CakeResume 找人才
最輕量、快速的招募方案，數百家企業的選擇
搜尋履歷，主動聯繫求職者，提升招募效率。
- 瀏覽所有搜尋結果
- 每日可無限次數開啟陌生對話
- 搜尋僅開放付費企業檢視的履歷
- 檢視使用者信箱 & 電話
職場能力評價定義
Mike Chen
Program Manger
Become the best version of me, share with the team and the people around me all that I can contribute
Learn from mistakes and never give up
Work Experience
External Manufacturing Program Manager • ONsemiconductors, Taipei, Taiwan
February 2018 - Present
Lead IC front-end for Wafer Level Chip Scale Package and Through Silicon Via program operation management.
• Leads foundries, assembly and test facilities related to new product development, product operations, product quality, delivery and procurement activities.
• New product development execution.
• New product introduction to mass production process control (stability) and best practice cross fertilization management
• Drive post-production yield improvements and quality issues, lead continuous improvement programs to achieve outstanding yield and quality performance.
• Lead supplier contingency planning and crisis management activities programs.
• Supplier quarterly business review management and related activities execution.
• Cooperate with the planner, monitoring and execution of production capacity and scheduling.
• Collaborate with procurement to lead and develop multi-year ODM procurement strategies based on business and market intelligence. Lead supplier procurement, selection and performance management.
• Cooperate with quality control, customer complaint response and poor quality improvement implementation.
• Successfully qualified new supplier in Mainland China – 20 percent cost saving
• Quick classification to solve a large number of chipping problems – scrap$saving 100M in 2021
• FTA tool analysis, effectively reducing the time liness of CIS FA analysis – scrap$saving 300M in 2021
Regional Supplier Technical/QA Program Manager • STMicroelectronics , Taipei, Taiwan
May 2014 - January 2018
Directed the daily operations of one full-time engineer, Directed all aspects of regional assembly house operation projects, from technical to high volume manufacturing for WLCSP/Ball Grid Array(BGA)/Lead frame (LF)
•Leads assembly and test facilities related to new product development, product operations, product quality, delivery and procurement activities.
• New product development execution.
• New product introduction to mass production process control (stability) and best practice cross fertilization management
• Drive post-production yield improvements and quality issues, lead continuous improvement programs to achieve outstanding yield and quality performance.
• Lead supplier contingency planning and crisis management activities programs.
• Supplier quarterly business review management and related activities execution.
• Lead quality control, customer complaint response, regular audit and quality improvement implementation.
• Use material knowledge to resolve line-down issues
• IATF/VDA solid training to solve EOS problems of automotive customers
Assistant External Manufacturing Program Manager • Realtek Semiconductor Corp., Hsin-Chu, Taiwan
May 2012 - May 2014
engineers directing the daily operations of two full-time engineers. They provide management for supplier chain technical and quality program management, including the foundry, assembly, testing and module house of IC. Support manufacturing planning performance management. Ensures all sub-con processes are in accordance with company standards and all relevant regulations.
Analyzed current processes before determining the most effective strategies which would ultimately result in cost reductions for the company while assessing yield enhancement and reliability stressing.
• TV production line, new product development execution, IC pad layout design.
• TV production line relevant new product introduction to mass production process control (stability) and best practice cross fertilization management.
• Cost saving of 50M US dollars by developing Cu wire to replace gold wire.
IC Package Product Design Assistant Program Manage • Power Technology Assembly house, Inc.
October 2007 - May 2012
Directed the daily operations of six full-time employees while establishing long-term goals. Facilitated the IC package and SMT process by surveying, selecting, and designing mechanical structures. Performed supplier chain management functions, including tasks involving assembly materials, Program management, the BOM, NPI ramp up, quality resolving and customer complaint.
• New product development execution, including BOM select.
• New product introduction to mass production process control (stability) and best practice cross fertilization management.
• Lead all IC assembly, SMT activities projects, including BGA/LGA/TSV/LF IC packaging.
• Sent to Japan for half a year to learn Cu-pillar bump production and factory planning.
•Assisted the company to build an 8" 12" Cu pillar bump production line, with a current monthly production capacity of 10K wafers.
Senior Engineer – Product Support (Research and Development Substitute Military Services) • Industrial Technology Research Institute, Hsin Chu, Taiwan
October 2003 - October 2007
Directed the daily operations of one full-time engineer, performed in-depth surveys of Driver IC assembly mechanical structures and materials before selecting the appropriate candidates to move forward with mass production. Spec. define and new program consultant with IC assembly, test and module house.
Performed in-depth surveys and development of polymer particle for core-shell structure, which is particularly suitable for biomedical applications such as MRI (magnetic resonance imaging) development, specific tissue identification development, and magnetic thermal therapy.
• New Technology Development of Electrode Bumps
• Performed semiconductor polymer materials feasibility studies prior to selection
• Awarded two patents for metallization polymer particle for MRI applications.
• Awarded with the ITRI Excellence Research for a NCF-type Compliant-bump COG in a real display panel.
• display panel ITRI transfers technology to related IC factories at 3M
Education
2008 - 2017
National Chiao Tung University
Material Science and Engineering Ph.D.
2001 - 2003
國立中正大學(National Chung Cheng University)
Chemical Engineering
Licenses & Certifications
IATF 3rd part Audit Certification
IATF
4-ADP-21-10-2505
Issued October 2018 · No Expiration Date
Skills
User Experience
- Project Management
- Communication
- Problem Solving
- Team Work
- Time Management
Strength
- Integrity
- Reliable
- Logical
- Strategic
- Hard-Working
Language
- Chinese
- English
Mike Chen
Program Manger
Become the best version of me, share with the team and the people around me all that I can contribute
Learn from mistakes and never give up
Work Experience
External Manufacturing Program Manager • ONsemiconductors, Taipei, Taiwan
February 2018 - Present
Lead IC front-end for Wafer Level Chip Scale Package and Through Silicon Via program operation management.
• Leads foundries, assembly and test facilities related to new product development, product operations, product quality, delivery and procurement activities.
• New product development execution.
• New product introduction to mass production process control (stability) and best practice cross fertilization management
• Drive post-production yield improvements and quality issues, lead continuous improvement programs to achieve outstanding yield and quality performance.
• Lead supplier contingency planning and crisis management activities programs.
• Supplier quarterly business review management and related activities execution.
• Cooperate with the planner, monitoring and execution of production capacity and scheduling.
• Collaborate with procurement to lead and develop multi-year ODM procurement strategies based on business and market intelligence. Lead supplier procurement, selection and performance management.
• Cooperate with quality control, customer complaint response and poor quality improvement implementation.
• Successfully qualified new supplier in Mainland China – 20 percent cost saving
• Quick classification to solve a large number of chipping problems – scrap$saving 100M in 2021
• FTA tool analysis, effectively reducing the time liness of CIS FA analysis – scrap$saving 300M in 2021
Regional Supplier Technical/QA Program Manager • STMicroelectronics , Taipei, Taiwan
May 2014 - January 2018
Directed the daily operations of one full-time engineer, Directed all aspects of regional assembly house operation projects, from technical to high volume manufacturing for WLCSP/Ball Grid Array(BGA)/Lead frame (LF)
•Leads assembly and test facilities related to new product development, product operations, product quality, delivery and procurement activities.
• New product development execution.
• New product introduction to mass production process control (stability) and best practice cross fertilization management
• Drive post-production yield improvements and quality issues, lead continuous improvement programs to achieve outstanding yield and quality performance.
• Lead supplier contingency planning and crisis management activities programs.
• Supplier quarterly business review management and related activities execution.
• Lead quality control, customer complaint response, regular audit and quality improvement implementation.
• Use material knowledge to resolve line-down issues
• IATF/VDA solid training to solve EOS problems of automotive customers
Assistant External Manufacturing Program Manager • Realtek Semiconductor Corp., Hsin-Chu, Taiwan
May 2012 - May 2014
engineers directing the daily operations of two full-time engineers. They provide management for supplier chain technical and quality program management, including the foundry, assembly, testing and module house of IC. Support manufacturing planning performance management. Ensures all sub-con processes are in accordance with company standards and all relevant regulations.
Analyzed current processes before determining the most effective strategies which would ultimately result in cost reductions for the company while assessing yield enhancement and reliability stressing.
• TV production line, new product development execution, IC pad layout design.
• TV production line relevant new product introduction to mass production process control (stability) and best practice cross fertilization management.
• Cost saving of 50M US dollars by developing Cu wire to replace gold wire.
IC Package Product Design Assistant Program Manage • Power Technology Assembly house, Inc.
October 2007 - May 2012
Directed the daily operations of six full-time employees while establishing long-term goals. Facilitated the IC package and SMT process by surveying, selecting, and designing mechanical structures. Performed supplier chain management functions, including tasks involving assembly materials, Program management, the BOM, NPI ramp up, quality resolving and customer complaint.
• New product development execution, including BOM select.
• New product introduction to mass production process control (stability) and best practice cross fertilization management.
• Lead all IC assembly, SMT activities projects, including BGA/LGA/TSV/LF IC packaging.
• Sent to Japan for half a year to learn Cu-pillar bump production and factory planning.
•Assisted the company to build an 8" 12" Cu pillar bump production line, with a current monthly production capacity of 10K wafers.
Senior Engineer – Product Support (Research and Development Substitute Military Services) • Industrial Technology Research Institute, Hsin Chu, Taiwan
October 2003 - October 2007
Directed the daily operations of one full-time engineer, performed in-depth surveys of Driver IC assembly mechanical structures and materials before selecting the appropriate candidates to move forward with mass production. Spec. define and new program consultant with IC assembly, test and module house.
Performed in-depth surveys and development of polymer particle for core-shell structure, which is particularly suitable for biomedical applications such as MRI (magnetic resonance imaging) development, specific tissue identification development, and magnetic thermal therapy.
• New Technology Development of Electrode Bumps
• Performed semiconductor polymer materials feasibility studies prior to selection
• Awarded two patents for metallization polymer particle for MRI applications.
• Awarded with the ITRI Excellence Research for a NCF-type Compliant-bump COG in a real display panel.
• display panel ITRI transfers technology to related IC factories at 3M
Education
2008 - 2017
National Chiao Tung University
Material Science and Engineering Ph.D.
2001 - 2003
國立中正大學(National Chung Cheng University)
Chemical Engineering
Licenses & Certifications
IATF 3rd part Audit Certification
IATF
4-ADP-21-10-2505
Issued October 2018 · No Expiration Date
Skills
User Experience
- Project Management
- Communication
- Problem Solving
- Team Work
- Time Management
Strength
- Integrity
- Reliable
- Logical
- Strategic
- Hard-Working
Language
- Chinese
- English