighting technology seminar to understand the development obstacle of Industry.
Due to headlights with high color temperature provides high visibility at night, and headlights with low color temperature can increase driving safety in rainy days and fog, and the automotive LED has a heat issue, I decided to study this project.
Both results of experiment and simulation are matched, and the maximum surface temperature of the packaged LEDs operated at 7 W and 12 W is decreased as the CCT is increased. The conversion efficiency of phosphor for the packaged LEDs with the CCT 5700K is higher than that of 3000K. This model can provide guidance in thermal analysis of LED producer to design different CCT and input power of LEDs.
Effect of Ceramic Substrate Thickness in LED Module on Thermal Characteristic, Mar 2016
Evaluating the effect of changing the thickness of alumina ceramic substrate on the thermal characteristics of LED modules through the development of the Comsol application, ceramic substrate suppliers can simplify the time and labor costs of thermal analysis of LED modules with this module.
When the thickness of the ceramic substrate is reduced, the surface temperature of the COB LED module is lowered. Because the thermal resistance of the ceramic substrate is reduced, the heat transfer path is shortened, and the heat generated by the LED can be quickly transferred to the heat sink, so that it has better thermal characteristics.
Geometric Design APP of Heat Sink, May 2016
High-power LED module heat dissipation has become a significant feature. By developing a heat sink geometry design APP to explore the effect of changing the geometry of the heat sink on the heat dissipation characteristics, the heat sink manufacturer can also use this application to significantly shorten the time and labor cost of thermal analysis.
Posted on Conference on innovation and technology in electronics, signal and communication, May 2016
Skills & License
Software
COMSOL Multiphysics、Microsoft Excel、Word、PowerPoint、Visio、SketchUp、OriginLab、Google Drive
Skill
Improve LED Process Stability, LED Material Evaluation, LED Reliability Verification, LED Thermal Characteristics Analysis, Process Cost Control, Fault AnalysisLanguage
Chinese ★★★★★
English ★★★☆☆
LED License
Professional LED Engineer-Entry Level (L-B-463-2013)
Electrical License
Industrial Wiring-Class C
(013-073643)Commercial Wiring-Class C
(007-102956)
Computer Software Application-Class C
(118-618008)