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Google welcomes people with disabilities. Minimum qualifications: Bachelor's degree in Engineering or equivalent practical experience. 6 years of experience working in a data center class hardware systems development technical environment with focus on mechanical and thermal design, or 5 years of experience with an advanced degree. 3 years of experience in technical leadership. Preferred qualifications: Master's degree in Mechanical Engineering or a related field. Experience solving complex mech

Google welcomes people with disabilities. Minimum qualifications: Bachelor's degree in Thermal Engineering, Mechanical or Product Design, a related field, or equivalent practical experience. 5 years of experience in design and analysis/development of thermal solutions (e.g., servers, storage. switches, etc.). 5 years of experience with CFD (e.g., FloTherm/Icepak or equivalent), thermal analysis techniques, pipe flow (pressure drop) calculations, and structural modeling techniques. Experience wit

Google welcomes people with disabilities. Minimum qualifications: Bachelor's degree in Mechanical, Industrial, Process, Manufacturing Engineering, or equivalent practical experience. 15 years of experience in the manufacturing process and product development for thermal/mechanical parts. Experience developing technical relationships with contract manufacturers. Experience with manufacturing best practices, DFx, and production line development. Experience in a people manager role managing one or

【工作內容】 1. 負責熱流與散熱設計及評估 2. 負責機構材料的設計及選用 3. 協助解決量產製造及製程中的散熱問題 4. 負責散熱零件BOM表及BOM之修正 5. 基礎熱流擬真軟體使用 6

Google welcomes people with disabilities. Minimum qualifications: Bachelor's degree in Computer Science, Electrical Engineering, Computer Engineering, a related technical field, or equivalent practical experience. 5 years of experience with embedded systems or architectures. Ability to communicate in English fluently to collaborate with stakeholders globally. Preferred qualifications: 5 years of experience with Linux or Android Board Support Package (BSP)/OS development. Experience with the oper

Providing sales forecast and meet sales target. Conducting regular customer visits and building up strong customer relationships to have first-hand information about installed base, competitor trend, overhaul schedule, maintenance budget and buying processes…etc. Being able to identify customers’ pain points and offer counter solution by stressing Alfa Laval’s unique selling points and follow up; including complex quotations and advanced technical support (sizing and energy saving calculation) B

1.Electrical & Firmware Function Debug 2.Electrical & Firmware Function Test 3.EMC Debug 4.EMC Test 5.Technical Document Preparation 6.Schematic & Layout Modification 7.RD Sample Pilot Run 8.Component Stress & Thermal Test

NB 系統散熱設計及風險評估 Thermal module 圖面設計及發包 系統溫度驗證分析 及 Thermal issue問題解決 能用英文與外國客戶開會討論及溝通 水冷散熱系統的研究和開發 創新散熱技術的資訊收集

1. Electrical & firmware function test & debug. 2. EMC test & debug. 3. Component Stress & Thermal Test. 4. Schematic & Layout Modification. 5. Technical Document Preparation.

1. HPC 晶片測試之溫控系統開發 2. 相變化技術研發 3. 冷媒系統研發