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研發資深工程師 @世界先進積體電路股份有限公司2022 ~ Sekarang
・
半導體研發工程師,應用工程師,FAE
Dalam satu bulan
RTO/RSA handling Module(Diff) - 資深工程師 世界先進積體電路股份有限公司 OctSep 2022, 4years Taoyuan, Taiwan 生產線異常分析與排除 產能配置及擴充 SPC監測 8D問題分析及對策分析 新機台導入驗證及量產測試 產品troubleshooting 材化所- 實習生 工業技術研究院 SepAug 2015, 1year Hsinchu, Taiwan 1. 實驗製備 & 資
Sudah bekerja
・
Terbuka untuk peluang
Full-time / Tertarik bekerja jarak jauh
4-6 tahun
台灣科技大學
・
材料科學與工程學系
Senior Engineer @Powertech Technology Inc.2021 ~ Sekarang
・
Senior Engineer
Lebih dari satu tahun
Sudah bekerja
・
Tidak terbuka untuk peluang
Full-time / Tertarik bekerja jarak jauh
4-6 tahun
國立雲林科技大學 National Yunlin University of Science and Technology
・
Electrical Engineering
Past
Support Engineer @ Astrata Europe (formerly Qualcomm Business Solutions Europe2007 ~ 2014
・
Customer Support
Lebih dari satu tahun
Manufacturing Engineer is to guard the process of building, adjusting and qualifying a NPI (New Product Introduction) type of machine with regards to Cycle Time CT: - Identify current/former product actual KPI values: Availability, Cycle Time, part failures, errors, downtimes. - Conduct in a mutli-disciplinary team the FMEA analysis . - Review design documentations and add -up industrialization requirements. - Write the impact analysis doc and support the fab with the right tools, building instructions, plant availability, mechanics, product design, knowledge. - Create blue print in SAP ME for the machine blocks assembling sequence order. - Write assembling procedures
Tidak bekerja
Full-time / Tidak tertarik bekerja jarak jauh
10-15 tahun
Technical University of Orleans (France)
・
Applied physicsPast
產品開發工程師/EPM @鴻來企業股份有限公司2018 ~ 2023
・
半導體工程師/PM/產品經理/專案管理
Dalam enam bulan
Tidak bekerja
Full-time / Tertarik bekerja jarak jauh
4-6 tahun
私立中國文化大學
・
機械工程學
Cloud Service Provider - SSD engineer @Lenovo_台灣聯想環球科技股份有限公司2022 ~ Sekarang
・
Dalam satu bulan
technical documents and (8D) failure analysis report Provide technical support for customers in the development stage. Provide training to Sales and FAE of oversea branches. (Japan, Europe, Middle East area and Taiwan) [Taiwan semiconductor Inc] JUL.2015–Oct.2017AE Section Manager Lead 5 team members to implement failure analysis and determine root cause. Interface suppliers andmonitor production quality,production record and make the improvement be done. Create and audit 8D report and failure analysis report Deal with customer complaint and technical inquiry Provide technical support directly and feedback for major customers...
Sudah bekerja
Full-time / Tertarik bekerja jarak jauh
6-10 tahun
國立宜蘭大學National Ilan University
・
Electrical Engineering
Customer Service Deputy Manager @欣興電子股份有限公司2023 ~ Sekarang
・
SQE
Dalam satu bulan
Ares Huang Deputy Manager at Unimicron Technology Corp. Have more than 6 years of customer/ quality management experience of PCB in Apple's supply chain. Familiar with the knowledge and tool of 8D failure mode analysis and solve quality issue. Taoyuan City, Taiwan 工作經歷 Quality Service Deputy Manager • 欣興電子股份有限公司 Responsible for managing PCB issue for Apple Macbook/ iPad/ Tcon/ Accessiores project Serve as the primary contact window for customers regarding PCB assembly processes and quality assurance. In the event of
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Terbuka untuk peluang
Full-time / Tertarik bekerja jarak jauh
6-10 tahun
National Taiwan Ocean University
・
Marine biology
FAE Assistant Manager @UD info CORP.2018 ~ Sekarang
・
Product Manager
Dalam tiga bulan
Using an oscilloscope, logic analyzer measurement signal to solved many compatibility problems. Regularly visit various MB manufacturers, gathering the latest information To the client educate customers on how to design DRAM, explain Datasheet EXPERIENCE TAIWAN Wistron COMPANY Hsin-Chu County Work in the Wistron as global quality and failure analysis department, Senior Application Engineer For NB, Server, PC ,DTV etc, has in fact analysis and writing 8D report and use 8D way to solve problems in the factory production line. TAIWAN Silicon-Power COMPANY Taipei County Worked at Silicon Power FAE section manager. In March 2012 sent
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Full-time / Tertarik bekerja jarak jauh
Lebih dari 15 tahun
National Dong Hwa University, NDHU
・
RRAM
Product Manager @喬山健康科技股份有限公司2022 ~ Sekarang
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Project Manager、PM、專案經理、UX、網站企劃、產品企劃
Dalam enam bulan
Ltd. Songson Hardware Co. Ltd. ODM/JDM: Optimized customer demand progress design, structure design, Narimoto report, strike, functional test, various materials and joint services, DVT/EVT, product assembly distribution, product packaging distribution. Company-owned development: new product design and development, new product market failure analysis. Product functional problem elimination: quantity product quality, functional problem research/experiment/improvement, production 8D report, etc. Market analysis: market external competitor analysis, product market positioning analysis, product labeling strategy analysis. Planning management: Controlling the timing of discussion with guests, managing the timing of each
Sudah bekerja
Full-time / Tertarik bekerja jarak jauh
6-10 tahun
國立雲林科技大學 National Yunlin University of Science and Technology
・
工業設計Past
Seller @Sell MAP Ltd (Shopee)2022 ~ 2024
・
主任工程師
Dalam satu bulan
Tidak bekerja
・
Siap untuk wawancara
Full-time / Tertarik bekerja jarak jauh
6-10 tahun
大葉大學 DaYeh University
・
電機工程學系
ERP資訊工程師 ERP Software Engineer @南茂科技股份有限公司 ChipMOS TECHNOLOGIES2022 ~ Sekarang
・
Engineer, SA, SD, Data Analyst, PM
Dalam satu bulan
SVN、VSS 資料庫： Oracle DB、Oracle DB Gateways、SQL Server、SQLite 伺服器&虛擬化： IIS、Nginx、Windows Server、Windows CE、Solaris、VirtualBox ML&DL： YOLO、Darknet、Pandas、Seaborn 管理分析相關： 專案管理、IT治理服務管理、8D Report、統計分析、Excel、Tableau 其它： SoftwareAG webMethods 、SAP、救護技能、財務會計 工作經歷 ERP資訊工程師-ERP Software Engineer 南茂科技股份有限公司 ChipMOS TECHNOLOGIES • 十二月至
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6-10 tahun
國立成功大學 National Cheng Kung University
・
Industrial and Information ManagementPaket Perekrutan Paling Mudah dan Efektif, Pilihan Ratusan Perusahaan
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Problem-Solving
Ability to identify, analyze, and prepare solutions to problems.
Adaptability
Ability to navigate unexpected situations; and keep up with shifting priorities, projects, clients, and technology.
Communication
Ability to convey information effectively and is willing to give and receive feedback.
Time Management
Ability to prioritize tasks based on importance; and have them completed within the assigned timeline.
Teamwork
Ability to work cooperatively, communicate effectively, and anticipate each other's demands, resulting in coordinated collective action.
Leadership
Ability to coach, guide, and inspire a team to achieve a shared goal or outcome effectively.
Lebih dari satu tahun
Process Integration Engineer @ Taiwan Semiconductor Manufacturing Company
Taiwan Semiconductor Manufacturing Company
・
2014 ~ Sekarang
Latar Belakang Profesional
Status sekarang
Tahap pencarian kerja
Profesi
Lainnya
Bidang Pekerjaan
Manufaktur
Pengalaman Kerja
4-6 tahun
Management
Keterampilan
Bahasa
Chinese
・
Bahasa ibu atau Bilingual
English
・
Fasih
Japanese
・
Pemula
Preferensi Pencarian Pekerjaan
Jabatan
Product Engineer
Tipe Pekerjaan
Full-time
Lokasi
Hsinchu County, 台灣
Bekerja jarak jauh
Tertarik bekerja jarak jauh
Freelance
Pendidikan
Institusi Pendidikan
Cheng Kung University
Jurusan
Electrical Engineering
林庭揚 (Ting Yang, Lin)
Over 7 years of semiconductor integration experience, and successful Tape-Out new products to 5nm from 90nm and mass production (including logic and more than moore products). Successfully improve product yield through data analysis and DOE, and enhance process tolerance. "Teamwork" is very important to me both in the graduate school and in the company. I hope that I have opportunity to try my best for your company with my extensive experience.
Process Integration Engineer, TSMC,
Tainan, Taiwan
[email protected]
+886 963958505
Skills
Semiconductor (5nm~90nm)
- Device engineering
- Semiconductor Process
- WAT Analysis
- Yield Analysis
- Process Quality Test
Manufacturing
- Statistical Process Control (SPC)
- Cp/Cpk
- Failure Mode and Effects Analysis (FMEA)
- Design of Experiments (DOE)
- PDCA
- 3-Leg-5-Why
- 8D
- Pareto Chart
- Box Plot & Normal Quantile Plot
Failure Analysis Tool
- JMP software
- Transmission Electron Microscopy (TEM)
- Energy-dispersive X-ray spectroscopy (EDX)
Work Experience
TSMC, Process Integration Engineer Nov 2014 ~ Present
- 5nm process experience for new product tape-out, yield/device improvement, process optimization and risk assessment.
- More than moore products' experience including 40/55/80nm high voltage (panel driver),
90nm eDRAM and 65nm automotive products.
- Yield/ device troubleshooting in semiconductor process and coordinating cross team (Module/ Device/ Defect/ Product) to propose possible solution.
- Design, execute and analyze experiment to find out process sweet spot for process window assurance.
- Good for customer management: technical support, successful new tape-out pilot run, device window optimization and continue improvement plan.
- Mass data analysis: inline/WAT/CP/FT data integrated analysis by EDA tool -- Implement FA skill for chip failure mechanism analysis, such as FIB/SEM/TEM/EDX,etc.
Award & Honor (TSMC)
- 2019 1H Engineering Contribution Award (Quality Improvement), 2nd Award, 2019
- Success tape-out customer 1st 40nm HV product, yield is over 90%, and pass customer product quality test.
- (5nm) Found wafer edge low yield caused by rework effect
- (5nm) Found chronic wafer center low yield caused by device profile and tool issue
- (40nm) Found and reduce the device leakage.
- (55nm) Improve wafer edge yield loss due to leakage and process weakness by wafer uniformity increment.
Education
National Cheng Kung University (NCKU)
Master's Degree, Electrical and Electronics Engineering, 2012 ~ 2014
Design and Verification of the Control Procedure of Attitude Determination and Control Subsystem for Nanosatellite.
- Participate 1st cubesat (PACE) make and launch
- Japan Satellite Design Contest: lead graduate and college students to do engineering design
- Phoenix (QB50 project): Be responsible for attitude determination and control system
- Matlab teaching assistant
National Cheng Kung University (NCKU)
Bachelor's's Degree, Systems and Naval Mechatronic Engineering, 2008 ~ 2012
Award & Honor (NCKU)
- The 20th Japan Satellite Design Contest, 1st Award, 2012
- Participate to manufacture 1st nanosatellite by students.
林庭揚 (Ting Yang, Lin)
Over 7 years of semiconductor integration experience, and successful Tape-Out new products to 5nm from 90nm and mass production (including logic and more than moore products). Successfully improve product yield through data analysis and DOE, and enhance process tolerance. "Teamwork" is very important to me both in the graduate school and in the company. I hope that I have opportunity to try my best for your company with my extensive experience.
Process Integration Engineer, TSMC,
Tainan, Taiwan
[email protected]
+886 963958505
Skills
Semiconductor (5nm~90nm)
- Device engineering
- Semiconductor Process
- WAT Analysis
- Yield Analysis
- Process Quality Test
Manufacturing
- Statistical Process Control (SPC)
- Cp/Cpk
- Failure Mode and Effects Analysis (FMEA)
- Design of Experiments (DOE)
- PDCA
- 3-Leg-5-Why
- 8D
- Pareto Chart
- Box Plot & Normal Quantile Plot
Failure Analysis Tool
- JMP software
- Transmission Electron Microscopy (TEM)
- Energy-dispersive X-ray spectroscopy (EDX)
Work Experience
TSMC, Process Integration Engineer Nov 2014 ~ Present
- 5nm process experience for new product tape-out, yield/device improvement, process optimization and risk assessment.
- More than moore products' experience including 40/55/80nm high voltage (panel driver),
90nm eDRAM and 65nm automotive products.
- Yield/ device troubleshooting in semiconductor process and coordinating cross team (Module/ Device/ Defect/ Product) to propose possible solution.
- Design, execute and analyze experiment to find out process sweet spot for process window assurance.
- Good for customer management: technical support, successful new tape-out pilot run, device window optimization and continue improvement plan.
- Mass data analysis: inline/WAT/CP/FT data integrated analysis by EDA tool -- Implement FA skill for chip failure mechanism analysis, such as FIB/SEM/TEM/EDX,etc.
Award & Honor (TSMC)
- 2019 1H Engineering Contribution Award (Quality Improvement), 2nd Award, 2019
- Success tape-out customer 1st 40nm HV product, yield is over 90%, and pass customer product quality test.
- (5nm) Found wafer edge low yield caused by rework effect
- (5nm) Found chronic wafer center low yield caused by device profile and tool issue
- (40nm) Found and reduce the device leakage.
- (55nm) Improve wafer edge yield loss due to leakage and process weakness by wafer uniformity increment.
Education
National Cheng Kung University (NCKU)
Master's Degree, Electrical and Electronics Engineering, 2012 ~ 2014
Design and Verification of the Control Procedure of Attitude Determination and Control Subsystem for Nanosatellite.
- Participate 1st cubesat (PACE) make and launch
- Japan Satellite Design Contest: lead graduate and college students to do engineering design
- Phoenix (QB50 project): Be responsible for attitude determination and control system
- Matlab teaching assistant
National Cheng Kung University (NCKU)
Bachelor's's Degree, Systems and Naval Mechatronic Engineering, 2008 ~ 2012
Award & Honor (NCKU)
- The 20th Japan Satellite Design Contest, 1st Award, 2012
- Participate to manufacture 1st nanosatellite by students.