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Advanced Process & Package Technology Development Technical Manager
Lowongan diperbarui 12 bulan yang lalu
Deskripsi Pekerjaan
1. Advanced process technology development
2. Advanced package technology development
Persyaratan
- 7nm/5nm/3nm/2nm advanced technology research/development experience
- Advanced device technology development (semiconductor device physic)
- Advanced YE & FA technology development (IP test chips Tape-out, DRC review, diagnosis, failure analysis, material analysis)
- Advanced new product introduction technology development (1st NTO product Tape-out, DRC review, DOE and corner plan, yield analysis, MP window)
- Advanced Chiplet and 3DIC package technology development
- Foundry working experience > 8years
50,000 ~ 200,000 TWD / bulan
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Tentang Kami
聯發科技成立於1997年，透過持續投資先進製程與前瞻技術，現已成長為全球領先的IC設計公司，提供涵蓋智慧手持裝置、智慧家庭應用、無線連結技術及物聯網產品等多個領域的系統晶片整合解决方案(SoC)，並居市場領先地位。聯發科技一年約出貨15億顆晶片落實在上億台的終端產品在全球各地上市。聯發科技提供高度整合與創新性的晶片設計方案，不僅協助製造商優化供應鏈及縮短新產品開發時間，還利於其在全球成熟及發展中市場建立競爭優勢。
聯發科技致力讓科技產品更普及，因為我們相信科技能夠改善人類的生活、與世界連結，每個人都有潛力利用科技創造無限可能（Everyday Genius）。了解更多訊息，請瀏覽：www.mediatek.com.
Pekerjaan
Full-time
・
Level Menengah-Senior
・
1
・
35 rb ~ 200 rb TWD / bulan
Full-time
・
Level Menengah-Senior
・
1
・
35 rb ~ 200 rb TWD / bulan
Full-time
・
Level Menengah-Senior
・
1
・
35 rb ~ 200 rb TWD / bulan