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National Taiwan University
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Past
Process Integration Engineer @TSMC Fab12B
2019 ~ 2021
Yield Improvement Engineer
Lebih dari satu tahun
Communicating
Measuring Instruments
Semiconductor Process
Tidak bekerja
Full-time / Tertarik bekerja jarak jauh
4-6 tahun
National Taiwan University
M.S. Photonics and Optoelectronics
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iOS Developer @CMoney全曜財經資訊股份有限公司
2019 ~ Sekarang
Senior iOS Developer
Dalam satu bulan
Quiz - https://itunes.apple.com/tw/app/idExperienced with App deployment procedure on App Store. Experienced with Git/Github version control. Had experience of Scrum developing procedure Toshiba, Out sourcing project manager, Nov 2013 ~ Apr 2017 Focusing on back-end process of semiconductor of memory (SSD). Constructed Business Intelligence (BI) system to all out sourcing resource. Introduced BI tool (Spotfire) to weekly, monthly report of all out sourcing resource. Managing schedule and monitoring out-sourcing items process. Monitoring shipment situation of out-sourcing sites. Showa
IOS
Objective-C/Swift
SwiftUI
Reputation Credits2
Sudah bekerja
Tidak terbuka untuk peluang
Full-time / Tertarik bekerja jarak jauh
6-10 tahun
National Taiwan University
Material Science
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Past
AI Project Coordinator @TSMC
2020 ~ Sekarang
雲端工程師,雲端架構師
Lebih dari satu tahun
experiencing various cultures is my favourite after work. Graduate Student at the University of Auckland Hsinchu,TW [email protected] Work Experience AI Project Coordinator,, 1 year, 6 months Taiwan Semiconductor Manufacturing Company @ Machine-learning-based DoE (D esign o f E xperiments ) Consult 10+ process recipe tuning projects in advanced technology (N3, N2, N1.4) Build up a machine-learning adoption framework to assist used OFAT to MFAT tuning. Data Scientist, 8 years 3 months Taiwan Semiconductor Manufacturing Company @ Ma chine Learning Solution Development Using OpenCV(C#), ImageJ (Java) and
Word
Google Drive
Excel
Tidak bekerja
Full-time / Tertarik bekerja jarak jauh
6-10 tahun
National Taiwan University
Industrial Engineering
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Project leader engineer(主任工程師) @TSMC
2014 ~ Sekarang
Optical engineer, Semiconductor engineer
Dalam tiga bulan
OPC
Data Science
Python
Sudah bekerja
Full-time / Tertarik bekerja jarak jauh
6-10 tahun
National Taiwan University
Photonics and optoelectronic
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CTO @KryptoGO Co., Ltd.
2021 ~ Sekarang
AI Software Engineer,Deep learning Engineer
Dalam satu tahun
Algorithm
ASP.NET
Machine Learning
Sudah bekerja
Tidak terbuka untuk peluang
Full-time / Tertarik bekerja jarak jauh
6-10 tahun
National Taiwan University
Computer Science and Information Engineering

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Lebih dari satu tahun
Yield Improvement Engineer
TSMC Fab12B
2019 ~ 2021
Latar Belakang Profesional
Status sekarang
Tidak bekerja
Tahap pencarian kerja
Profesi
Electrical Engineer, Product Engineer
Bidang Pekerjaan
Elektronik Konsumen
Pengalaman Kerja
4-6 tahun
Management
Tidak ada
Keterampilan
Communicating
Measuring Instruments
Semiconductor Process
Property Analysis
Field Inspection
Data Analysis
Word
PowerPoint
Excel
Bahasa
English
Fasih
Chinese
Bahasa ibu atau Bilingual
Preferensi Pencarian Pekerjaan
Jabatan
Yield Improvement Engineer
Tipe Pekerjaan
Full-time
Lokasi
Taipei, 台灣, Zhubei, Zhubei City, Hsinchu County, Taiwan
Bekerja jarak jauh
Tertarik bekerja jarak jauh
Freelance
Tidak
Pendidikan
Institusi Pendidikan
National Taiwan University
Jurusan
M.S. Photonics and Optoelectronics
Cetak

Shih Heng Sun

Semiconductor Process Integration Engineer with 5+ years of experience.

TSMC PIE specializing in advanced technology semiconductor products (3nm~10nm). Well-versed in yield improvement of semiconductor manufacturing process, Logic IC yield analysis, and collaborating with production line to solve problems. Making a huge leap for TSMC advanced IC fabrication in process integration and yield improvement. Enthusiastic about semiconductor product development and design which can change people's lives.

    

Work Experiences

Yield Improvement Engineer  •  TSMC Fab12B

August 2016 - December 2020

Expert in most advanced Logic IC process (5nm~10nm) and familiar with advanced measuring instruments such as SEM, E-beam and Bright/Dark Field Inspection Tool.
Specialized in detecting defects to improve yield.
Collaborated with EE & PE to refine logic IC manufacturing procedure and lower production cost.

Process Integration Engineer  •  TSMC Fab12B / TSMC R&D

May 2019 - December 2019 / January 2021 - December 2021 

Proficient in analyzing the relationship between chip electrical properties and process problems.
Specialized in using electrical data analysis (3nm~5nm) to improve Logic IC performance
Experienced in hitherto the most advanced semiconductor process (3nm).

Education

2013/09 - 2016/07

National Taiwan University

M.S. Photonics and Optoelectronics

2006/09 - 2010/06

National Taiwan University

B.S. Physics

Graduate Research

Enhancement of Emission Efficiency of Deep-ultraviolet AlGaN Quantum Wells through Surface Plasmon Coupling with an Al Protrusion Array

Skills


  • Semiconductor electrical property analysis
  • Advanced metrology tools (SEM, DB/DD and E-beam)
  • Excellent in problem-solving
  • Capable of both working on teams and individual
  • Influential communicating and reporting skills

Languages


  • English — Fluent
  • Chinese — Native
CV
Profil

Shih Heng Sun

Semiconductor Process Integration Engineer with 5+ years of experience.

TSMC PIE specializing in advanced technology semiconductor products (3nm~10nm). Well-versed in yield improvement of semiconductor manufacturing process, Logic IC yield analysis, and collaborating with production line to solve problems. Making a huge leap for TSMC advanced IC fabrication in process integration and yield improvement. Enthusiastic about semiconductor product development and design which can change people's lives.

    

Work Experiences

Yield Improvement Engineer  •  TSMC Fab12B

August 2016 - December 2020

Expert in most advanced Logic IC process (5nm~10nm) and familiar with advanced measuring instruments such as SEM, E-beam and Bright/Dark Field Inspection Tool.
Specialized in detecting defects to improve yield.
Collaborated with EE & PE to refine logic IC manufacturing procedure and lower production cost.

Process Integration Engineer  •  TSMC Fab12B / TSMC R&D

May 2019 - December 2019 / January 2021 - December 2021 

Proficient in analyzing the relationship between chip electrical properties and process problems.
Specialized in using electrical data analysis (3nm~5nm) to improve Logic IC performance
Experienced in hitherto the most advanced semiconductor process (3nm).

Education

2013/09 - 2016/07

National Taiwan University

M.S. Photonics and Optoelectronics

2006/09 - 2010/06

National Taiwan University

B.S. Physics

Graduate Research

Enhancement of Emission Efficiency of Deep-ultraviolet AlGaN Quantum Wells through Surface Plasmon Coupling with an Al Protrusion Array

Skills


  • Semiconductor electrical property analysis
  • Advanced metrology tools (SEM, DB/DD and E-beam)
  • Excellent in problem-solving
  • Capable of both working on teams and individual
  • Influential communicating and reporting skills

Languages


  • English — Fluent
  • Chinese — Native