Company highlight

• A leading manufacturer of semiconductor for both array connect and leadframe assembly applications.
• Their technologically advanced equipment and integrated systems are used principally to produce semiconductor assemblies or packages.
• Their customers are leading U.S., European and Asian semiconductor manufacturers and assembly subcontractors.
• Products: Flipchip bonder, Die bonder, MCM die bonder, CMOS lensholder bonder, LCOS bonder, die sorting, packaging and plating equipment, Trim&Form, Singulation,ESEC

Responsibilities

• Project coordination (issue tracking, daily reporting, quality and yield improvement)
• Project coordination for next product (Sample builds, demos, line bring up, yield and throughput optimization, EVT)
• Align potential new business opportunities with the product group.
• Arrange machine demonstrations and sample builds
• Support/guide local support team (Training, day2day work schedule, prioritization)
• Support Sales, CPM and product group

Experience

• Minimum 5 years of experience in a complex Technical environment
• Experience within semiconductor backend industry
• Very good command of English (spoken & written)

Location:

新竹縣

Feel free to contact me know if you are interested in this role, thank you:)

Email: [email protected]
LinkedIn: Jamie Liang / Mobile:0968511502/ Line ID:jamieisworking