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Professional Background
- 現在の状況
- ProfessionProcess Engineer・Packaging Engineer・Equipment Engineer
- Fields半導体・Hardware・Material Science
- 職務経験1年未満 (1年未満関連の実務経験)
- Managementなし
- Skills
- LanguagesEnglish・ビジネスレベルChinese・ネイティブまたはバイリンガル
- Highest level of education
Job search preferences
- Desired job typeフルタイム・リモートワークに興味なし
- Desired positions
- 希望の勤務地
- Freelance非フリーランス
Work Experience
Education
Bachelor’s Degree
・
機械與機電工程學系
Bachelor’s Degree
・
綠色能源科技學系
High School Diploma
・
普通科