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4-6 years
6-10 years
10-15 years
More than 15 years
智慧製造全端開發工程師 @聯華電子股份有限公司2022 ~ Present
・
AI工程師、機器學習工程師、深度學習工程師、影像演算法工程師、資料科學家、Ai Application Engineer,Machine Learning Engineer,Deep Learning Engineer,Data Scientist
Within one month
影像分割模型開放、影像定位演算法開發。 開發功能專案管理:系統設計與功能規劃，與外包共同完成系統優化與功能開發。 UMC 12X 廠內RPA專案執行:與使用者共同開發專案，支援RPA 功能與各系統串接。 維運管理:負責 UMC 12X 聯芯 RPA 平台 系統維運與需求
Employed
・
Ready to interview
Full-time / Interested in working remotely
4-6 years
元智大學 Yuan Ze University
・
工業工程與管理學系所
Past
Seller @Sell MAP Ltd (Shopee)2022 ~ 2024
・
主任工程師
Within one month
Robert Song ( 宋少傑 ) Tainan City. Email: [email protected] Experience E-commerce (Shopee) Seller, May/2022~February/2024 Marketing Management / Cost Control Claw machine chain store (Monse Blog Ltd) Director, December/2019~ April/2022 Marketing Management / Cost Control / Employee education training United Microelectronics Corporation (UMC) Equipment Engineer , April/2011 ~ November/Use analytical techniques to solve Producer SE ultra-low K CVD long-term Defect issue improve line yield 1% and fan-out all fab solve method knowledge. 2.Collaborated with PE engineers to improve
Unemployed
・
Ready to interview
Full-time / Interested in working remotely
6-10 years
大葉大學 DaYeh University
・
電機工程學系
Past
資深顧問 @一宇數位科技股份有限公司2023 ~ Present
・
軟體科技業營運管理/ 產品經理/ 專案管理/ 系統服務顧問/ 程式設計/ Product Manager/ Project Manager/ Consultant/Programmer
Within two months
利進行，因此也兼任專案中心管理並擔任過PM，成功協助導入B-B人才發展系統到國內外知名企業，如中華汽車,中華郵政,UMC, 力晶,采鈺,拜耳,富邦人壽,華銀保代,力成科技等等。 對待工作的態度一直以來都是認真負責，始終堅持使命必達的原則。重
Unemployed
・
Ready to interview
Full-time / Interested in working remotely
More than 15 years
University of Utah
・
機械工程
Offline
Offline
Past
Project Manager @ATX Semiconductors Suzhou2022 ~ 2023
・
Project Manager
Within one month
Stacked-Die FBGA and PoP (package on package) products from Y2008 to end of Y2012 Successfully led FOW (DAF over wire) products of M company into mass-production in end of Y2009 Successfully led PoP products of B company into mass-production on Q2 of Y2011 JanJan 2008 Integration Engineer UMC (Tainan Taiwan) Took charge of F/BEoL integration includes 45nm wafer processing, Flip-chip/BOAC rule maintain and low-k wafer dicing solution. JanJan 2007 Product Engineer ASE Kaohsiung Taiwan Took charge of New Products Development of Stacked-Die FBGA. Successfully led MSPD (Memory Stick
Unemployed
・
Ready to interview
Full-time / Interested in working remotely
More than 15 years
國立臺灣海洋大學 National Taiwan Ocean University
・
Materials Science
Sr. Manager @Joules Miles Co., Ltd (Buima Group)2021 ~ 2023
・
Sr. Engineering Manager
Within one month
Employed
・
Open to opportunities
Full-time / Interested in working remotely
More than 15 years
Southern Illinois University Carbondale
・
Electrical Engineering
研發主管 @河北晶國富研新材料有限公司2019 ~ Present
・
全端/後端工程師
Within one month
Shanghai Chengxuan New Materials Technology Co., Ltd. to develop a new thermal graphite film to replace thermal paste. 三、Assistant to international superhard materials expert, Prof. Jame Song (MITto present FIB Engineer • MA-Tek MarchOctober 2019 Various material analyses, collaborated with industries such as TSMC, Apple, UMC, and polymer-related projects, to resolve customers' material pain points and conduct failure analysis. 1. Surface cross-section chemical analysis: OM, SEM, FIB, EDX elemental analysis 2. Spectroscopic detection: FTIR, UV 3. Chemical properties: GC, LC 4. Physical properties: reliability compression testing, tensile testing
Employed
Full-time / Interested in working remotely
4-6 years
南台科技大學
・
化學工程與材料工程學系Unemployed
Full-time / Interested in working remotely
More than 15 years
徳明財經科技大學 企業管理系
・
企業管理系
前端工程師 @國立臺南大學知識與網路應用中心2018 ~ 2021
・
前端工程師 Front-End Developer
Within six months
權存取控制站 以Next.js、Mui、Recoil建立管理系統。 客戶管理、客戶產品管理、客戶資訊管理模組。 客戶產品授權設定、客戶部署設定。 UMC - AI訓練管理系統後台 以Next.js、Mui、Recoil建立管理後台系統。 人員、角色、系統設定管理。 模型資訊管理、辨識技術記錄管理。 高雄
Employed
Full-time / Interested in working remotely
4-6 years
國立臺南大學
・
數位學習科技學系
Product Guide @Arc’Teryx2019 ~ 2020
・
資深工程師
Within one year
I accept new challenge to lead Light Bar team for new project. I learn more technology of LB process and proposal of specification. We combine LED and PCB to accord to thermal dissipation and safety of UL and CE. I was a engineer of thin film in UMC. The major job is design ULKCVD(Ultra-low K CVD) and do new experiments. Experiments of RC decay could be low by reducing K-factor. Let constructs would not be weak after curing. UMC trained me to learn more process of NDC, TEOS and SION
Employed
Full-time / Not interested in working remotely
6-10 years
Gerystone
・
Business communicationUnemployed
・
Not open to opportunities
Part-time / Remote Only
6-10 years
朝陽科技大學 Chaoyang University of Technology
・
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Technical Skills
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Problem-Solving
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Adaptability
Ability to navigate unexpected situations; and keep up with shifting priorities, projects, clients, and technology.
Communication
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Time Management
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Leadership
Ability to coach, guide, and inspire a team to achieve a shared goal or outcome effectively.
Professional Background
Current status
Unemployed
Job Search Progress
Ready to interview
Professions
Product Engineer, Project Engineer
Fields of Employment
Semiconductor
Work experience
More than 15 years
Management
I've had experience in managing 1-5 people
Skills
Languages
English
・
Fluent
Chinese
・
Native or Bilingual
Job search preferences
Positions
Project Manager
Job types
Full-time
Locations
Kaohsiung City, 台灣, Tainan, 台灣, Taiwan, 日本
Remote
Interested in working remotely
Freelance
No
Educations
School
國立臺灣海洋大學 National Taiwan Ocean University
Major
Materials Science
Wei-Yueh Sung (Cloud Sung) 宋威岳
Desired Position: A challenging position as Assembly Engineering/ Quality/ Planning in utilizing my skills and experience.
Kaohsiung, Taiwan
Email: [email protected]
https://www.cakeresume.com/s--Oj8brP5jTYjBJ7tGzYvCcg--/cloud-sung-2aa072
工作經歷 Work Experience
Jul 2022 - Nov 2023
Project Manager ATX Semiconductors Suzhou China
- Took charge of NPI leader of N company (Analog, Logic & Cu-clip devices) products from Apr’23 to Nov’23. Also took charge of NPI of B company (MEMS device) at the same period. Team members & project quantities: 6 persons with 26 projects.
- Took charge of NPI leader of N company (Isolator & MEMS devices) products from Jul’22 to Apr’23. Team members & project quantities: 5 persons with 20 projects.
Aug 2018 - Jul 2022
Business Manager ATX Semiconductors Suzhou China
- Took charge of business development (Quote of RFQ/AOD definition/customer relationship maintaining/TAM-SAM-PAM control/NDA & Agreement & MOU establishment) of US customers (main focus on T & S companies) from 2018 to 2022.
- Led revenue of US account with 200% growth from 2018 to 2021
Nov 2015 - Aug 2018
Project Manager ASEN (Suzhou China)
- Took charge of New device phase-in of E company (Diversity front-end module) products from Nov’15 to Aug’18. Team members & project quantities: 3 persons with 20 projects
- Took charge of New device phase-in of T company QFN products from Nov’15 to Aug’18. Team members & project quantities: 4 persons with 22 projects.
Jan 2008 - Nov 2015
Project Engineer ASE Kaohsiung Taiwan
- Took charge of New device phase-in and HVM issue of Module products (Wireless/PA/Wearable module) from Dec’12 to Nov’15
- Took charge of New Products development of Stacked-Die FBGA and PoP (package on package) products from Y2008 to end of Y2012
- Successfully led FOW (DAF over wire) products of M company into mass-production in end of Y2009
- Successfully led PoP products of B company into mass-production on Q2 of Y2011
Jan 2007 - Jan 2008
Integration Engineer UMC (Tainan Taiwan)
Took charge of F/BEoL integration includes 45nm wafer processing, Flip-chip/BOAC rule maintain and low-k wafer dicing solution.
Jan 2004 - Jan 2007
Product Engineer ASE Kaohsiung Taiwan
- Took charge of New Products Development of Stacked-Die FBGA.
- Successfully led MSPD (Memory Stick Pro Duo) products of S company into mass-production in end of Y2005.
- Successfully pass qualification lots of Stacked-die FBGA of I company in Jan’07 and will start mass-production on Q2’07.
Jan 2000 - Jan 2004
Process Engineer ASE Kaohsiung Taiwan
- Took charge of troubleshooting and process integration of Front End Processes (Wafer preparation to Die attach) of FBGA
學歷 Education
National Taiwan Ocean University (Keelung, Taiwan)
- Master of Science in Materials Engineering
- Thesis: Study on Plasma Vitrification Treatment for Petroleum Industry Wastes and LLRW Surrogates from Nuclear Power Plants
Sep 1997 - Jun 1999
Feng Chia University (Taichung, Taiwan)
- Bachelor of Science in Materials Science
Sep 1992 - Jun 1997
語言 Language
- Chinese - Native
- English - Fluent (TOEIC 630)
技能 Skills
- Experience in Statistics : Basic Statistics, Statistic software (JMP)- ANOVA analysis/DOE/Taguchi method/Control chart/Variability chart/Pareto chart
- Experience in Quality : 8D reporting, 3x5 why analysis, QC tools, SPC, FMEA, MSA, CP
- Experience of APQP (Advanced Product Quality Planning) & PPAP, PSM (problem solving methodology)
- TOEIC 630
A
Wei-Yueh Sung (Cloud Sung) 宋威岳
Desired Position: A challenging position as Assembly Engineering/ Quality/ Planning in utilizing my skills and experience.
Kaohsiung, Taiwan
Email: [email protected]
https://www.cakeresume.com/s--Oj8brP5jTYjBJ7tGzYvCcg--/cloud-sung-2aa072
工作經歷 Work Experience
Jul 2022 - Nov 2023
Project Manager ATX Semiconductors Suzhou China
- Took charge of NPI leader of N company (Analog, Logic & Cu-clip devices) products from Apr’23 to Nov’23. Also took charge of NPI of B company (MEMS device) at the same period. Team members & project quantities: 6 persons with 26 projects.
- Took charge of NPI leader of N company (Isolator & MEMS devices) products from Jul’22 to Apr’23. Team members & project quantities: 5 persons with 20 projects.
Aug 2018 - Jul 2022
Business Manager ATX Semiconductors Suzhou China
- Took charge of business development (Quote of RFQ/AOD definition/customer relationship maintaining/TAM-SAM-PAM control/NDA & Agreement & MOU establishment) of US customers (main focus on T & S companies) from 2018 to 2022.
- Led revenue of US account with 200% growth from 2018 to 2021
Nov 2015 - Aug 2018
Project Manager ASEN (Suzhou China)
- Took charge of New device phase-in of E company (Diversity front-end module) products from Nov’15 to Aug’18. Team members & project quantities: 3 persons with 20 projects
- Took charge of New device phase-in of T company QFN products from Nov’15 to Aug’18. Team members & project quantities: 4 persons with 22 projects.
Jan 2008 - Nov 2015
Project Engineer ASE Kaohsiung Taiwan
- Took charge of New device phase-in and HVM issue of Module products (Wireless/PA/Wearable module) from Dec’12 to Nov’15
- Took charge of New Products development of Stacked-Die FBGA and PoP (package on package) products from Y2008 to end of Y2012
- Successfully led FOW (DAF over wire) products of M company into mass-production in end of Y2009
- Successfully led PoP products of B company into mass-production on Q2 of Y2011
Jan 2007 - Jan 2008
Integration Engineer UMC (Tainan Taiwan)
Took charge of F/BEoL integration includes 45nm wafer processing, Flip-chip/BOAC rule maintain and low-k wafer dicing solution.
Jan 2004 - Jan 2007
Product Engineer ASE Kaohsiung Taiwan
- Took charge of New Products Development of Stacked-Die FBGA.
- Successfully led MSPD (Memory Stick Pro Duo) products of S company into mass-production in end of Y2005.
- Successfully pass qualification lots of Stacked-die FBGA of I company in Jan’07 and will start mass-production on Q2’07.
Jan 2000 - Jan 2004
Process Engineer ASE Kaohsiung Taiwan
- Took charge of troubleshooting and process integration of Front End Processes (Wafer preparation to Die attach) of FBGA
學歷 Education
National Taiwan Ocean University (Keelung, Taiwan)
- Master of Science in Materials Engineering
- Thesis: Study on Plasma Vitrification Treatment for Petroleum Industry Wastes and LLRW Surrogates from Nuclear Power Plants
Sep 1997 - Jun 1999
Feng Chia University (Taichung, Taiwan)
- Bachelor of Science in Materials Science
Sep 1992 - Jun 1997
語言 Language
- Chinese - Native
- English - Fluent (TOEIC 630)
技能 Skills
- Experience in Statistics : Basic Statistics, Statistic software (JMP)- ANOVA analysis/DOE/Taguchi method/Control chart/Variability chart/Pareto chart
- Experience in Quality : 8D reporting, 3x5 why analysis, QC tools, SPC, FMEA, MSA, CP
- Experience of APQP (Advanced Product Quality Planning) & PPAP, PSM (problem solving methodology)
- TOEIC 630