2020.4 to 2020.11 Improvement for MTB bumping process, the new design cover improves the thickness problem during oven baking and it's successfully promoted and extend the new cover design to other factories, which can reduce cost by about NTD 5,000,000. 2020.11 to now Service in TSMC F18, Completed hardware modification including transfer arm, process unit, chemical piping, the electrical, software upgrade for next generation product. Analyze the root cause of equipment or process issues and offer solutions to customers. Coordinate action plans with customers and assigns the job to subcontract engineer.

2016.10 to 2018.4 Since TSMC Fab12 is RD fab, customer improvement proposals are provided through experimental data for hardware modification, parameter optimization, and troubleshooting. 2018.5 to 2020.4 Transfer to Linko customer service team to serve MTTW, NTC3, TSMC AP3, and ASECL. Different customers, machine types,s, and processes make me understand more about the evolution and construction of each generation of machines. 2018 to 2019 MTTW Bypass module recovery project. The goal is to reduce the bypass rate by 90% to 20% within 6 months of improving customer production capability.