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影像分割模型開放、影像定位演算法開發。 開發功能專案管理:系統設計與功能規劃，與外包共同完成系統優化與功能開發。 UMC 12X 廠內RPA專案執行:與使用者共同開發專案，支援RPA 功能與各系統串接。 維運管理:負責 UMC 12X 聯芯 RPA 平台 系統維運與需求

Robert Song ( 宋少傑 ) Tainan City. Email: [email protected] Experience E-commerce (Shopee) Seller, May/2022~February/2024 Marketing Management / Cost Control Claw machine chain store (Monse Blog Ltd) Director, December/2019~ April/2022 Marketing Management / Cost Control / Employee education training United Microelectronics Corporation (UMC) Equipment Engineer , April/2011 ~ November/Use analytical techniques to solve Producer SE ultra-low K CVD long-term Defect issue improve line yield 1% and fan-out all fab solve method knowledge. 2.Collaborated with PE engineers to improve

利進行，因此也兼任專案中心管理並擔任過PM，成功協助導入B-B人才發展系統到國內外知名企業，如中華汽車,中華郵政,UMC, 力晶,采鈺,拜耳,富邦人壽,華銀保代,力成科技等等。 對待工作的態度一直以來都是認真負責，始終堅持使命必達的原則。重

Stacked-Die FBGA and PoP (package on package) products from Y2008 to end of Y2012 Successfully led FOW (DAF over wire) products of M company into mass-production in end of Y2009 Successfully led PoP products of B company into mass-production on Q2 of Y2011 JanJan 2008 Integration Engineer UMC (Tainan Taiwan) Took charge of F/BEoL integration includes 45nm wafer processing, Flip-chip/BOAC rule maintain and low-k wafer dicing solution. JanJan 2007 Product Engineer ASE Kaohsiung Taiwan Took charge of New Products Development of Stacked-Die FBGA. Successfully led MSPD (Memory Stick

Shanghai Chengxuan New Materials Technology Co., Ltd. to develop a new thermal graphite film to replace thermal paste. 三、Assistant to international superhard materials expert, Prof. Jame Song (MITto present FIB Engineer • MA-Tek MarchOctober 2019 Various material analyses, collaborated with industries such as TSMC, Apple, UMC, and polymer-related projects, to resolve customers' material pain points and conduct failure analysis. 1. Surface cross-section chemical analysis: OM, SEM, FIB, EDX elemental analysis 2. Spectroscopic detection: FTIR, UV 3. Chemical properties: GC, LC 4. Physical properties: reliability compression testing, tensile testing

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I accept new challenge to lead Light Bar team for new project. I learn more technology of LB process and proposal of specification. We combine LED and PCB to accord to thermal dissipation and safety of UL and CE. I was a engineer of thin film in UMC. The major job is design ULKCVD(Ultra-low K CVD) and do new experiments. Experiments of RC decay could be low by reducing K-factor. Let constructs would not be weak after curing. UMC trained me to learn more process of NDC, TEOS and SION