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4-6 tahun
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Avatar of 蔡嘉原.
Avatar of 蔡嘉原.
Past
工程師 @優貝克科技股份有限公司
2023 ~ 2023
開發/技術服務 工程師
Dalam enam bulan
間曾在超商及學校水電維修單位進行打工 彰化師大附屬高級工業職業學校, 高中文憑, 機械製圖科, 2006 ~ 2008 技能 軟體 AutoCAD Inventor SolidWorks ANSYS 語言能力 中文:母語程度 台語:母語程度 日文:日常會話 相關證照與執照 2019/8 日本語能力試験 N1 2018/8 日本語能力試
Inventor
SolidWorks
日文檢定N1
Tidak bekerja
Siap untuk wawancara
Full-time / Tertarik bekerja jarak jauh
6-10 tahun
南台科技大學
機械系自動化控制組
Avatar of 張博舜.
Avatar of 張博舜.
機構課長 @大日科技股份有限公司
2023 ~ Sekarang
機械工程師、振動工程師、裝機工程師、設備工程師
Dalam dua bulan
Bo-Shun Chang ( Peter Chang) He has more than ten years of experience in engineering, design, and management. Working as an electrical control engineer for plastic injection molding machines for three years, he has experience designing electrical material BOM tables and program controls for 180 sets. In addition, he has handled 130 domestic and foreign machine customer complaints. He managed 73 video projects in five years. The most significant contribution was to improve equipment rental and promote the standard contract system, saving the company more than 30% of costs. In the past two and a
高精密光學設備操作與量測
高精密頻譜分析儀操作與量測
高精密設備異常排除
Sudah bekerja
Siap untuk wawancara
Full-time / Tertarik bekerja jarak jauh
10-15 tahun
Newtype International Language School
英文
Avatar of Hsiang-Hua Liu.
Avatar of Hsiang-Hua Liu.
馬達設計工程師 @鑫元鴻實業股份有限公司
2022 ~ Sekarang
工程師
Dalam satu bulan
術社社員 學習歷程: RF基礎知識學習 天線設計課程(實作) 基礎語言課程(C、C++、組合語言等) 藍芽模組應用 技能 軟體應用 Ansys Maxwell Ansys Rmxpert MotorCad AutoCAD 2D Matlab 基本文書軟體 技能經歷 IE3&IE4 馬達磁路設計 直流無刷馬達優化設計 最佳化設計( 基因演算法、田口法) 產
ANSYS MAXWELL
AutoCad 2D
word
Sudah bekerja
Terbuka untuk peluang
Full-time / Tertarik bekerja jarak jauh
4-6 tahun
逢甲大學(Feng Chia University)
資訊電機工程碩士學位學程
Avatar of Paul Chang.
Avatar of Paul Chang.
機械工程師 @中光電智能機器人
2023 ~ Sekarang
Mechanical Engineer
Dalam satu bulan
Kengming [email protected] 工作經歷 機械工程師 • 中光電智能機器人 五月Present 負責之專案產品有三光三軸雲台、三光雙軸雲台以及四光雙軸雲台 突顯成就與貢獻: 建立了雲台馬達扭力計算文件,以便未來的雲台設計能夠根據不同需求進行選擇,避免過度設
SolidWorks
AutoCAD
ANSYS
Sudah bekerja
Terbuka untuk peluang
Full-time / Tertarik bekerja jarak jauh
4-6 tahun
國立台灣海洋大學 (NTOU)
系統工程暨造船學系
Avatar of Vivian.
Avatar of Vivian.
Past
Product Specialist @老達利貿易股份有限公司(Canon Medical)
2016 ~ 2019
Dalam dua bulan
Vivian 【Failure will never overtake me if my determination to succeed is strong enough.】 As a skilled professional with a diverse background in problem-solving, project management, and sales, I am excited to seek a challenging position that will effectively utilize my skills, experience, and provide an opportunity to work collaboratively with a team. With a proven track record of success in identifying the root cause of problems, developing and executing successful projects, and building positive relationships with customers to achieve sales targets, I am confident in my ability to excel in a dynamic and fast-paced environment
Statistical Process Control (SPC)
JMP
FDC
Tidak bekerja
Terbuka untuk peluang
Full-time / Tidak tertarik bekerja jarak jauh
4-6 tahun
National Tsing Hua University
Mechanical Engineering
Avatar of the user.
Avatar of the user.
Business Development @瑞福生醫 Reform Biomedicine Co., Ltd.
2022 ~ Sekarang
業務人員
Dalam satu bulan
Word
PowerPoint
Excel
Sudah bekerja
Terbuka untuk peluang
Full-time / Tertarik bekerja jarak jauh
4-6 tahun
國立臺灣海洋大學 National Taiwan Ocean University
System Engineering and Naval Architecture
Avatar of 錢冠丞.
Avatar of 錢冠丞.
經理/天線研發部 @寰波科技股份有限公司
2019 ~ Sekarang
Dalam satu bulan
7 / 3 ~ 18 dBi 全/指向性天線 5th Gen. / 3 ~ 12 dBi 全/指向性天線 無人載具天線 GNSS 低雜訊放大器 專長 天線/射頻電路開發 ANSYS HFSS / Circuit AutoCAD / Cam350 / KI-CAD 陣列天線 / 指向性、全向性天線 / 特殊應用天線設計 Meta Material / 週期性結構 設計 功率分配 / 高、低通
Ansys HFSS
Origin
AutoCAD
Sudah bekerja
Full-time / Tertarik bekerja jarak jauh
4-6 tahun
國立屏東大學
資訊工程學系
Avatar of the user.
Avatar of the user.
Mechanical Design Engineer @INNOLUX CORPORATION
2017 ~ Sekarang
Dalam satu tahun
SolidWorks
ANSYS
CREO 3.0
Full-time / Tertarik bekerja jarak jauh
6-10 tahun
Southern Taiwan University of Science and Technology
department of mechanical engineering
Avatar of the user.
Avatar of the user.
Principal Engineer @TSMC
2021 ~ Sekarang
Dalam enam bulan
Physical Design
ASIC
System On A Chip
Sudah bekerja
Tidak terbuka untuk peluang
Full-time / Tertarik bekerja jarak jauh
6-10 tahun
National Chiao Tung University
Electronics Engineering
Avatar of 林韋任.
Avatar of 林韋任.
Senior Engineer @康全電訊股份有限公司
2021 ~ Sekarang
RF工程師
Lebih dari satu tahun
林韋任 I have more than five years of experience in wireless communication design in the field of notebook computers and desktop computers, and also have experience in designing Network products, which can solve the problems encountered by RF in computer systems, and am good at communicating with internal teams and external Cooperate with manufacturers and make production line SOP to complete each project I like working with people more than designing electronics, looking for business and marketing type jobs I am curious and love reading, to learn basic knowledge in different fields, I will try to combine different
PowerPoint
Word
Excel
Sudah bekerja
Full-time / Tertarik bekerja jarak jauh
6-10 tahun
國立臺灣海洋大學
電機工程

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Dalam enam bulan
Taipei City, Taiwan
Latar Belakang Profesional
Status sekarang
Tidak bekerja
Tahap pencarian kerja
Profesi
Packaging Engineer, Mechanical Engineer, Process Engineer
Bidang Pekerjaan
Semikonduktor
Pengalaman Kerja
Kurang dari satu tahun
Management
Tidak ada
Keterampilan
AutoCAD
SolidWorks
ABAQUS
ANSYS
Hypermesh
Bahasa
Chinese
Bahasa ibu atau Bilingual
English
Fasih
Preferensi Pencarian Pekerjaan
Jabatan
Tipe Pekerjaan
Full-time
Lokasi
Bekerja jarak jauh
Tertarik bekerja jarak jauh
Freelance
Pendidikan
Institusi Pendidikan
National Cheng Kung University
Jurusan
Master of Mechanical Engineering
Cetak

李育瑾 (Yugene Lee)

Hey, I'm Yugene! 個性隨和,積極主動,願意學習新的知識,且面對困難不輕易放棄,並勇於接受挑戰。 擅長數值模擬,並具有製程熱應力、翹曲相關模擬實務經驗 具有IEEE ECTC、ICEP、IMPACT等國際研討會發表之經驗 。

  :[email protected]      

學歷

2020 - 2022

National Cheng Kung University

Master of Mechanical Engineering

Research direction: IC Packaging, Finite element simulation, FOWLP

2016 - 2020

Yuan Ze University

Bachelor of Mechanical Engineering

GPA(3.65/4.0)

技能

CAE Softwear


  • Abaqus
  • Ansys
  • Hypermesh
  • Solidworks
  • Autocad

Programming


  • Matlab
  • Python

Language


  • Chinese
  • English (TOEIC 810)

專案經歷

NCKU-ASE 預測晶圓重組製程之非對稱翹曲分析與防治計畫 (2020.08~2022.08)

  1. 針對扇出型晶圓級封裝製程(FOWLP)中所產生的晶圓翹曲進行分析,透過數值模擬與半解析模型的預測,達到快速有效的分析。
  2. 設計試片實驗(DOE),用以驗證數值模擬與半解析模型的準確度。
  3. 在數值模擬中考慮各材料與溫度相依特性、元素生與死技巧、黏彈分析,並根據實際製程中的溫度建立chip first與chip last的製程模擬器,預測熱機械行為所造成的熱應力與翹曲。
  4. 綜合半解析模型與數值模擬的結果,提出輔助決策判斷流程,在新產品導入時能對翹曲進行快速有效的預測,歸納出最佳的設計參數。

迅得機械產學合作計畫(2019.05~2019.09)

使用光電感應器測量六軸機械手臂與印刷電路板之間的角度誤差,利用P計算補償後將其精準放置,設計校正系統和自動化生產線的規劃與整合,以提升生產效率。

IEEE 國際封裝研討會經歷

IEEE ECTC(Electronic Components and Technology Conference)-San Diego

  • Effective Computational Models for Addressing Asymmetric Warping of Fan-Out Reconstituted Wafer Packaging
    • Served as presenter in the ECTC 2022 conference.


IEEE IMPACT (International Microsystems, Packaging, Assembly and Circuits Technology Conference)-Taipei

  • Development and Validation of a Semi-Analytical Model for Predicting Asymmetric Warpage of Fan-Out Reconstituting Packaging
    • Served as the presenter in the IMPACT 2021 conference.


IEEE ICEP (International Conference on Electronics Packaging)-Tokyo

  • Development of Semi-Analytical Formulation for Asymmetric Warpage Prediction in Fan-Out Reconstitution Process
    • Served as the presenter in the ICEP 2021 conference.
    • JIEP Poster Award


CV
Profil

李育瑾 (Yugene Lee)

Hey, I'm Yugene! 個性隨和,積極主動,願意學習新的知識,且面對困難不輕易放棄,並勇於接受挑戰。 擅長數值模擬,並具有製程熱應力、翹曲相關模擬實務經驗 具有IEEE ECTC、ICEP、IMPACT等國際研討會發表之經驗 。

  :[email protected]      

學歷

2020 - 2022

National Cheng Kung University

Master of Mechanical Engineering

Research direction: IC Packaging, Finite element simulation, FOWLP

2016 - 2020

Yuan Ze University

Bachelor of Mechanical Engineering

GPA(3.65/4.0)

技能

CAE Softwear


  • Abaqus
  • Ansys
  • Hypermesh
  • Solidworks
  • Autocad

Programming


  • Matlab
  • Python

Language


  • Chinese
  • English (TOEIC 810)

專案經歷

NCKU-ASE 預測晶圓重組製程之非對稱翹曲分析與防治計畫 (2020.08~2022.08)

  1. 針對扇出型晶圓級封裝製程(FOWLP)中所產生的晶圓翹曲進行分析,透過數值模擬與半解析模型的預測,達到快速有效的分析。
  2. 設計試片實驗(DOE),用以驗證數值模擬與半解析模型的準確度。
  3. 在數值模擬中考慮各材料與溫度相依特性、元素生與死技巧、黏彈分析,並根據實際製程中的溫度建立chip first與chip last的製程模擬器,預測熱機械行為所造成的熱應力與翹曲。
  4. 綜合半解析模型與數值模擬的結果,提出輔助決策判斷流程,在新產品導入時能對翹曲進行快速有效的預測,歸納出最佳的設計參數。

迅得機械產學合作計畫(2019.05~2019.09)

使用光電感應器測量六軸機械手臂與印刷電路板之間的角度誤差,利用P計算補償後將其精準放置,設計校正系統和自動化生產線的規劃與整合,以提升生產效率。

IEEE 國際封裝研討會經歷

IEEE ECTC(Electronic Components and Technology Conference)-San Diego

  • Effective Computational Models for Addressing Asymmetric Warping of Fan-Out Reconstituted Wafer Packaging
    • Served as presenter in the ECTC 2022 conference.


IEEE IMPACT (International Microsystems, Packaging, Assembly and Circuits Technology Conference)-Taipei

  • Development and Validation of a Semi-Analytical Model for Predicting Asymmetric Warpage of Fan-Out Reconstituting Packaging
    • Served as the presenter in the IMPACT 2021 conference.


IEEE ICEP (International Conference on Electronics Packaging)-Tokyo

  • Development of Semi-Analytical Formulation for Asymmetric Warpage Prediction in Fan-Out Reconstitution Process
    • Served as the presenter in the ICEP 2021 conference.
    • JIEP Poster Award