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National Taiwan University
Avatar of shih-heng sun.
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Process Integration Engineer @TSMC Fab12B
2019 ~ 2021
Yield Improvement Engineer
Lebih dari satu tahun
huge leap for TSMC advanced IC fabrication in process integration and yield improvement. Enthusiastic about semiconductor product development and design which can change people's lives. Work Experiences Yield Improvement Engineer • TSMC Fab12B AugustDecember 2020 Expert in most advanced Logic IC process (5nm~10nm) and familiar with advanced measuring instruments such as SEM, E-beam and Bright/Dark Field Inspection Tool. Specialized in detecting defects to improve yield. Collaborated with EE & PE to refine logic IC manufacturing procedure and lower production cost. Process Integration Engineer • TSMC Fab12B / TSMC R&D MayDecember 2019 /
Communicating
Measuring Instruments
Semiconductor Process
Tidak bekerja
Full-time / Tertarik bekerja jarak jauh
4-6 tahun
National Taiwan University
M.S. Photonics and Optoelectronics

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Lebih dari satu tahun
Yield Improvement Engineer
TSMC Fab12B
2019 ~ 2021
Latar Belakang Profesional
Status sekarang
Tidak bekerja
Tahap pencarian kerja
Profesi
Electrical Engineer, Product Engineer
Bidang Pekerjaan
Elektronik Konsumen
Pengalaman Kerja
4-6 tahun
Management
Tidak ada
Keterampilan
Communicating
Measuring Instruments
Semiconductor Process
Property Analysis
Field Inspection
Data Analysis
Word
PowerPoint
Excel
Bahasa
English
Fasih
Chinese
Bahasa ibu atau Bilingual
Preferensi Pencarian Pekerjaan
Jabatan
Yield Improvement Engineer
Tipe Pekerjaan
Full-time
Lokasi
Taipei, 台灣, Zhubei, Zhubei City, Hsinchu County, Taiwan
Bekerja jarak jauh
Tertarik bekerja jarak jauh
Freelance
Tidak
Pendidikan
Institusi Pendidikan
National Taiwan University
Jurusan
M.S. Photonics and Optoelectronics
Cetak

Shih Heng Sun

Semiconductor Process Integration Engineer with 5+ years of experience.

TSMC PIE specializing in advanced technology semiconductor products (3nm~10nm). Well-versed in yield improvement of semiconductor manufacturing process, Logic IC yield analysis, and collaborating with production line to solve problems. Making a huge leap for TSMC advanced IC fabrication in process integration and yield improvement. Enthusiastic about semiconductor product development and design which can change people's lives.

    

Work Experiences

Yield Improvement Engineer  •  TSMC Fab12B

August 2016 - December 2020

Expert in most advanced Logic IC process (5nm~10nm) and familiar with advanced measuring instruments such as SEM, E-beam and Bright/Dark Field Inspection Tool.
Specialized in detecting defects to improve yield.
Collaborated with EE & PE to refine logic IC manufacturing procedure and lower production cost.

Process Integration Engineer  •  TSMC Fab12B / TSMC R&D

May 2019 - December 2019 / January 2021 - December 2021 

Proficient in analyzing the relationship between chip electrical properties and process problems.
Specialized in using electrical data analysis (3nm~5nm) to improve Logic IC performance
Experienced in hitherto the most advanced semiconductor process (3nm).

Education

2013/09 - 2016/07

National Taiwan University

M.S. Photonics and Optoelectronics

2006/09 - 2010/06

National Taiwan University

B.S. Physics

Graduate Research

Enhancement of Emission Efficiency of Deep-ultraviolet AlGaN Quantum Wells through Surface Plasmon Coupling with an Al Protrusion Array

Skills


  • Semiconductor electrical property analysis
  • Advanced metrology tools (SEM, DB/DD and E-beam)
  • Excellent in problem-solving
  • Capable of both working on teams and individual
  • Influential communicating and reporting skills

Languages


  • English — Fluent
  • Chinese — Native
CV
Profil

Shih Heng Sun

Semiconductor Process Integration Engineer with 5+ years of experience.

TSMC PIE specializing in advanced technology semiconductor products (3nm~10nm). Well-versed in yield improvement of semiconductor manufacturing process, Logic IC yield analysis, and collaborating with production line to solve problems. Making a huge leap for TSMC advanced IC fabrication in process integration and yield improvement. Enthusiastic about semiconductor product development and design which can change people's lives.

    

Work Experiences

Yield Improvement Engineer  •  TSMC Fab12B

August 2016 - December 2020

Expert in most advanced Logic IC process (5nm~10nm) and familiar with advanced measuring instruments such as SEM, E-beam and Bright/Dark Field Inspection Tool.
Specialized in detecting defects to improve yield.
Collaborated with EE & PE to refine logic IC manufacturing procedure and lower production cost.

Process Integration Engineer  •  TSMC Fab12B / TSMC R&D

May 2019 - December 2019 / January 2021 - December 2021 

Proficient in analyzing the relationship between chip electrical properties and process problems.
Specialized in using electrical data analysis (3nm~5nm) to improve Logic IC performance
Experienced in hitherto the most advanced semiconductor process (3nm).

Education

2013/09 - 2016/07

National Taiwan University

M.S. Photonics and Optoelectronics

2006/09 - 2010/06

National Taiwan University

B.S. Physics

Graduate Research

Enhancement of Emission Efficiency of Deep-ultraviolet AlGaN Quantum Wells through Surface Plasmon Coupling with an Al Protrusion Array

Skills


  • Semiconductor electrical property analysis
  • Advanced metrology tools (SEM, DB/DD and E-beam)
  • Excellent in problem-solving
  • Capable of both working on teams and individual
  • Influential communicating and reporting skills

Languages


  • English — Fluent
  • Chinese — Native