朱思明
Sr. Engineer
Motivated engineer who is highly energetic, outgoing and tenacity. Have project management experience. Ability to solve problems and rich cost down/capacity max out experience. Co-working with foreigners experience. Quickly learns and masters new concepts and skills.
Micron Technology 台灣美光
中原大學 Chung Yuan Christian University
Taichung, 台灣
专业背景
- 目前状态待业中
- 专业半导体工程师・研发
- 产业半导体
- 工作年资10 到 15 年 (10 到 15 年相关工作经验)
- 管理经历无
- 技能
- 语言能力Chinese・母语或双语English・中阶Japanese・初阶
- 最高学历硕士
求职偏好
- 预期工作模式全职・对远端工作有兴趣
- 希望获得的职位Semiconductor Sr. Engineer, Manager
- 期望的工作地点台灣
- 接案服务不提供接案服务
工作经验
OCT CPEE CVD/PVD Sr. Engineer
台灣台中市
Integrate supplier resources to reduce company cost and improve capacity.
ADTT PVD Sr. Engineer
台灣台中市
1.Published Micron internal paper in FY22.
2.TF line yield owner, and scrap wafer improve around 40%.
3.Contact Co/SICONI recipe optimization.
4.Digit line W sputter recipe development for RS reduction.
5.W/SIN capacity improve 5%~8% for max out project.
JTC Film Team Sr. Engineer
台灣台中市
1.Development Ti/WN/WSI metal sputter recipe for digit line RS reduction
2.New tech process transfer form US RD team.
PEE PVD Sr. Engineer
台灣台中市
1.SPC champion, responsible for PVD team meet SPC KPI.
2.Responsible backend layers defect/cost/max out projects.
3.TSV Cu process transfer from JP RD team.
TF Technology Development Engineer
300台灣新竹市
1.Published paper “Capacitance density and breakdown voltage improvement by optimizing the PECVD dielectric film characteristics in metal insulator metal capacitors” in IEEE symposium 2015
2.Responsible for Logic Foundry Thin Film process development
TF Process Engineer
300台灣新竹市
1.. NOR/NAND-Flash memory yield and capacity improvement.
2. Thin Film PVD/CVD Process maintenance.
3. CIP competition received Honorable Mention.
学历
Master’s Degree
・
物理活动和社团
童軍團, 攝影社,
简介
“Percolation in Two-dimensional Nanoparticle Films from Colloidal Self-assembly” , 2007 , Physica Status Solidi (a) , vol.204 , p.1856-1862. (SCI期刊)