Bruce Hsieh
Package design and substrate planning manager
v Master of material science technology
v 10 years experience in assembly industry, including
- 3 years wire bonding process experience for lead frame base product
- 6.5 years package design experience for NAND flash product with wire bonding and flip chip product. Package type include BGA base product (MCP / PoP )
- 0.5 year substrate planning experience
v Key achievement
- Focal team leader to achieve major customer annual audit successfully
- Manage new product development from design till mass production
- Leading team to accomplish customer annual project with cross function team
v Phone no. :
0972-393331
v e-mail :
[email protected]
NXP Semiconductors Taiwan Ltd. 台灣恩智浦半導體股份有限公司
National Taiwan University of Science and Technology
Hsinchu, 新竹市台灣
專業背景
- 目前狀態
- 專業其他
- 產業製造
- 工作年資10 到 15 年 (10 到 15 年相關工作經驗)
- 管理經歷我有管理 5～10 人的經驗
- 技能
- 語言能力English・中階
- 最高學歷碩士
求職偏好
- 預期工作模式全職・對遠端工作有興趣
- 希望獲得的職位Substrate material planning manager
- 期望的工作地點
- 接案服務不提供接案服務
工作經驗
Principal Engineer
As a project leader for new product or new technology or new material development. The role need to work with internal cross function team, business unit, quality and engineering team for project development. While development need,
1. from assembly process, package design, selected material point of view to create risk assessment
2. prepare development proposal including development schedule to meet production plan.
3. work with OSAT or production line to complete process window study to make sure qualification quality
Substrate material planning manager
1. Leading 6 members team for substrate planning
2. Work with procurement to define long term substrate allocation and strategy
3. Inventory and excess material control
4. Be coordinator to work with x function team to come out disposition for substrate incoming issue
R&D manager
1. Leading 6 members for new production development
1-1 work with customer to find out best structure solution for new product. (both WB base and flip chip base)
1-2 find out best direct material solution through technical discussion and simulation
2. Build up design data base to consolidate capability of team members
3. Coordinator for cross function team project, e.g. standardization substrate deign
R&D section manager
1. Leading 6 members for new production development
1-1 work with customer to find out best structure solution for new product. (both WB base and flip chip base)
1-2 find out best direct material solution through technical discussion and simulation
2. Build up design data base to consolidate capability of team members
3. Coordinator for cross function team project, e.g. standardization substrate design
R&D senior engineer
1. Project management :
1-1 New product development from design till mass production
1-2 Cost reduction project
2. Trouble shooting, define design rule and upgrade regularly
3. New direct material development (wire /compound / solder ball / die attach film)
Wire bond process engineer
1. Wire bonding process engineer main job function
1-1 new product process condition and loop setting
1-2 New Cu wire and capillary development
1-2 trouble shooting while new product development
2. Focal team leader for new device qualification
3. Mass production trouble shooting and throughput enhancement
學歷
Master’s Degree
・
Material Science and TechnologyBachelor’s Degree
・
Material Science and Technology